• Journal of Adhesion and Interface
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• v.13 no.1
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• pp.45-50
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• 2012

Recently developed polyketone fiber has various applications in the mechanical rubber goods as reinforcement because of its good mechanical properties. However, its surface is not suitable for good adhesion with the rubber matrix. Thus, a surface modification is essential to obtain the good interfacial adhesion. Plasma treatment, in this study, has been conducted to modify the surface of the polyketone fiber. The morphological changes of the fibers by oxygen plasma treatment were observed by using SEM and AFM. The chemical composition changes of PK fiber surface treated with oxygen plasma were investigated using an XPS (X-ray photoelectron spectroscopy). Finally, the effect of these changes on the interfacial adhesion between fiber and rubber was analyzed by using a microdroplet debonding test. By the plasma treatment, oxygen moieties on the fiber surface increased with processing time and power. The surface RMS roughness increases until the proper processing condition, but a long plasma processing time resulted in a rather reduced roughness because of surface degradation. When the treatment time and power were 60 s and 80 W, respectively, the highest interfacial shear strength (IFSS) was obtained between the PK fiber and natural rubber. However, as the treatment time and power were higher than 60 s and 80 W, respectively, the IFSS decreased because of degradation of the PK fiber surface by severe plasma treatment.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.1 s.34
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• pp.87-93
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• 2005

Interfacial reactions between 48Sn-52In solder and $0.1{\mu}m$ Ti/3 ${\mu}m$ Cu/Au under bump metallurgies(UBM) with various Au thickness of $0.1{\~}0.7{\mu}m$ have been investigated after solder reflow at $150^{\circ}C,\;200^{\circ}C$, and $250^{\circ}C$ for 1 minute. Ball shear strength and shear energy of the Sn-52In solder bump on each UBM was also evaluated. With reflowing at $150^{\circ}C$ and $200^{\circ}C$, $Cu_6(Sn,In)_5$ and $AuIn_2$ intermetallic compounds were formed at UBW solder interface. However, UBM was consumed almost completely with reflowing at $250^{\circ}C$. While ball shear strength was not consistent with UBM/solder reactions, ball shear energy matched well with UBM/solder reactions.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.26 no.1A
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• pp.107-115
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• 2006

A challenging topic was and still is the failure behavior of concrete beams without shear reinforcement. In spite of substantial experimental and theoretical efforts in the past, the mechanism of shear failure is not entirely understood. ALWAC is of importance to the current construction industry. Most of present concrete research focuses on high performance concrete, by which in meant a cost effective material that satisfies demanding performance requirements, including durability. The advantages of ALWAC are its reduced mass and improved thermal and acoustic insulation properties, while maintaining adequate strength. In spite of these advantages, its ultimate failure behavior has not been well defined for adequate design process. This paper will investigate mainly the shear behavior of reinforced ALWAC beam without web reinforcements numerically with experimental evidences.

• Journal of the Korea Concrete Institute
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• v.28 no.5
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• pp.535-544
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• 2016

This paper aims at examining the effects of sustained load and elevated temperature on the time-dependent deformation of a carbon fiber reinforced polymer (CFRP) sheets bonded to concrete as well as the pull-off strength of single-lap shear specimens after the sustained loading period using digital images. Elevated temperature during the sustained loading period resulted in increased slip of the CFRP composites, whereas increased curing time of the polymer resin prior to the sustained loading period resulted in reduced slip. Pull-off tests conducted after sustained loading period showed that the presence of sustained load resulted in increased pull-off strength and interfacial fracture energy. This beneficial effect decreased with increased creep duration. Based on analysis of digital images, results on strain distributions and fracture surfaces indicated that stress relaxation of the epoxy occurred in the 30 mm closest to the loaded end of the CFRP composites during sustained loading, which increased the pull-off strength provided the failure locus remained mostly in the concrete. For longer sustained loading duration, the failure mode of concrete-CFRP bond region can change from a cohesive failure in the concrete to an interfacial failure along the concrete/epoxy interface, which diminished part of the strength increase due to the stress relaxation of the adhesive.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.1-9
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• 2010

We reported the methodology for the shear test which is one of the evaluation procedure for mechanical reliability of flip-chip package. The shear speed and the tip height are found to be two significant experimental parameters in the shear test. We investigated how these two parameters have an influence on the results, the shear strength and failure mode. In order to prove these experimental inconsistency, simulation using finite element analysis was also conducted to calculate the shear strength and to figure out the distribution of plastic energy inside of the solder ball. The shear strength decreased while the tip height increased or the shear speed decreased. A variation in shear strength due to inconsistent shear conditions made confusion on analyzing experimental results. As a result, it was strongly needed to standardize the shear test method.

• Composites Research
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• v.22 no.5
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• pp.8-14
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• 2009

Interfacial evaluation of glass fiber reinforced carbon nanotube (CNT)-epoxy nanocomposite was investigated by micromechanical technique in combination with wettability test. The contact resistance of the CNT-epoxy nanocomposite was measured using a gradient specimen, containing electrical contacts with gradually-increasing spacing. The contact resistance of CNT-epoxy nanocomposites was evaluated by using the two-point method rather than the four-point method. Due to the presence of hydrophobic domains on the heterogeneous surface, the static contact angle of CNT-epoxy nanocomposite was about $120^{\circ}$, which was rather lower than that for super-hydrophobicity. For surface treated-glass fibers, the tensile strength decreased dramatically, whereas the tensile modulus exhibited little change despite the presence of flaws on the etched fiber surface. The interfacial shear strength (IFSS) between the etched glass fiber and the CNT-epoxy nanocomposites increased due to the enhanced surface energy and roughness. As the thermodynamic work of adhesion, $W_a$ increased, both the mechanical IFSS and the apparent modulus increased, which indicated the consistency with each other.

• Composites Research
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• v.20 no.3
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• pp.55-62
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• 2007

Interfacial evaluation and durability of Jute and Hemp fibers/polypropylene (PP) composites were investigated. Moisture content of various treated conditions were measured by thermogravimetic analyzer (TGA). After boiling water test, mechanical properties and IFSS between Jute, Hemp fibers and PP matrix decreased. On the other hand, work of adhesion increased due to swelled fibril by water. Surface energies of Jute and Hemp fibers before and after boiling water test were obtained using dynamic contact angle measurement. IFSS was not always consistent with thermodynamic work of adhesion. In boiling water case, since Jute and Hemp fibers could be swelled by water, surface area and moisture infiltration space increased. Environmental effect on microfailure modes of Jute or Hemp fibers and Jute or Hemp fibers/PP composites were obtained by observing via optical microscope and by monitoring acoustic emission (AE) events and their AE parameters. After boiling water test, unlike Hemp fiber, microfailure process of Jute fiber could occur due to low tensile strength by swelled fibril. In addition, AE events occurred more and AE amplitude and energy became lower than those of before boiling water test.

• Journal of the Korea Concrete Institute
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• v.26 no.6
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• pp.741-749
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• 2014

Prestressed hollow-core (PHC) slabs are structurally-optimized lightweight precast floor members for long-span concrete structures, which are widely used in construction markets. In Korea, the PHC slabs have been often used with cast-in-place (CIP) topping concrete as a composite slab system. However, the PHC slab members produced by extrusion method use concrete having very low slump, and it is very difficult to make sufficient roughness on the surface as well as to provide shear connectors. In this study, a large number of push-off tests was conducted to evaluate interfacial shear strengths between PHC slabs and CIP topping concrete with the key variable of surface roughness. In addition, the horizontal shear strengths specified in the various design codes were evaluated by comparing to the test results that were collected from literature.

• Korean Journal of Materials Research
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• v.9 no.7
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• pp.747-752
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• 1999

The interfacial reaction and joint properties of Sn-3.5Ag/Cu and Sn-3.5Ag-1Zn/Cu joint were studied. Modified double lap shear solder joints of Sn-3.5Ag and Sn-3.5Ag- lZn solder were aged for 60days at $100^{\circ}C$ and $150^{\circ}C$ and then loaded to failure in shear. The Sn-3.5Ag/Cu had a fast growth rate of the reaction layer in comparison with the Sn-3.5Ag-lZn at the aging temperature of $150^{\circ}C$ Through the SEM/EDS analysis of solder joint, it was proved that intermatallic layer was $Cu_{6}Sn_5$ phase and aged specimens showed that intermatallic layer grew in proportion to $t_{1/2}$, and the precipitate of $Ag_3Sn$ occur to both inner layer and interface of layer and solder. In case of Zn-containing composite solder, $Cu_{6}Sn_{5}$ phase formed at the side of substrate and $Cu_{5}Zn_{8}$ phase formed at the other side in double layer. The shear strength of the Sn-3.5Ag/Cu joint improved by addition of IZn. The strength of the joint increases with strain rate and decreases with aging temperature

• Journal of the Microelectronics and Packaging Society
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• v.9 no.1
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• pp.35-41
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• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of micro-electronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder bump and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6/Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.