• Journal of Korean Electronics
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• v.2 no.11
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• pp.30-32
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• 1982

• Proceedings of the Korea Air Pollution Research Association Conference
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• 2003.05b
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• pp.253-254
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• 2003

구미시 산단지역은 반도체, LCD, 브라운관, 정보통신기기 등 첨단전자 정보통신산업을 위주로 형성되어 있으며, 섬유와 기타 합성수지 산업도 위치하고 있다. 이러한 산업 구조로 인해 전자산업에서는 세척제로 Trichloroethylene과 Dichloromethane등이 사용되며, 섬유와 합성수지 산업에서는 Toluene과 같은 유기용제가 많이 사용되고 있다. 이에 본 연구에서는 전자산업을 위주로 형성된 구미 산단지역의 대기중 휘발성유기화합물(이하 VOCs)의 농도를 여름과 겨울철로 나누어 측정ㆍ평가하여, 구미지역 유해오염도 개선을 위한 기초자료를 제시함을 목적으로 하였다. (중략)

• Journal of Korean Electronics
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• v.5 no.4
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• pp.129-133
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• 1985

• Proceedings of the Korea Air Pollution Research Association Conference
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• 2003.11a
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• pp.317-318
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• 2003

구미지역의 산업단지는 반도체, LCD, 브라운관, 정보통신기기 등 첨단전자 정보통신산업을 위주로 형성되어 있으며, 섬유와 기타 합성수지 산업도 위치하고 있다. 이러한 산업적 구조로 인하여 2002년도 현재 톨루엔은 년간 1029.4톤 이상을 사용하고 있으며, 배출량이 년간 200톤 이상으로 나타나 있다. 그리고 자일렌은 년간 1274.646톤의 사용량을 기록하고 있으며, 40톤 이상을 배출하고 있다(대구지방환경청, 2003). (중략)

• Journal of the Semiconductor & Display Technology
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• v.18 no.1
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• pp.15-20
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• 2019

Inspection and measurement of surface quality is one of the most critical processes for manufacturing products such as semiconductor wafers, sapphire substrates, and display panels. The vibrations of the inspection and measurement devices are supposed to be the most dominant factors for severe measurement errors and longer measuring time. In this study, dynamic characteristics of an inspection and measurement device are analyzed through frequency response experiment and computer simulation to obtain parameters such as frequencies, magnitudes, mode shapes, and periods of vibrations. And then an active damper which consists of sensor, interface board, and actuator is designed based on the parameters to formulate the most effective reaction signal to suppress the vibrations which is generated by an interface board, and provided by an actuator. If the vibrations are measured by the sensor, the active damper immediately generates and provides the corresponding reaction signal to inspection and measurement device. The result shows that the active damper can suppress structural vibrations effectively and reduce measuring time of the device and enhance the productivity.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.15 no.6
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• pp.209-215
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• 2015

Following the semiconductor industry's growing, various types of toxic gases and caustic chemicals, HF(Hydrofluoric acid), HCI (Hydochloric acid), $H_2O_2$ (Hydrogen peroxide), $H_2SO_4$ (Sulfuric acid), and Piranha, were using on the semiconductor manufacturing process. Therefore many gas leakage accidents that produce huge losses of lives were caused by the processes. This research deeply considers two basic solutions that the necessity of MSDS education on university for reducing damage of lives and protecting life from chemical leak accidents such as a HF accident in Gumi, Korea and the use of GHS, REACH and the comprehension of propriety about using MSDS for keeping safety from conflagrations by released poison chemical materials.

• Journal of the Semiconductor & Display Technology
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• v.17 no.3
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• pp.46-52
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• 2018

Slitting, which is supposed to be one of the most critical processes in Li-Ion battery manufacturing, is supposed to cut off the uncoated parts of the foil, and cut the wide foils into the size of the Li-ion batteries. Vibrations of slitting machines are the most critical factors for uneven cut surface such as surface roughness and burr, which are the main reasons of the tearing of microporous membranes to separate the cathodes and the anodes, and eventually causing explosion of the batteries. In this study, the structure of a slitting machine has been analyzed through computer simulations to figure out the main reasons of the vibrations. The result of the study shows that simple design alterations of the supporting area and roller without modifying the main structure of the machine can suppress the vibrations effectively, and further to prevent the devastating explosion.

• Journal of the Semiconductor & Display Technology
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• v.16 no.3
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• pp.47-52
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• 2017

Solar cell industry requires high technologies to stabilize apparatuses for the wafer manufacturing. Vibrations of squaring & grinding machines are one of the most critical factors for causing residual stresses of ingots, which are the main reasons of the breakage in the following processes such as wire sawing, cleaning, and modularity. In this study, the structure of a squaring & grinding machine has been analyzed through experiments and computer simulations to figure out the ways to suppress the vibrations effectively, and further to minimize the breakage of wafers. The result shows that simple design changes of applying a few ribs can improve the stability of the machine.

• Journal of the Semiconductor & Display Technology
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• v.17 no.3
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• pp.53-58
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• 2018

The modern industry requires the precision machining as well as the high productivity. The machine tool structure should be evaluated in aspects such as durability, static stability, precision rate and the dynamic stability which is one of the most critical characteristics in determining the magnitude of vibrations. In this study, the dynamic properties of a pipe cutting machine were investigated to analyze the structural vibrations of the machine, and further to improve the structural stability and precision machining. Frequency response test and computer simulation have been utilized for the analysis and the design alterations. And the result shows that proposed design alterations can reduce the vibrations of the machine substantially.

• Journal of the Semiconductor & Display Technology
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• v.17 no.3
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• pp.59-64
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• 2018

In recent years, the solar cell market has steadily grown with the demand for new energies. And wire sawing is one of the most critical processes in manufacturing solar cell wafer which is supposed to affect the breakage of wafers most during the process and afterwards. Generally, the defects of the wafers are generated from the structural vibrations of the machine. In the sawing process, the vibrations cause unnecessary normal stress on the cut surface of wafers, and eventually create the surface damage or leave the residual stress. In this study, the dynamic properties of a wire saw have been analyzed through the frequency response test and the computer simulation. And the effects of the design alterations have been investigated to stabilize the machine structure and further to reduce the vibrations. The result shows that relatively simple design alterations of supporting structure without any change of major parts of the machine can suppress the vibrations of the machine effectively.