• Journal of Sensor Science and Technology
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• v.5 no.3
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• pp.33-40
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• 1996

$(Ba_{0.5}\;Ca_{0.5})TiO_{3}$ humidity-sensitive devices were fabricated by a solid reaction method, and their electrical properties were investigated. The specimens exhibited good humidity sensitivity, in which the impedance changes linearly. It is shown that electrical conduction with moisture adsorption is dominated by the ions through characteristics of charging and discharing current, and electrical conductivity increases as rasing the temperature and relative humidity. It is realized that relative permittivity increases and activation energy decreases with increasing relative humidity.

• Composites Research
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• v.34 no.3
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• pp.174-179
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• 2021

Currently, fluid transfer steel pipes take a lot of time and expense to maintain all facilities due to new construction and painting or corrosion and aging. Therefore, this study was conducted for designing a CFRP pipe structure with high corrosion resistance and chemical resistance as a substitute for steel pipes. The helical/hoop pattern was cross-laminated to improve durability, and HNT was added to suppress the moisture absorption phenomenon of the epoxy. The HNT/CFRP pipe was manufactured by a filament winding process, and performed a mechanical property test, and a moisture absorption test in distilled water at 70℃. As a result, the highest bending strength was obtained when the hoop pattern was laminated with a thickness equivalent to 0.6% of the pipe. The 0.5 wt% HNT specimen had the highest moisture absorption resistance. Also, the delamination phenomenon at the interlayer interface was delayed, resulting in the lowest strength reduction rate.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.8
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• pp.889-895
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• 2012

Carbon fiber reinforced plastic (CFRP) composites have high specific stiffness and high specific strength. Therefore, they are increasingly being use, instead of conventional metallic materials in the aviation and automobile industries, where there is a strong demand for lightweight materials. In aircraft, the fuselage is exposed to severe conditions of high temperatures and high humidity. Therefore, it is necessary to estimate the strength of CFRP composites under real conditions from the viewpoint of aircraft safety. In this study, CFRP specimens were immersed in distilled water at $75^{\circ}C$ for a long time. Then, tensile tests were performed on these specimens, and the fracture characteristics of the fractured surfaces were analyzed using SEM. A fatigue test was performed on specimens immersed for 300 days with R=0.1, and it was confirmed that the fatigue life deteriorated in immersed specimens compared to specimens that were not immersed.

• Korean Chemical Engineering Research
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• v.56 no.4
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• pp.555-560
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• 2018

The high temperature stability of a chloride mixture, $NaCl-KCl-ZnCl_2$ (NaKZn-Chloride), is investigated to evaluate its potential as a thermal storage material. A thermal storage media should maintain a stable thermal properties within the temperature range of heat storage. Results from an a priori experiment showed that the NaKZn-chloride is stable only up the much lower temperature, while its stability limit is reported to be $850^{\circ}C$ in the literature. This study aims to investigate if the thermal property is changed by the moisture absorbed in the heat storage material. The effect of moisture content on the thermal properties was measured. The results show that the melting point remains the same regardless of the amount of moisture absorbed. Meanwhile, the high temperature stability is lower for the moisture treated samples. The results of this work infer that the loss of a hygroscopic thermal storage media can be reduced by avoiding its contacts to moisture in designing high temperature thermal storage systems.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.25-29
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• 2009

High temperature high humidity and thermal shock reliability tests were performed for the board level COB(chip-on-board) flip chip packages using self-formulated and commercial NCPs(non-conductive pastes) to ensure the performance of NCP flip chip packages. It was considered that the more smaller fused silica filler in prototype NCPs is more favorable for high temperature high humidity reliability. The failure of NCP interconnection was affected by the expansion of epoxy due to moisture absorption rather than the fatigue due to thermal stress. It was considered that the NCP having more higher adhesive strength seems to be more favorable to increase the thermal shock reliability.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.2
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• pp.49-55
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• 2016

The effects of post-annealing and temperature/humidity conditions on the interfacial adhesion energies of atomic layer deposited RuAlO diffusion barrier layer for Cu interconnects were systematically investigated. The initial interfacial adhesion energy measured by four-point bending test was $7.60J/m^2$. The interfacial adhesion energy decreased to $5.65J/m^2$ after 500 hrs at $85^{\circ}C$/85% T/H condition, while it increased to $24.05J/m^2$ after annealing at $200^{\circ}C$ for 500 hrs. The X-ray photoemission spectroscopy (XPS) analysis showed that delaminated interface was RuAlO/$SiO_2$ for as-bonded and T/H conditions, while it was Cu/RuAlO for post-annealing condition. XPS O1s peak separation results revealed that the effective generation of strong Al-O-Si bonds between $AlO_x$ and $SiO_2$ interface at optimum post-annealing conditions is responsible for enhanced interfacial adhesion energies between RuAlO/$SiO_2$ interface, which would lead to good electrical and mechanical reliabilities of atomic layer deposited RuAlO diffusion barrier for advanced Cu interconnects.

• The Korean Journal of Mycology
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• v.40 no.4
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• pp.215-223
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• 2012

This study was aimed to find factors responsible for export potential of oyster mushroom through postharvest treatments including high pressure $CO_2$ and anti-moisture pad. Temperature fluctuation during export simulation induced the condensation of excess moisture resulting in the quality loss due to browning and decay. Anti-moisture pad was effective on inhibition of browning occurrence in part. High temperature exposure ($15^{\circ}C$) as retail simulation greatly offset the positive effect of anti-moisture pad. Short term treatment of high pressure $CO_2$ delayed the surface color changes as hunter L, a, and b values. There was no consistent tendency in total sugar and phenolics between treatments. In general, the export potential of small size mush-room (export size) at harvest was higher than large ones (domestic size). The major factors asso-ciated with the quality decrease of oyster mushroom during export were moisture condensation in packages and temperature fluctuation. Further research is required to improve mushroom export procedures.

• Journal of Sericultural and Entomological Science
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• v.34 no.1
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• pp.49-56
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• 1992

Treatment of vinyl monomers onto silk fiber modifies the properties of the original silk fiber considerably. This field has been the subject of investigation by many workers using chemical and radiation initiation. Many studies on the reaction conditions, polymerization mechanism, physical properties and practical performances of methacrylamide-treated silk fiber have been continued. However, the polymerization mechanism has not been clearly revealed yet and this remains ambiguously whether the grafting is formed on fiber or not. In general, it has been accepted that free radicals were formed and vinyl monomers were polymerized in silk fibroin by graft polymerization mechanism, while active sties were varied by the types of monomer and initiator as well as by the reaction conditions. On the other hand, there is another argument on polymerization mechanism, in which monomers are polymerized and impregnated in the internal side of the fiber by homopolymerization. Though a large number of analytical methods are used to examine the polymerization mechanism of methacrylamide-treated silk fiber, the results on the basis of thermal analysis are merely reported in this paper. In differential scanning calorimetry (DSC) analysis, the thermal decomposition behaviors of the methacrylamie-treated silk fibers were determined and compared to those of the controlled silk fibers. DSC curves obtained from the methacrylamide-treated silk fibers showed double peaks at around 290$^{\circ}C$ (A peak) and 320$^{\circ}C$ (B peak) which are attributed to the thermal decomposition of the methacrylamide polymer and silk fibroin fiber, respectively. The temperature of A and B peak shifted to higher value with the increase of add-on. Also, the moisture regain of the treated silk fibers increased with add-on.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.5
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• pp.523-528
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• 2012

A bendable electronic module is developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In the module, a thin silicon chip is embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. A set of tests are conducted for the purpose of qualification: thermal shock, high temperature storage, and autoclave tests. During the autoclave test, delamination occurs at many places within the module layers. To investigate the failure mechanism, moisture diffusion analysis is conducted for the interior of the module under the autoclave test condition. For the analysis, the hygroscopic characteristics of the encapsulating materials are experimentally determined. Analysis results indicate the moisture saturation process in the interior of the module under the autoclave test condition.

• Journal of the Korean Society of Food Science and Nutrition
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• v.19 no.6
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• pp.617-624
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• 1990

Proper processing condition of Yukwa(oil popped rice snack) for mass production and pop-ping mechanism of it were tested with Shinsun (waxy, Japonica type rice) which was excellent for Yukwa making. Optimum steaming time of dough was 15 min among 4 to 60 min and reasonable moisture content of the dough before steaming was 4895 among 48 to 53% which had good and fine texture. Acceptable stirring time of steamed dough was not significantly different among 1 to 4 min, but no stirring with much larger volume was shown very poor and too soft in texture. At the simplification test of milling method, wet milling was better then dry milling in expansion rate and high temperature treatment of dough at 6$0^{\circ}C$ gave negative effect on their quality. Extending high temperature treatment of dough, reducing sugars in the dough increased and it might be caused of starch degradation. In addition of some other protein sources to dough, Yukwa quality were in proportion to the protein content of the beans. At the long term storage of the Yukwa base, moisture absorption was different depending upon RH of atmosphere and the quality of Yukwa was inferior by storage time. By addition of some alcoholic beverage, such as Makkoli, Soju and Chungju, expansion rate and their texture were somewhat improved by increasing addition amount of them from 15% to. 30％ on dough (w/w).