• Resources Recycling
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• v.23 no.6
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• pp.63-67
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• 2014

Gallium is an important material and is used by industry of oxide semi-conductor and LED chip. However, the most of the gallium-containing waste resources became outflow abroad and the most of which is imported from oversea by following technical problem and low circulation rate. In this research, the recovery of high purity Gallium metal from Gallium scrap, which containing about 30% of Gallium, was investigated by using hydro-metallurgical process. As pretreatment, the Gallium scrap was pulverized and leached by strong acid such as hydro chloric acid. At the leached solution, Indium was separated as an Indium sponge by substitution reaction and then Gallium and Zinc hydroxide separated and filtrated using strong alkaline solution such as sodium hydroxide by precipitation method. Also, Gallium metal and Zinc metal was recovered by electrowinning method. To make an electrolytic solution, Gallium and Zinc hydroxide was leached by strong alkaline solution. Finally, High purity Gallium metal was recovered by vacuum refining process to remove the Zinc impurity.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.331.2-331.2
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• 2016

스퍼터 타깃 (target)을 스퍼터링하여 박막을 형성하는 스퍼터 증착은 고체 박막 형성 방법의 하나로서 널리 사용되고 있다. 타깃을 구성하는 합금 원소의 스퍼터링율 (sputtering yield)의 차이 때문에 스퍼터 증착이 진행됨에 따라 타깃 표면의 조성이 변화하지만 일반적으로 원소 간의 표면 농도 및 스퍼터링율의 차이 효과가 서로 상쇄되므로 증착되는 합금 박막의 조성은 타깃의 조성과 일치한다. 그러나 갈륨 (Ga)을 포함하는 합금 타깃을 스퍼터링하는 경우에는 갈륨의 낮은 녹는점 특성 때문에 타깃 조성보다 갈륨의 농도가 더 높은 갈륨 합금 박막이 형성되는 현상이 최근에 보고되었다 [1]. 본 연구에서는 GeGa 및 GeSbTe 타깃을 스퍼터링한 후의 타깃 표면형상 및 성분의 변화를 조사함으로써 마그네트론 스퍼터링 기술로 갈륨 합금 박막을 형성할 때 타깃 표면에서 발생하는 불균일한 조성 변화 특성을 고찰한다. GeSbTe 타깃에 비해 GeGa 타깃은 횡적으로 구분되는 영역이 뚜렷하고 각 영역에서의 Ge와 Ga의 농도가 최대 25 at%의 차이를 나타낸다. 이러한 국부적인 미세구조와 Ge 및 Ga 농도의 차이를 비교 분석하여 갈륨 합금 타깃 표면에서 발생하는 불균일한 조성 변화 현상의 메커니즘을 설명한다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.437-437
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• 2013

3족 질화물은 우수한 광학 특성과 특히 3족 물질의 조성비 조절로 넓은 대역의 밴드갭 엔지니어링으로 발광다이오드의 물질로 각광 받고 있다. 이와 더불어 발광다이오드의 광추출효율을 향상시키기 위해 다양한 연구들이 활발히 이루어지고 있다. 그 연구 중 하나로 나노, 마이크로 사이즈의 막대와 같은 일차원적 구조와 최근 ITO를 활용한 투명 전극을 대체하여 전도도가 100배 정도 높은 금속을 이용한 옆면 접촉 전극을 도입한 것이 최근 발표되었다. 그러나 옆면 접촉 전극을 형성하기 위해서는 기존의 약 100 nm 정도의 두께의 p-형질화갈륨층은 공정 마진 등에 어려움이 있다. 따라서 기존에 비해 두꺼운 p-형 질화갈륨층이 필요하다. 보통 상용화된 유기 금속화학 증착법을 이용한 p-형 질화갈륨층은 도핑 물질인 Mg의 낮은 활성화와 성장 분위기 중 수소로 인해 양질의 것을 얻기 어렵고 이를 위해 성장 후 추가적인 활성화가 필요하다. 따라서 두꺼워진 p-형 질화갈륨층에 대해서도 기존의 성장 조건과 활성화 조건의 적합 여부와 이에 대한 연구가 필요하다. 따라서 본 연구에서는 양질의 p-형 질화갈륨을 얻기 위하여 성장 조건 및 성장 후 급속 열처리 온도, 시간에 대한 최적화와 약 630 nm 두께의 p-형 갈륨질화층을 가지는 발광다이오드에 대해 급속 열처리 조건에 대한 특성 연구를 실시한다.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.12
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• pp.2741-2746
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• 2012

In this study, we propose a novel structure based on AlGaN substrate or buffer layer to implement a normally-off mode transistor that was difficult to be realized by conventional AlGaN/GaN heterojunction structures. The channel under the gate can be selectively depleted by growing an upper AlGaN barrier with a higher Al mole fraction and a top GaN charge elimination layer on AlGaN substrate or buffer layer. The proposed AlGaN heterojunction field effect transistor can achieve a threshold voltage of > 2 V, which is generally required in power device specification.

• Resources Recycling
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• v.9 no.3
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• pp.29-36
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• 2000

A study on the recovery of gallium from leaching solutions is carried out by solvent extraction in order to produce gallium oxide of high purity. The results show that the extraction of gallium is found to be increase with acidities of aqueous solution up to 7.4 M/L when pure isopropyl ether is used. And the extraction of iron also increases with increasing acidity of aqueous solution. It appears that the separation of gallium from iron cannot be satisfactorily accomplished with isopropyl ether. But, in the case of extaction with D2EHPA, almost complete extraction of iron is achieved-leaving all the gallium in the aqueous solution-by maintaining the acidity of aqueous solution at 2 M/L. Accordingly, $Ga_2O_3{\cdot}H_2O$ of more than 99wt.% in purity can be produced from zinc residues through the processes comprising of alkali leaching, precipitation by neutralization and solvent extraction using isopropyl ether and D2EHPA as extractants.

• Resources Recycling
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• v.2 no.2
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• pp.22-26
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• 1993

The flowsheet for the recovery of gallium and indium from zinc residues has been established based on the sulfuric acid treatment. In comparison with the alkali treatment, the method proposed in this work allowed the recovery of indium together with gallium. The majority of iron contained in leach liquor could be removed through the two-stage neutrallization under oxidative or reductive atmosphere. Crude gallium and indium could be obtained through the alkali and/or acid leaching of the products generated from the above treatment. In addition, cementation of indium with zinc powders could also be used for the concentration of it from weak acid solutions.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.30 no.6
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• pp.220-225
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• 2020

Gallium oxide nano-powder, the key starting material for IGZO target, is fabricated by gas phase synthesis using a new apparatus consist of reaction, transportation, and collection parts. As a result of gallium metal evaporation above 1150℃, Ga2O3 nano-powders, are successfully synthesized. The SEM images of the synthesized powders displace the spherical shaped powders without severe agglomeration. X-ray diffraction and PSA analysis show that the higher temperature at the reaction part results in the better crystallinity and larger powder size of the synthesized Ga2O3. To see the applicability to IGZO target, Ga2O3 nano-powders synthesized at 1250℃ are mixed with indium oxide and zinc oxide (In2O3 : Ga2O3 : ZnO = 1 : 1 : 1), and then sintered at 1400~1500℃. The highest sintered density of 5.83 g/㎤ (= 91 % of relative density) is achieved when sintered at 1450℃, showing better sinterability compared to the commercially available Ga2O3 powder, which has 5.61 g/㎤ of sintered density at the same condition.

• Resources Recycling
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• v.2 no.4
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• pp.27-32
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• 1993

A process has been studied to recover gallium from steelmaking dust which had several hundreds ppm of gallium. Aqueous solution containing 38 mg/l gallium was obtained by leaching of dust with 2.25 mol/l sulfuric acid. The leach liquor contained iron and zinc about 1,000 times greater than gallium. Gallium was then concentrated by ion exchanger of chelating resin with functional group of amino carboxylic acid after reduction of ferric ion to ferrous ion and pH adjustment. Gallium was concentrated to be 13 g/l in the resulting eluate by double ion exchanges. The liquor was further treated to remove impurities by solvent extraction technique empolying TOMAC as extractant. The galluim with 99% purity was finally obtainable.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2012.05a
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• pp.241-242
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• 2012

산화아연 씨앗층을 졸-겔 스핀코팅법으로 석영기판위에 증착시킨 후, 수열합성법을 이용하여 갈륨의 양을 0에서 2.0 at.% 으로 변화를 주어 갈륨이 도핑된 산화아연 나노막대를 성장하였다. 산화아연과 갈륨이 도핑된 산화아연 나노막대의 구조적 광학적 특성을 조사하기 위해 field-emission scanning electron microscopy, X-ray diffraction (XRD), photoluminescence (PL), 그리고 ultraviolet-visible spectroscopy를 이용하였다. 일정한 산화아연과 갈륨이 도핑된 산화아연 나노막대는 육각형형태로 성장하였다. XRD 데이터로부터, 산화아연과 갈륨이 도핑된 산화아연 나노막대의 스트레스는 각각 -0.022 (0 at.%), 0.097 (0.5 at.%), 0.165 (1.0 at.%), 0.177 (1.5 at.%), 0.182 GPa (2.0 at.%) 였다. PL 스펙트라에서 얻어진 반가폭(The full width at half maximum)은 갈륨의 양이 0에서 2.0 at.%로 증가함에 따라 127에서 171 meV로 증가하였다. Urbach 에너지는 68 (0 at.%), 97 (0.5 at.%), 108 (1.0 at.%), 104 (1.5 at.%), 127 meV (2.0 at.%)였다.

• Journal of the Institute of Electronics and Information Engineers
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• v.51 no.2
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• pp.33-37
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• 2014

We have developed a novel passivation process employing a sacrificial gallium oxide process in order to recover the surface damage in AlGaN/GaN HFETs. Even with a conventional prepassivation process, surface damage during high temperature ohmic annealing cannot be avoided completely. Therefore, it is necessary to recover the damaged surface to avoid the characteristic degradation. In this work, a sacrificial gallium oxide process has been proposed in which the damaged surface after ohmic annealing was oxidized by oxygen plasma treatment and thereafter etched back using HCl. As a result, the leakage current was dramatically reduced and thus the subthreshold slope was significantly improved. In addition, the maximum drain current level was increased from 594 to 634 mA/mm. To verify the effects, the surface conditions were carefully investigated using X-ray photoelectron spectroscopy.