• Korean Chemical Engineering Research
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• v.46 no.1
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• pp.200-204
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• 2008

The curing kinetics of diglycidyl ether of bisphenol F (DGEBF) with an asymmetric cycloaliphatic amine curing agent were examined by thermal analysis in both isothermal and dynamic curing conditions. From the residual curing of the samples partially cured in isothermal condition and from the dynamic curing with various heating rates, it was found that there exist two kinds of reactions such as at low temperature and at high temperature regions. It was thus also found that the cure parameters obtained from the isothermal curing kinetic model hardly estimate experimental results for a degree of cure larger than 0.6. The activation energies and frequency factors of these two kinds of reactions were obtained from the dynamic curing experiments with various heating rates. From the curing analysis, it was verified that the total cure kinetics for low degrees of cure is dominated by the cure reaction in the low temperature region.

• Journal of Advanced Marine Engineering and Technology
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• v.36 no.1
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• pp.78-84
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• 2012

Mold may experience deterioration of molding quality as the abrasion of mold occurring due to friction between mold and molded product works as allowance in the course of press process. Therefore, to improve the wear-resistance of mold, methods like nitriding, carburizing, flame and induction surface hardening treatment etc have been applied. However, as such methods are accompanied by problems like shape limitation or product deformation etc, laser surface treatment technology is under review as surface treatment method that can solve such problems. Therefore, in this study, mold material cast iron was surface-treated by using high power diode laser. In previous report 1 and report 2, the heat treatment characteristics were compared by the differences of die materials and shapes, then this paper observed microstructure by using optical microscope and scanning electronic microscope to analyze the structural difference of hardened zone, interface area and base metal after heat treatment. And the structural condition was grasped through EDS. As a result of microstructure, hardened zone showed formation of acicular martensite.

• Composites Research
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• v.33 no.5
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• pp.302-308
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• 2020

We measured the thermal conductivity of composite materials manufactured by the autoclave and vacuum bag only processes and predicted the cure behavior of the external and internal of composite parts with a cure kinetics model. The temperature difference between the external and internal depends on the processes because of the change of thermal conductivity. In the autoclave process, the temperature and cure behavior of the internal were similar to those of the external because of the high thermal conductivity. However, the temperature of the internal of the vacuum bag only process was different from that of the external. The difference can influence the part quality and evacuation of air. Compression tests were performed to find the mechanical property using 0° unidirectional specimens. The composite of the vacuum bag only process was found to have a lower compressive strength than that of the autoclave process.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.69-74
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• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.

• Journal of Advanced Marine Engineering and Technology
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• v.35 no.8
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• pp.1048-1054
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• 2011

Laser surface hardening process is the method of hardening surface by inducing rapid self quenching of laser injected area through transfer of surface heat to inside after rapid heating of laser injected area only by high density energy heat source. This surface treatment method does not involve virtually any thermal deformation by heat treatment nor accompanies any other process after surface hardening treatment. In addition, allowing local machining, this method is a surface treatment method suitable for die with complicated shape. In this study, die material cast iron was surface-treated by using high power diode laser with beam profile suitable for heat treatment. Since the shapes of die differ by press die process, specimens were heat-treated separately on plane and corner depending on the applied parts. At this time, corner heat treatment was done with optic head inclined at $10^{\circ}$. As a result, corner heat treatment easily involves concentration of heat input due to limitation of heat transfer route by the shapes compared with plane part, so the treatment accomplished hardening at faster conveying speed than plane heat treatment.

• Elastomers and Composites
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• v.49 no.1
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• pp.59-65
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• 2014

In this study, in order to complete curing reaction of the molding compound comprising an epoxy/anhydride at $71^{\circ}C$ for 40 hours, metal coordination complexes such as cobalt (II) acetylacetonate, potassium acetylacetonate, iron (III) acetylacetonate and chromium (III) octoate as a catalyst were applied to the epoxy/anhydride compounds respectively. The weight ratio of an epoxy part/an anhydride part was adjusted to improve the mechanical properties of the molding compound. According to the experimental results, an epoxy/anhydride compound containing chromium (III) octoate showed a high conversion at $71^{\circ}C$ for 40 hours as well as a proper processability at room temperature among the several metal coordination complexes. For the mechanical properties of the cured epoxy/anhydride compound, the compounds containing weight ratio from 0.9/1 to 0.5/1 of the epoxy part/anhydride part with chromium (III) octoate showed the high flexural strength, and higher compressive strength was shown with increasing of the hardener part.

• Transactions of Materials Processing
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• v.28 no.1
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• pp.27-33
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• 2019

The effect of hardening methods and process parameters on surface hardening of a Ti-6Al-4V Alloy has been investigated in this study. To characterize the effectiveness of the respective surface hardening methods, samples of a Ti-6Al-4V alloy were self-quenched, laser-nitrided, laser-carburized, laser-carbonitrided at the same laser irradiation conditions. This experimental procedure was followed by comparing the microstructural evolutions and mechanical properties of the respective samples after the laser surface hardenings. The hardening characteristics of the respective laser surface hardenings were well defined in this study, and the hardness was significantly influenced by the reaction compounds and laser energy density.

• Proceedings of the KWS Conference
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• 1990.04a
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• pp.94-96
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• 1990

• Proceedings of the KWS Conference
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• 1990.11a
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• pp.117-120
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• 1990

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1992.10a
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• pp.106-110
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• 1992

컴퓨터에 의한 입체 형상 이용 기술의 발달로 3차원 CAD 데이타 형상의 제품을 2차원 형상의 층으로 연속적으로 적층 하는 입체인쇄(Stereolithography)기술개발이 활발하게 이뤄지고 있어 부품설계와 생산에 혁신을 예고하고 있으며, 이 같은 입체 인쇄 기술 중에서 특히, 특정 주파수의 빛에 의하여 경화되는 광 경화성수지(Photopolymer)에 레이저(Laser)를 주사하면 표면의 미소경화부만 경화되는 성질을 이용하여 소재를 경화시키는 광 조형법리 각광을 받고 있다. 본 논문에서는 광조형법에 의한 모델성형시 레이저빔의 조사에 의하여 야기되는 광경화성 수지의 상변화에 의한 성형물의 수축 및 뒤틀림에 대한 연구를 수행하였다