• Proceedings of the KSME Conference
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• 2003.11a
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• pp.1109-1114
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• 2003

The initial crack often occurs on the bonded interface and it is the general cause of the interface fracture. It is very significant to establish the measurement method of interfacial crack by applying the ultrasonic technology into the interface of bonded dissimilar materials. In this paper, the interfacial crack length was measured by ultrasonic attenuation coefficient in the Al/Epoxy bonded dissimilar materials of double-cantilever beam(DCB). The energy release rate, G, was obtained by the experimental and Ripling's equation measurement of compliance. The experimental results represent that the relation between interfacial crack length for the ultrasonic attenuation coefficient and energy release rate is increased proportionally. From the experimental results, a measurement method of the interfacial crack length by the ultrasonic attenuation coefficient was proposed and discussed.

• Transactions of the Korean Society of Automotive Engineers
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• v.12 no.1
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• pp.130-137
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• 2004

The ultrasonic attenuation coefficients were measured by interfacial crack length in the adhesive components of double-cantilever beam(DCB). The energy release rate, G, was obtained by the experimental measurement of compliance. The numerical analysis by the boundary element method(BEM) and Ripling's equation was investigated. The experimental results represent that the relation between interfacial crack length for the ultrasonic attenuation coefficient and energy release rate is increased proportionally. A measurement method of the interfacial crack length by the ultrasonic attenuation coefficient was proposed and discussed.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.4
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• pp.386-393
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• 2004

In this paper, the ultrasonic attenuation coefficient was measured by variation of crack length for double-cantilever beam(DCB) specimen. The energy release rate, G, was obtained by the experimental measurement of compliance. The experimental results represents that the crack length for the ultrasonic attenuation coefficient and energy release rate is increases proportionally From the experimental results, we proposed a detecting method of the crack length by the ultrasonic attenuation coefficient and discussed it.

• Composites Research
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• v.26 no.2
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• pp.129-134
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• 2013

The strength of adhesive joints employed in composite structures under cryogenic environments, such as LNG tanks, is affected by thermal residual stress generated from the large temperature difference between the bonding process and the operating temperature. Aramid fibers are noted for their low coefficient of thermal expansion (CTE) and have been used to control the CTE of thermosetting resins. However, aramid composites exhibit poor adhesion between the fibers and the resin because the aramid fibers are chemically inert and contain insufficient functional groups. In this work, electrospun meta-aramid nanofiber-reinforced epoxy adhesive was fabricated to improve the interfacial bonding between the adhesive and the fibers under cryogenic temperatures. The CTE of the nanofiber-reinforced adhesives were measured, and the effect on the adhesion strength was investigated at single-lap joints under cryogenic temperatures. The fracture toughness of the adhesive joints was measured using a Double Cantilever Beam (DCB) test.

• Composites Research
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• v.32 no.2
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• pp.102-107
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• 2019

Several studies related to reinforce composites structures in the through thickness direction have been developed along the years. As follows, in this study a new reinforced process is proposed based on previous experimental results using a novel stitching process in T-joints and one-stitched specimens. It was established the need to perform more analysis under standard test methods to obtain a better understanding. FEM analysis were compared after performed mode I interlaminar fracture toughness test, using different stitching patterns to analyze the through thickness strength with reference laminates without stitching. The stitching patterns were defined in $2{\times}2$ and $3{\times}3$, where the upper and lower head of the non-continuous stitching process (I-Fiber) has proven to influence in a higher through thickness strength of the laminate. In order to design the numerical model, cohesive parameters were required to define the surface to surface bonding elements using the cohesive zone method (CZM) and simulate the crack opening behavior from the double cantilever beam (DCB) test.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.41-48
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• 2018

The quantitative interfacial adhesion energy measurement method of copper redistribution layer and WPR dielectric interface were investigated using $90^{\circ}$ peel test, 4-point bending test, double cantilever beam (DCB) measurement for FOWLP Applications. Measured interfacial adhesion energy values of all three methods were higher than $5J/m^2$, which is considered as a minimum criterion for reliable Cu/low-k integration with CMP processes without delamination. Measured energy values increase with increasing phase angle, that is, in order of DCB, 4-point bending test, and $90^{\circ}$ peel test due to increasing roughness-related shielding and plastic energy dissipation effects, which match well interfacial fracture mechanics theory. Considering adhesion specimen preparation process, phase angle, measurement accuracy and bonding energy levels, both DCB and 4-point bending test methods are recommended for quantitative adhesion energy measurement of RDL interface depending on the real application situations.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.2
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• pp.29-37
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• 2021

The effect of Ar/N₂ two-step plasma treatment on the quantitative interfacial adhesion energy of low temperature Cu-Cu bonding interface were systematically investigated. X-ray photoelectron spectroscopy analysis showed that Ar/N₂ 2-step plasma treatment has less copper oxide due to the formation of an effective Cu4N passivation layer. Quantitative measurements of interfacial adhesion energy of Cu-Cu bonding interface with Ar/N₂ 2-step plasma treatment were performed using a double cantilever beam (DCB) and 4-point bending (4-PB) test, where the measured values were 1.63±0.24 J/m² and 2.33±0.67 J/m², respectively. This can be explained by the increased interfacial adhesion energy according phase angle due to the effect of the higher interface roughness of 4-PB test than that of DCB test.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.6 s.177
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• pp.1547-1556
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• 2000

In this paper, an evaluation method of fracture toughness to apply interfacial fracture mechanics was investigated in adhesively bonded double-cantilever beam (DCB) joints. Four types of adhesively bonded DCB joints with an interface crack were prepared for analyses of the stress intensity factors using boundary element method(BEM) and the fracture toughness test. From the results of BEM analysis and fracture toughness experiments, it is found that the stress intensity factor, K1 is a parameter driving the fracture of adhesively bonded joints. Also, the evaluation method of fracture toughness by separated stress intensity factors of mixed mode cracks was proposed and the influences of mode components for its fracture toughness are investigated in adhesively bonded DCB joints.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.7
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• pp.2213-2222
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• 1996

This paper presents the design process and evaluaation results of a two-axis force transducer for measuring flange reaction forces. A double-cantilever beam structure is used as a sensing element, and its optimal configuration is determined based on the derived strain equations to maximize the sensitivity and minimize the regid body displacements. To reduce the coupling errors between two-axis forces, strain distributions by finite elemetns analysis are utilized and the Wheaststone bridge cricuits composed of strain gages are built such that the output voltage should be zero, although strains of four strain gages are not zero. Calibration test shows that the two-azxis force transducer developed in this paper is useful in measuring flange reaction forces within the coupling error of 5.53%.

• Composites Research
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• v.31 no.5
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• pp.177-185
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• 2018

Fiber metal laminate (FML) is a type of hybrid composites which consist of metallic and fiber-reinforced plastic sheets. As the FML has a drawback of the delamination that is a failure of the interfacial adhesive layer, the nominal stresses and the energy release rates should be determined to identify the delamination behavior. However, it is difficult to derive the nominal stresses and the energy release rates since the operating temperature of the equipment is restricted. For this reason, the objective of this paper is to predict the mode-I nominal stress and the mode-I energy release rate of the adhesive layer using the inverse analysis based on the Levenberg-Marquardt method. First, the mode-I nominal stress was assumed as the tensile strength of the adhesive layer, and the mode-I energy release rate was obtained from the double cantilever beam test. Next, the finite element method was applied to predict the mode-I delamination behavior. Finally, the mode-I nominal stress and the mode-I energy release rate were predicted by the inverse analysis. In addition, the convergence of the parameters was validated by trying to input two cases of the initial parameters. Consequently, it is noted that the inverse analysis can predict the mode-I delamination behavior, and the two input parameters were converged to similar values.