• Proceedings of the Korean Institute of Industrial Safety Conference
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• 1997.11a
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• pp.261-266
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• 1997

가장 넓게 쓰이고 있는 알칼리염소법에 의한 도금폐수 처리법은 약 50년전에 Dodge와 Zabban에 의해 발표된 이론에 기초하고, 이것은 pH 및 ORP에 의존하는 반응으로 차아염소산이 시안화물을 시안산염으로 산화시키는 것이며, 알칼리조건하에서 염소화를 하는 동안에 시안화물이 파괴되고 중금속염은 침전을 생성한다. 이 반응은 1단계에서 시안산기가 바로 시안산나트륨으로 되는 것이 아니고 반응의 중간생성물인 염화시아노겐(CNCI)이라고 하는 독성물질이 생성되기 때문에 안전상의 문제가 있다. 또 알카리 염소법은 고농도일 경우에는 처리가 대단히 어렵고, 저농도일지라도 철, 니켈 및 구리와 같이 중금속성분이 다량 혼입되면 배출허용기준치이하로 처리하기는 사실상 불가능하다. (중략)

• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.167-167
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• 2009

결정질실리콘 태양전지를 제조함에 있어 실리콘 기판 내의 금속 불순물들은 소자제작 시에 성능 저하의 원인으로 작용한다. 따라서 본 연구에서는 실리콘 기판에 Cr, Cu, Ni 불순물을 강제 오염시킨 후 태양전지를 제작하여 각각의 불순물에 대한 특성을 조사 하였다. p-type 실리콘 기판을 오염시키기 위해 일정 시간동안 표준용액에 담근 후 질소 분위기에서 열처리 하여 불순물을 확산시켰다. 이후 상용 공정을 이용하여 태양전지를 제작하고 기판내 금속불순물 농도에 따른 태양전지의 동작특성을 분석하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.648-648
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• 2013

물리적, 열적, 광학적, 그리고 전기적으로 우수한 특성을 가져 학계의 관심을 받는, 2차원 탄소 물질인 그래핀을 준비하는 방법에는 여러가지가 있다. 초창기 그래핀 연구방법에 사용됐던 흑연 플레이크와 스카치테이프를 이용한 기계적 박리법, 흑연의산화와 환원을이용한 화학적 합성법, 구리나 니켈과 같은 전이금속을 촉매로 이용한 화학기상증착을 이용한 합성법 등이 있고 각각은 그 방법에 따른 장단점이 있다. 본 포스터에서는 이 중 물리적 박리법과 화학기 상증착 성장법을 이용해 얻은 그래핀의 물리적, 전기적 특성을 비교분석하였다.

• Solar Energy
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• v.10 no.1
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• pp.57-62
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• 1990

The influence of substrate materials on the thermal stability of black chrome coating was investigated by Rutherford backscattering spectrometry(RBS). In order to study thermal degradation the sample were annealed in air for 24 hour at temperature of 450. Cu, Ni, and S.S(Stainless steel 304) were used as substrate for selective coating. The experimental results of substrate diffusion was discussed. It was found that little diffusion of substrate material occurred for the sample pre. pared on stainless steel.

• Journal of Industrial Technology
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• v.19
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• pp.189-195
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• 1999

A study on the separation Cu, Ni, and Co was carried out using LIX 84 leachate, chelate extractant. For this test, artificial test solution was prepared by varing concentrations of Cu, Ni, Co, $(NH_4)_2CO_3$ and $(NH_4)_2SO_4$. It found that pH of the solution was very important factor for the separation of nickel from copper. The results showed that nickel was effectively extracted from copper by using LIX 84 at pH 1.0 to 1.2. The volume ration or organic to aqueous phases was 1.0. According to the McCabe-Thiele diagram, the extraction rate of copper was 99 percents at the equal ratio of organic to aqueous phase in three stages.

• Korean Journal of Veterinary Research
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• v.25 no.2
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• pp.145-148
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• 1985

Nickel toxicity and interactions of nickel with zinc, copper, and lead were studied in glowing chicks fed supplemented diet. Feed intake and growth rate of the chick were reduced by 250mg nickel as a sulfate salt per kg of feed. The toxicity of nickel was decreased by zinc or copper supplementation, but not lead. High nickel feed increased nickel level in kidney and decreased zinc levels in tibia and plasma. However, low zinc levels in tibia and in plasma were reversed by zinc supplementation. Hemoglobin, packed cell volume, and aortic elastin content were increased in chicks fed nickel. These results suggest that nickel toxicity is induced by interference with zinc metabolism.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2013.05a
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• pp.37-37
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• 2013

무전해도금법 (electroless plating)은 Brenner와 Riddell이 1946년에 처음으로 환원제를 이용한 금속의 침적을 electroless plating이라고 명명한 뒤 전기를 이용하지 않고 금속막을 얻을 수 있는 방법으로 인지되어왔다. 초기에는 용액이 불안정하였으나 용액의 안정성을 향상시키면서 꾸준히 산업체에 쓰여왔다. 무전해도금의 응용이 처음에는 니켈에 국한되었으나 구리의 무전해도금이 PCB에 사용되면서 80년대부터 전자산업에서 많이 쓰이게 되었다. 최근에는 무전해도금을 이용한 전자산업뿐만 아니라 MEMS와 같이 전기도금을 위한 전기접촉이 어려우면서 정밀한 균일도를 요구하는 분야에도 많이 쓰이고 있다. 본 발표에서는 무전해도금법의 일반적인 원리와 이를 이용한 IT 산업에서의 응용에 대하여 알아본다.

• Journal of the Korean institute of surface engineering
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• v.16 no.2
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• pp.41-47
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• 1983

An investigation has been performed on the effects of temperature and Ni addition on the wetting behaviour of Cu on W substrate in hydrogen atmosphere. An sessile drop method was used to measure a wetting angle. The concentration profiles of W, Cu and Ni elements in W/Cu - 5 Ni specimen were made by EPMA. With increasing temperature, the wetting angle of Cu droplet on W plate decreases and the time to reach an equilibrium wetting angle is shortened in hydrogen atmosphere. The addition of Ni improves appreciably the wettability of Cu on W. With increasing Ni content in Cu liquid droplet(0, 1, 3, 5%), the wetting angle is decreased from 21$^{\circ}$to 0$^{\circ}$.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1485-1487
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• 2000

A variety of target configurations in sputtering process have been proposed to deposit various structures of thin film alloys and compound films. In this study, we presented the comparative experimental results regarding to the characterization of properties of Cu-Ni thin films deposited by using a magnetron co-sputtering method, as a function of target configurations; one is using a single target with varying the area of Ni chips attached on the Cu target and another is using a dual-type target with two targets of Ni and Cu separated each other. Structural(d-spacing, crystal orientation, crystallite size, cross-sectional morphology) and electrical(resistivity) properties of deposited films are characterized and compared as a function of target configurations as well as deposition conditions.

• Journal of the Korean institute of surface engineering
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• v.23 no.4
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• pp.208-217
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• 1990

Electroless Ni-Cu-P plating was performed was performed to investigate for plating and changes in microhardness and corrosion rate of of electroless deposits depending on heat treatment. The activation energy for $75~85^{\circ}C$ were calculated to be 66.7KJ/mole. Plating rate increased to 34% with addition of 200ppm of NaF and 0.8ppm of thiourea to the bath. The highest hardness value was obtained by heat treatment deposits layer at$ 400^{\circ}C$, 1 hour. The increase in hardness of deposits by heating was confirmed to be associated with crystallization of the amorphous deposits. Corrosion resistance of deposir layer, which had been heated up to $300^{\circ}C$, was found to be exellent when immersed in 1N-H2SO4 solution, Change of the corrosion resistance seems to have some important bearing on content of amorpous, Ni3P and Cu3P.