• Journal of the Institute of Electronics Engineers of Korea SP
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• v.49 no.2
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• pp.8-17
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• 2012

In this paper we proposes a new framework to obtain 3D shape information of thin film rapidly. The conventional equipments based on reflectometry are not suitable for obtaining 3D overall shape information of thin film rapidly since they require more than 30 minutes to measure the absolute thickness for 170 points. The proposed framework is based on an image analysis method that extracts contour lines from interference fringes images using Canny edge detector. The absolute thickness for contour lines are measured and then a height map from the contour lines is obtained by interpolation using Borgefors distance transformation. The extracted height map is visualized using the DirectX 3D terrain rendering method. The proposed framework can provide 3D overall shape information of thin film in about 5 minutes since relatively small number of real measurement for contour lines is required.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.2
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• pp.11-19
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• 2009

Thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Experiments are conducted for three types of WB-PBGA package that have full grid pattern and perimeter pattern with/without central connections. Bending deformations of the assemblies and average strains of the solder balls are investigated, with an emphasis on the effect of solder interconnection grid patterns, Thermal strain distributions and the location of the critical solder ball in package assemblies are quite different with the form of solder ball grid pattern. For the WB-PBGA-PC, The largest of effective strain occurred in the inner solder ball of perimeter closest to the chip solder balls. The critical solder ball is located at the edge of the chip for the WB-PBGA-FG, at the most outer solder ball of central connections for the WB-PBGA-P/C, and at the inner solder ball closest to the chip for the WB-PBGA-P.

• Journal of the Korean Society for Precision Engineering
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• v.16 no.12
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• pp.190-197
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• 1999

Electronic speckle contouring(ESC) is the optical method for measuring shape by using fringe-projection techniques in electronic speckle pattern interferometry. It has the advantage of being non-contacting and can also give a field view of the surface under investigation. Fringes in ESC represent the difference in depth along the view direction between the master wavefront and the test component. The contour maps of three-dimensional diffuse objects are obtained by small shifts of optical fiber carrying the dual-object-beams and 4-frame phase shift. We proposed the contouring method by shifting the collimated illumination beams through optical fiber in order to obtain the contour fringe patterns. And also, we performed addition of incremental addition of images and experiments based on it. we obtained both quantitative increment without decorrelation effect and qualitative improvement by reducing the noise of contour fringes.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.17-25
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• 2006

Thermo-mechanical behavior of flip-chip plastic ball grid array (FC-PBGA) packages are characterized by high sensitive $moir\'{e}$ interferometry. $Moir\'{e}$ fringe patterns are recorded and analyzed for several temperatures. Deformation analysis of bending displacements of the packages and average strains in the solder balls for both single and double-sided package assemblies are presented. The bending displacement of the double-sided package assembly is smaller than that of the single-sided one because of its symmetric structure. The largest effective strain occurred at the solder ball located on the edge of the chip and its magnitude of the double-sided package assembly is greater than that of single-sided one by 50%.

• Journal of the Microelectronics and Packaging Society
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• v.11 no.4 s.33
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• pp.13-22
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• 2004

In MEMS devices, packaging induced stress or stress induced structure deformation become increasing concerns since it directly affects the performance of the device. In this paper, deformation behavior of MEMS gyroscope package subjected to temperature change is investigated using high-sensitivity moire interferometry. Using the real-time moire setup, fringe patterns are recorded and analyzed at several temperatures. Temperature dependent analyses of warpages and extensions/contractions of the package are presented. Linear elastic behavior is documented in the temperature region of room temperature to $125^{\circ}C$. Analysis of the package reveals that global bending occurs due to the mismatch of thermal expansion coefficient between the chip, the molding compound and the PCB. Detailed global and local deformations of the package by temperature change are investigated, concerning the variation of natural frequency of MEMS gyro chip.

• Journal of the Microelectronics and Packaging Society
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• v.18 no.2
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• pp.17-27
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• 2011

This paper describes an experimental study and finite element analysis (FEA) carried out for investigating thermal deformation behavior of solders, resulting from temperature change in the solder. With such a goal in mind, a shear specimen that was composed of two metal bars having different coefficient of thermal expansion and solder blocks placed between two bars was designed and fabricated. Two different types of solder blocks, eutectic solder (Sn/36Pb/ 2Ag) and lead-free solder (Sn/3.0Ag/0.5Cu) were tested as well. Fringe patterns for several temperature steps were recorded and analyzed for three temperature cycles using a real-time moir$\acute{e}$ setup. The experimental data was verified with FEA and used to evaluate the suitability for numerous solder constitutive models available in literatures. FEA employing Anand material model suggested by Darveaux et al. and Chang et al. were found to be in an excellent agreement with the experimental results for the eutectic solder and the lead-free solder, respectively. In addition, numerical predictions on bending displacement, shear strain and viscoplastic distortion energy are documented and viscoplastic deformation behavior of two types of solder material are compared.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.3
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• pp.17-26
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• 2010

Pb-Sn solder is rapidly being replaced by lead-free solder for board-level interconnection in microelectronic package assemblies due to the environmental protection requirement. There is a general lack of mechanical reliability information available on the lead-free solder. In this study, thermo-mechanical behaviors of wire-bond plastic ball grid array (WB-PBGA) package assemblies are characterized by high-sensitivity moire interferometry. Experiments are conducted for two types of WB-PBGA packages that have Pb-Sn solder and lead-free solder as joint interconnections. Using real-time moire setup, fringe patterns are recorded and analyzed for several temperatures. Bending deformations of the assemblies and average strains of the solder balls are investigated and compared for the two type of WB-PBGA package assemblies. Results show that shear strain in #3 solder ball located near the chip shadow boundary is dominant for the failure of the package with Pb-Sn solder, while normal strain in #7 most outer solder ball is dominant for that with lead-free solder. It is also shown that the package with lead-free solder has much larger bending deformation and 10% larger maximum effective strain than the package with Pb-Sn solder at same temperature level.

• Journal of Broadcast Engineering
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• v.28 no.1
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• pp.31-41
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• 2023

Directly converting the focal depth and image size of computer-generated-hologram (CGH), which is obtained by calculating the interference pattern of light from the 3D image, is known to be quite difficult because of the less similarity between the CGH and the original image. This paper proposes a method for separately converting the each of focal length of the given CGH, which is composed of multi-depth images. Firstly, the proposed technique converts the 3D image reproduced from the CGH into a Light-Field (LF) image composed of a set of 2D images observed from various angles, and the positions of the moving objects for each observed views are checked using an object detection algorithm YOLOv5 (You-Only-Look-Once-version-5). After that, by adjusting the positions of objects, the depth-transformed LF image and CGH are generated. Numerical simulations and experimental results show that the proposed technique can change the focal length within a range of about 3 cm without significant loss of the image quality when applied to the image which have original depth of 10 cm, with a spatial light modulator which has a pixel size of 3.6 ㎛ and a resolution of 3840⨯2160.