• 한국가스학회지
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• 제10권2호
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• pp.40-46
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• 2006

본 논문은 다구찌 실험 설계법을 이용하여 O-링을 장착하는데 필요한 사각 그루브의 최적설계를 위해 FEM으로 최대코시응력과 최대변형률에 대하여 해석하였다. 다구찌 설계방법은 LPG 충전노즐의 내경측에 밀봉을 위해 설치하는 O-링 그루브의 설계변수를 최적화 하는데 대단히 유용하다. FEM과 함께 다구찌 설계기법을 적용하여 계산된 해석결과에 따르면, 최적화 설계치수를 단지 9번의 반복 실험법에 의해 설계변수의 치수를 최적의 조건으로 얻을 수 있다는 측면에서 간편한 최적설계 기술이다. 이것은 다구찌 설계 실험법이 사각형상의 O-링 그루브를 설계하는 간단한 방법으로 대단히 유용하다는 것이다. 다구찌 설계기법에 기초한 해석결과에 의하면, O-링 그루브의 기하학적 형상에 대한 최적치수는 h=2.5mm, d=2.74 mm, c=0.15 mm, w=3.0 mm으로 각각 요약될 수 있다. 본 연구는 공급된 LPG 가스압력이 18 $kg/cm^2$인 상태에서 밀봉성과 안전성을 고려하면 초기압축률은 8.7%로 유지하는 것이 가장 효과적이라는 사실을 제공한다.

• 대한기계학회논문집A
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• 제29권3호
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• pp.432-438
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• 2005

CMP characteristics such as material removal rate and edge effect were measured and investigated in accordance with pad grooving effect, groove width, depth and pitch. GSQ (Groove Stiffness Quotient) and GFQ (Groove Flow Quotient) were proposed to estimate pad grooving characteristics. GSQ is defined as groove depth(D) divided by pad thickness(T) and GFQ is defined as groove width(W) divided by groove pitch(P). As GFQ value increased, material removal rate increased some point but gradually saturated. It seems that material removal rate is not affected by each parameter respectively but by interaction of these parameters such as groove dimensions. In addition, an increase in GFQ and GSQ causes edge effect to be improved. Because, pad stiffness decreases as GSQ and GFQ increase. In conclusion, groove influences relative pad stiffness although original mechanical properties of pad are unchanged by grooving. Also, it affects the flow of slurry that has an effect on the lubrication regime and polishing results. The change of groove dimensions has influence on pad stiffness and slurry flow, so that polishing results such as removal rate and edge effect become changed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 추계학술대회 논문집
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• pp.127-128
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• 2010

• Tribology and Lubricants
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• 제32권4호
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• pp.119-124
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• 2016

In the sapphire wafering process, lapping is a crucial operation in order to reduce the damaged layer and achieve the target thickness. Many parameters, such as pressure, velocity, abrasive, slurry and plate, affect lapping characteristics. This paper presents an experimental investigation on the effect of the plate groove on the material removal rate and roughness of the wafer. We select the spiral pattern and rectangular type as the groove shapes. We vary the groove density by controlling the groove shape dimension, i.e., the groove width and pitch. As the groove density increases to 0.4, the material removal rate increases and gradually reaches a saturation point. When the groove density is low, the pressing load is mostly supported by the thick film, and only a small amount acts on the abrasives resulting to a low material removal rate. The roughness decreases on increasing the groove density up to 0.3 because thick film makes partial participations of large abrasives which make deep scratches. From these results, we could conclude that the groove affects the contact condition between the wafer and plate. At the same groove density, the pitch has more influence on reducing the film thickness than the groove width. By decreasing the groove density with a smaller pitch and larger groove width, we could achieve a high material removal rate and low roughness. These results would be helpful in understanding the groove effects and determining the appropriate groove design.