• 한국체육학회지인문사회과학편
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• v.54 no.5
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• pp.769-780
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• 2015

This study investigated the changes in inflammatory mediators, immunocompetent cells and bone merrow progenitor cells by the magnitude of muscle damage and type of the muscle contraction in the elderly. Twenty older adults who had not been involved in a resistance-training program at least 6 months prior to the present study were assigned to eccentric exercise group (ECC, n=10) and concentric exercise group (CON, n=10). All subjects performed 10 sets of 6 maximal isokinetic eccentric (ECC 1) or concentric (CON) contractions with the non-dominant arm in a randomized, with 4 wk between bouts (ECC 2). Skeletal muscle damage index (ROM, VAS, Plasma CK), inflammation mediators (TNF-α, IL-1, IL-6), immunocomperent cells (CD3+, CD4+, CD8+, CD19+), bone merrow progenitor cell (CD34+) and leukocytes were measured before, immediately after, 2, 24, 48, 72, and 96 h after exercise. Changes in ROM and VAS were greater (P<.05) after ECC 1 than CON and ECC 2. Increases in TNF-α and IL-6 were greater (P<.05) 24, 48 and 72 h after ECC 1 than CON and ECC 2. Increases in neutrophils were greater (P<.05) 2 h after ECC 1 than CON and ECC 2. It was confirmed that muscle damage was greater following eccentric than concentric contractions as well as first bout than second bout in the elderly, and suggested that TNF-α, IL-6 and neutrophils should closely correlate with magnitude of muscle damage.

• Korean Chemical Engineering Research
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• v.45 no.5
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• pp.466-472
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• 2007

A technology platform for wafer-level three-dimensional integration circuits (3D-ICs) is presented, and that uses wafer bonding with low-k polymeric adhesives and Cu damascene inter-wafer interconnects. In this work, one of such technical platforms is explained and characterized using a test vehicle of inter-wafer 3D via-chain structures. Electrical and mechanical characterizations of the structure are performed using continuously connected 3D via-chains. Evaluation results of the wafer bonding, which is a necessary process for stacking the wafers and uses low-k dielectrics as polymeric adhesive, are also presented through the wafer bonding between a glass wafer and a silicon wafer. After wafer bonding, three evaluations are conducted; (1) the fraction of bonded area is measured through the optical inspection, (2) the qualitative bond strength test to inspect the separation of the bonded wafers is taken by a razor blade, and (3) the quantitative bond strength is measured by a four point bending. To date, benzocyclobutene (BCB), $Flare^{TM}$, methylsilsesquioxane (MSSQ) and parylene-N were considered as bonding adhesives. Of the candidates, BCB and $Flare^{TM}$ were determined as adhesives after screening tests. By comparing BCB and $Flare^{TM}$, it was deduced that BCB is better as a baseline adhesive. It was because although wafer pairs bonded using $Flare^{TM}$ has a higher bond strength than those using BCB, wafer pairs bonded using BCB is still higher than that at the interface between Cu and porous low-k interlevel dielectrics (ILD), indicating almost 100% of bonded area routinely.