• Title/Summary/Keyword: 구리 박판

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A Study on Laser Ablation of Copper Thin Foil by 355nm UV Laser Processing (355nm UV 레이저를 이용한 구리 박판 가공 시 어블레이션에 관한 연구)

  • Oh, Jae-Yong;Shin, Bo-Sung
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.2 s.191
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    • pp.134-139
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    • 2007
  • Usually nanosecond pulsed laser processing of metal is mainly affected by the thermal ablation. Many studies of the theoretical analysis and modeling to predict the laser ablation of metal are suggested on the basis of the photothermal mechanism at higher laser fluence. In this paper, we investigate the etching depth and laser fluence of laser ablation of copper foils and propose the simplified SSB Model(Srinivasan-Smrtic-Babu model) to study the photothermal effect of nanosecond pulsed laser ablation. The experimental results show that the photothermal ablation of the 355nm DPSS $NdYVO_{4}$ laser is useful to process the copper thin foils.

Evaluation of Surface Mechanical Properties of Electro-formed Fe-Ni-Co Thin Foil by Dynamic Nano-indentation and Finite Element Methods (Fe-Ni-Co 박판의 동적 나노 압침법과 유한 요소법에 의한 표면 기계적 특성 평가)

  • Gang, Bo-Gyeong;Choe, Yong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2017.05a
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    • pp.124-124
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    • 2017
  • Fe-Ni-Co 합금 박막(<$100{\mu}m$)을 황화물계 용액에서 전주공정으로 제조하였다. XRF로 측정한 박판의 평균 조성은 Fe-34 wt.% Ni-3 wt.% Co 이다. AFM으로 측정한 표면 조도는 35.2 nm 이다. 표면의 나노 경도는 평균 5.4 GPa 이었다. Oliver 모델을 적용한 구리 박막의 탄성하강강성도는 약 75 이었다. Alekhin 모델을 적용한 구리 박막의 마찰계수, 피로한계는 각각 0.134, 0.027 이었다. 유한요소법으로 평가한 Berkovich 형 나노압침선단의 하중분포를 이차원 선형 및 비선형 해석하면 1 [mN]의 정적하중을 가한 Fe-Ni-Co 박막은 약 576 [mN]로 예측되었다. 압침선단의 하중집중정도는 표면탐침현미경으로 관찰한 압흔의 변형정도와 유사한 경향을 보였다.

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A Comparative Analysis of Thermal Properties of COB LED based on Thermoelectric Device Structure (열전소자 구조에 따른 COB LED의 방열 성능 비교 분석)

  • Kim, Hyo-Jun;Kang, Eun-Yeong;Im, Seong-Bin;Hoang, Geun-Chang;Kim, Yong-Kab
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.15 no.2
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    • pp.189-194
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    • 2015
  • In this study, the heat radiation performance of COB LED according to the structure of thermoelectric device were compared. Thermoelectric device of the sheet copper structure and ceramic structure were used for bonding with the heating part of the COB LED. The temperature distribution in the bonding part of the thermoelectric device of COB LED was measured with a contact-type thermometer. The temperature variation of the thermoelectric device was measured by inputting the currents of 0.1A, 0.3A, 0.5A, and 0.7A. When 0.7A was applied, the temperature of the bonding part where there was a heat aggregation phenomenon of the COB LED was $59^{\circ}C$ for thermoelectric device of the sheet copper structure and $67^{\circ}C$ for the thermoelectric device of the ceramic structure. Therefore, the sheet copper thermoelectric device whose temperature was lower by $9^{\circ}C$ showed better heat radiation performance than those of the ceramic structure.

유전자 알고리즘을 이용한 고속 확관기의 확관속도 최적화

  • 정원지;김재량;한철문;김수태
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2004.05a
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    • pp.216-216
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    • 2004
  • 본 논문은 우리가 일상 생활에서 접하는 에어컨의 핵심 부품인 열 교환기의 제작과정 중에서 확관 공정에서의 확관속도 최적화에 관한 것이다 여기서 열 교환기는 구멍 뚫린 박판형태의 방열핀과 이 구멍을 통과하는 구리재질의 관인 헤어핀의 2가지 주요 부품으로 구성되어있다 그리고 확관기(Fig. 1)에 있어서의 확관공정은 Fig. 2에서 보는 바와 같이 소성변형을 통한 관의 반지름 방향의 팽창으로 방열핀과 헤어핀을 결합시켜주는 높은 정밀도를 요구하는 작업이다.(중략)

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Effect of the particle size on the electrical contact in selective electro-deposition of copper (구리의 선택적 전착에서 결정 입자의 크기가 전기적 접촉성에 미치는 영향)

  • Hwang, Kyu-Ho;Lee, Kyung-Il;Joo, Seung-Ki;Kang, Tak
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.1 no.2
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    • pp.79-93
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    • 1991
  • With the advent of ULSI, many problems in previous metallization techniques and interconnection materials have become more serious. In this work, selective deposition of copper to fill the submicron contact has been tried. After forming electro-deposited copper films on p-type (100) silicon wafer using 0.75M $CuSO_4{\cdot}$5H_2O$ as an electrolyte, the effect of deposition time, current density and concentration of an additive on film properties were investigated. Film thickness, particle size and resistivity were analyzed by Alpha Step, SEM and 4 - point probe measurement respectively. The deposition rate was about $0.5-0.6\mu\textrm{m}$/min at $2A/dm^2$ and the particle size increased with increasing current density. The resistivities of electro-deposited copper films were about $3-6{\mu}{\Omega}{\cdot}$cm for the particle size above $4000{\AA}$. By the addition of 0.2 g/l gelatin, the particle size was reduced to less than $0.1{\mu}m $ and selective plugging of copper on submicron contacts could be successfully achieved.

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Machining of Corner-cube Pattern on Accumulated Cu-Thin Plates (적층된 구리 박판의 코너 큐브 패턴의 가공)

  • Lee, Joon-Yong;Bae, Chan-Yeol;Kim, Chang-Ho
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.15 no.3
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    • pp.109-114
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    • 2016
  • This study presents the optimal hardness range for a coated layer of a workpiece when the diamond tool cuts the corner-cube pattern on the coated plates using an ultra-precision diamond-turning machine. Two kinds of coated plates, which have the hardness range of 211~328 Vickers hardness, are used on the first experiments. The form accuracy for the corner-cube pattern could be achieved through the following experiments using the accumulated thin copper plates in second experiments, having optimal 265~275 Vickers hardness based on the basic first experiments without tool wear. When the number of machining adjustments was increased to seven times, having machining depth was reduced successively in second experiment, a fine surface could be achieved without tool wear.

Electrode Fabrication of MWCNT-PDMS Strain Sensors by Wet-etching (습식 식각을 이용한 MWCNT-PMDS 변형율 센서 전극 생성에 관한 연구)

  • Jung, La-Hee;Hwang, Hui-Yun
    • Composites Research
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    • v.34 no.6
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    • pp.387-393
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    • 2021
  • This paper investigated the electrical properties of multiwall carbon nanotube reinforced polydimethylsiloxane (CNT-PDMS) strain sensors with copper electrodes on the wet-etched surface. MWCNT-PDMS strain sensors were fabricated according to the wt% of MWCNT. Surfaces on the electrode area were wet-etched with various etching duration and silver epoxy adhesives were spread on the wet-etched surface. Finally, we attached the copper electrodes to the MWCNT-PMDS strain sensors. We checked the electric conductivities by the two-probe method and sensing characteristics under the cyclic loading. We observed the electric conductivity of MWCNT-PDMS strain sensors increased sharply and the scattering of the measured data decreased when the surface of the electrode area was wet-etched. Initial resistances of MWCNT-PDMS strain sensors were inversely proportion to wt% of MWCNT and the etching duration. However, the resistance changing rates under 30% strain increased as wt% of MWCNT and the etching duration increased. Decreasing rate of the electric resistance change after 100 repetitions was smaller when wt% of MWCNT was larger and the etching duration was short. This was due to the low initial resistance of the MWCNT-PMDS strain sensors by the wet-etching.

Experimental Study of the Ultrasonic Vibration Effects on CHF Occurring on Inclined Flat Surfaces (초음파 진동이 경사진 평판에서의 CHF에 미치는 영향에 대한 실험연구)

  • 정지환;김대훈;권영철
    • Journal of Energy Engineering
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    • v.12 no.2
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    • pp.139-144
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    • 2003
  • Augmentation of CHF by ultrasonic vibration in water pool is experimentally investigated under pool boiling condition. The experiments are carried out using copper coated plates and distilled water. Measurements of CHF on flat plate heated surface were made with and without ultrasonic wave and with variations in inclined angle of the surface and water subcooling. Experimental apparatus consists of a bath, power supply, test section, ultrasonic generator, and data acquisition system. The measurements show that ultrasonic wave enhances CHF and its extent is dependent upon inclination angle as well as water subcooling. The rate of increase in CHF increases with an increase in water subcooling while it decreases with an increase in inclination angle. Visual observation shows that the cause of CHF augmentation is closely related with the dynamic behavior of bubble generation and departure in acoustic field.

Micro channel forming of ultra thin copper foil (초미세 구리 박판의 마이크로 채널 성형)

  • Joo B. Y.;Rhim S. H.;Oh S. I.;Baek S. W.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.09a
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    • pp.49-53
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    • 2005
  • The objective of this research was to establish the size limitation of micro metal forming and analyze the formability of foil. Flat-rolled ultra thin metallic copper foil($3{\mu}m$ in thickness) was used as a forming material and foil was annealed to improve the formability at the temperature of $385^{\circ}C$. Forming die was fabricated by using etching technique of DRIE(deep reactive ion etching) and HNA isotropic etching. For the forming die and coupe. foil were vacuum packed and the forming was conducted as applying hydrostatic pressure of 250MPa to the vacuum packed unit. We successfully obtained the micro channels of $12\~14{\mu}m$ width and $9{\mu}m$ depth from micro forming process we designed. We also investigated the thickness strain distribution of foil from experiment and FE simulation result. Micro channels had a good formability of smooth surface and size accuracy. We expect that micro metal forming technology will be applied to production of micro parts.

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