• 기계와재료
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• v.23 no.3
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• pp.82-95
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• 2011

다결정압연판재는 열가공공정을 거쳐서 생산되므로 공정의 특성을 반영하는 미세조직/집합조직 특성을 가지게 된다. 결정립들은 특정방향으로 배향하고 결정립의 형상과 크기도 변화한다. 이러한 변화는 거시적으로 다결정판재의 이방성으로 귀결이 되는데, 근본적으로 판재를 구성하는 단결정들의 기계적 물성이 각각의 방향별로 이방성을 띄기 때문이다. 본 자료에서는 압연공정시 다결정판재의 수직/평면이방성의 발생원인을 집합조직과 결정소성학을 이용하여 제시하고자 하였다.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.15 no.4
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• pp.57-61
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• 2001

The {111}<112> deformation torture, which originated from the {110}<00l> texture near the surface of hot bands, is not prerequisite for the recrystallized {110}<001> Goss texture. During final annealing, surface-energy-induced selective growth of grains urn at the strip surface of 3%Si-Fe alloys containing 6ppm bulk content of sulfur. With decreasing final reduction, the probability that Goss grains survive under the highly segregated sulfur atmosphere and have a chance for later surface-energy-induced selective growth becomes higher, resulting in high magnetic induction.

• Transactions of Materials Processing
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• v.13 no.7
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• pp.559-563
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• 2004

• Resources Recycling
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• v.20 no.1
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• pp.69-79
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• 2011

Recently, magnesium alloys are in the spotlight as a promising materials in the fields of automobile parts and electronic appliances due to their merits representing light weight, high specific strength, damping property, shielding of electromagnetic wave and so on. However, magnesium alloys show a poor formability at room temperature because magnesium has HCP crystal structure with limited slip planes and strong basal texture is formed during plastic deformation process such as rolling and extrusion. Therefore, many R&D efforts have been paid for improvement of formability through grain refinement, texture control and various forming technologies. This paper is giving an overview about recent achievements on control of microstructures, forming technologies and magnesium scrap recycling.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.11a
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• pp.46.2-46.2
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• 2009

휴대전화, 랩톱 컴퓨터 등 각종 모바일기기 및 디스플레이 기기의 경박단소화 및 고기능화에 따라 연성회로기판(FPCB)의 사용량이 증가하고있다. 연성회로기판의 핵심소재인 동박적층필름(FCCL)은 폴리이미드필름과 접착층, Cu 층으로 구성되는데, 이 중접착층으로 사용되는 Ni-20Cr합금은 에칭공정 후 Cr의 잔류에 의해 불량률 증가가 문제되고 있어, Ni-Cr합금 스퍼터링 타깃의 Cr 함량 저감 또는 Cr-free Ni합금 개발 등이 요구되고 있다. 본 연구에서는 차세대 FCCL 본드층에 적합한 Ni기 합금을 개발하기 위한 기초연구로써 Cr 함량 및 가공열처리조건에 따른 미세조직과 집합조직 변화를 조사하였다. 4N급의 고순도Ni과 Cr을 진공 플라즈마 용해장치로 용해하여Ni-xCr (x=5, 10, 15, 20wt.%)합금 잉곳을 만들고, 이를 두께감소율 90%로 냉간압연한 후, $600^{\circ}C$ 및 $800^{\circ}C$에서 10~120분 동안 어닐링하여 시편을 준비하였다. 광학현미경으로 미세조직을 관찰하고, Micro-Vickers 경도시험을 통해 어닐링 조건에 따른 경도변화를 조사하였다. 또한 SEM-EBSD를 이용하여 집합조직 및 입계특성을 분석하였다. $600^{\circ}C$ 어닐링 시 Cr함량이 증가할수록 재결정 완료시간이 증가하여 Ni-20Cr합금의 경우 2시간이상 어닐링에도 재결정이 일어나지 않았다. $800^{\circ}C$ 어닐링 시 10분 어닐링 조건에서 4종류 합금 모두 재결정이 완료되었으며, 동일한 어닐링 조건에서 Cr함량이 증가할수록 결정립이 작아지는 것으로 나타났다. $800^{\circ}C$ 2시간 어닐링 조건에서 Ni-5Cr 합금의 주요 집합조직은 {223}<113>과 {122}<112>로 나타났으며, 이중 {223}<113>은Cr 함량이 증가함에 따라 점차 {122}<112>에 가까운 방향으로 변화되어 Ni-20Cr 합금의 경우 {123}<112>만이 형성되었다. 이러한 집합조직의 변화는 적층결함에너지 감소에 의한 ${\Sigma}3$ 입계의 분율 증가와 밀접한 관련이 있는 것으로 사료된다.

• Korean Journal of Metals and Materials
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• v.47 no.6
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• pp.356-362
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• 2009

In order to vary the primary recrystallization textures, AA 1050 sheets were cold rolled in two different manners. Differences in cold rolling schedule gave rise to the formation of different cold rolling textures also leading to the formation of different primary recrystallization textures. Upon annealing for grain growth, changes in microstructure and texture hardly occurred in the sample depicting Cube recrystallization texture, while grain growth was accompanied with the development {001}<100> Cube texture in the sample displaying a recrystallization texture comprising of weak rolling texture components. The selective growth of Cube oriented grains is attributed to the high mobility of their grain boundaries.

• Journal of Powder Materials
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• v.18 no.2
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• pp.168-171
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• 2011

We investigate grain growth behavior of poly-crystalline Mg sheet having strong basal fiber texture using phase field model for grain growth and micro-elasticity. Strong initial basal texture was maintained when external load was not imposed, but was weaken when external biaxial strain was imposed. Elastic interaction between elastic anisotropy of Mg grain and external load is the reason why texture evolution occurs.

• Journal of the korean Society of Automotive Engineers
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• v.15 no.1
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• pp.3-8
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• 1993

본 고에서는 차체제작의 첫단계인 프레스 성형시 문제가 되는 알루미늄 합금판재의 성형성에 대하여 기술한다. 차체용 Al합금판의 성형성을 인장시험, 헤밍시험, 스트레치 포오밍 시험 등으로 조사해 보았다. 냉연강판과 비교하여 현재의 차체용 Al합금판은 강도와 연신율 면에서 열세임에 틀림이 없으나, 앞으로 냉여강판에 버금가는 Al합금판이 나오리라 예상한다. 1. 시편의 종류. 2. 결정립 조직. 3. 집합 조직. 4. 상온 인장시험. 5. 고온 인장시험. 6. 헤밍시험(Hemming test). 7. 스트레치 포오밍 시험(Stretch forming test)

• Journal of the Korean Society for Precision Engineering
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• v.29 no.8
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• pp.818-823
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• 2012

In order to predict necking behaviour of aluminium sheets, a crystal plasticity model is introduced in the finite element analysis of tensile test. Due to the computational limits of time and memory, only a small part of tensile specimen is subjected to the analysis. Grains having different orientations are subjected to numerical tensile tests and each grain is discretized by many elements. In order to predict the sudden drop of load carrying capacity after necking, a well-known Cockcroft-Latham damage model is introduced. The mismatch of grain orientation causes stress concentration at several points and damage is evolved at these points. This phenomenon is similar to void nucleation. In the same way, void growth and void coalescence behaviours are well predicted in the analysis. For the comparison of prediction capability of necking, same model is subjected to finite element analysis using uniform material properties of polycrystal with and without damage. As a result, it is shown that the crystal plasticity model can be used in prediction of necking and fracture behavior of materials accurately.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.2
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• pp.36-44
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• 2024

Copper electrodeposition technology is essential for producing copper films and interconnects in the microelectronics industries including semiconductor packaging, semiconductors and secondary battery, and there are extensive efforts to control the microstructure of these films and interconnects. In this study, we investigated the influence of crystallographic orientation on the local plastic deformation of copper films for secondary batteries deformed by uniaxial tensile load. Crystallographic orientation maps of two electrodeposited copper films with different textures were measured using an electron backscatter diffraction (EBSD) system and then used as initial conditions for crystal plasticity finite element analysis to predict the local plastic deformation behavior within the films during uniaxial tension deformation. Through these processes, the changes of the local plastic deformation behavior and texture of the films were traced according to the tensile strain, and the crystal orientations leading to the inhomogeneous plastic deformation were identified.