• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.6
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• pp.460-465
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• 2001

(Ba$_{0.6-x}$Sr$_{0.4}$Ca$_{x}$)TiO$_3$(x=1.10,0.15,0.20) specimens were fabricated by the solid state reaction method and then the structural and dielectric properties as a function of he composition ratio and sintering temperature were studied. As a result of the differential thermal analysis(DTA), exothermic peak was observed at around 102$0^{\circ}C$ due to the formation of the polycrystalline perovskite phase. The BSCT(50/40/10) specimen sintered at 150$0^{\circ}C$ showed the highest average grain size(18.25${\mu}{\textrm}{m}$). The Curie temperature and dielectric constant at room temperature decreased with increasing Ca content. The dielectric constant and dielectric loss of the BSCT(50/40/10) specimen, sintered at 145$0^{\circ}C$, were about 4324 and 0.972% at 1KHz, respectively.ively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.12
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• pp.996-1002
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• 2000

Ferroelectric (Ba, Sr) TiO$_3$(BST) thin films have attracted much attention for use in new capacitor materials of dynamic random access memories (DRAMs). In order to apply BST to the DRAMs, the etching process for BST thin film with high etch rate and vertical profile must be developed. However, the former studies have the problem of low etch rate. In this study, in order to increase the etch rate, BST thin films were etched with a magnetically enhanced inductively coupled plasma(MEICP) that have much higher plasma density than RIE (reactive ion etching) and ICP (inductively coupled plasma). Experiment was done by varying the etching parameters such as CF$_4$/(CF$_4$+Ar) gas mixing ratio, rf power, dc bias voltage and chamber pressure. The maximum etch rate of the BST films was 170nm/min under CF$_4$/CF$_4$+Ar) of 0.1, 600 W/-350 V and 5 mTorr. The selectivities of BST to Pt and PR were 0.6 and 0.7, respectively. Chemical reaction and residue of the etched surface were investigated with X-ray photoelectron spectroscopy (XPS) and secondary ion mass spectroscopy (SIMS).

• Journal of the Korean Ceramic Society
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• v.35 no.7
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• pp.679-684
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• 1998

Dielectricand pyroelectric properties of {{{{ { { {Ba }_{0.67 }Sr }_{0.33 } }`TiO_{3 } ^{ } }} (BST) thin plates and films were investigated. For BST thin plates maximum dielectric constant and pyrolelectric coefficient were observed at around 24$^{\circ}C$ and pyroelectric characteristics were improved as applied bias field was increased. When the electric field of 4kV/cm was applied to the thin plates sintered at 140$0^{\circ}C$ the pyroelectric coefficients over 4$\times$10-7C/{{{{ { cm}^{2 }K }} were obtained in the range of 0-4$0^{\circ}C$ BST thin films deposited using rf magnetron sputtering showed [001] preferred orientation at substrate temperatures above 50$0^{\circ}C$ On the contrary to the thin plates the dielectric constants of the thin films gradually increased above 15$^{\circ}C$ and decreased as applied bias field in-creased. The pyroelectric coefficients of thin films were lower than 1/10 those of thin plates.

• The Korean Journal of Ceramics
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• v.2 no.2
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• pp.95-101
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• 1996

Variations of the leakage current behaviors and interface potential barrier $({\Phi}_B)$ of rf-sputter deposited (Ba, Sr)$TiO_3$ (BST) thin films with thicknesses ranging from 20 nm to 150nm are investigated as a function of the thickness and bias voltages. The top and bottom electrodes are dc-sputter-deposited Pt films. ${\Phi}_B$ critically depends on the BST film deposition temperature, postannealing atmosphere and time after the annealing. The postannealing under $N_2$ atmosphere results in a high interface potential barrier height and low leakage current. Maintaining the BST capacitor in air for a long time reduces the ${\Phi}_B$ from about 2.4 eV to 1.6 eV due to the oxidation. ${\Phi}_B$ is not so dependent on the film thickness in this experimental range. The leakage conduction mechanism is very dependent on the BST film thickness; the 20 nm thick film shows tunneling current, 30 and 40 nm thick films show Shottky emission current.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.338-341
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• 2002

$(Ba_{1-x}Sr_{0.4}Ca_x)TiO_{3}$ (x=0.10, 0.15, 0.20) powders were prepared by the sol-gel method and BSCT thick films were fabricated by the screen-printing method. Their structural and dielectric properties were investigated with variation of composition ratio and $Al_{2}O_{3}$ doping contents. As results of the X-ray diffraction and microstructure analysis, the grain size of BSCT thick films was decreased with increasing $Al_{2}O_{3}$ amount. The thickness of BSCT thick films by 4-coating/drying is about $110{\sim}120{\mu}m$. The tunability increased with decreasing Ca content, and the BSCT(50/40/10) specimen doped with 1.0wt% $Al_{2}O_{3}$ showed the highest value of 12.94% at 5kV /cm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.198-199
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• 2008

페로브스카이트 구조의 (Ba,Sr,Ca)$TiO_3$ 분말에 $Y_2O_3$ 불순물을 첨가하여 첨가량에 따른 영향을 연구하였다. 시편의 제작은 Screen-printing을 이용하여 후막으로 제작하였으며, 구조적인 특성과 함께 유전적 특성을 관찰하였다. XRD 회절 운석을 통하여 $Y_2O_3$ 가 첨가된 모든 시편에서 전형적인 페로브스카이트 구조를 나타내는것을 알 수 있었다. 시편의 미세구조를 관찰한 결과 grain size 는 $Y_2O_3$ 첨가량이 증가 할수록 감소하였으며, 기공은 증가하는 것을 알 수 있었다. 후막의 두께는 $Y_2O_3$ 첨가량에 영향을 받지 않았으며 평균 두께는 $60{\mu}m$이었다. 유전상수는 $Y_2O_3$ 첨가량에 따라 감소하였으며, 유전손실은 모든 시편에서 1%이하의 양호한 값을 나타내었다.

• Journal of the Korean Ceramic Society
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• v.27 no.1
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• pp.7-12
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• 1990

The influence of MnO2 on the sintering property and PTCR behavior of(Ba0.8Sr0.2)TiO2 has been investigated. And the densities, grain sizes and electrical resitivities of specimens were measured as a function of doping with Mn ion of varying concentration. The density and grain size of the sintered specimens were almost the same regardless of MnO2 addition up to 0.2mol% MnO2. But in the case of 0.25mol% MnO2 addition, abnormal grain growth was appeared. So the grain size distribution was wide and density decreased greatly. The room-temperature resistivity increased as Mn content increased and the temperature coefficient of resistivity was highest in the case of 0.15mol% MnO2 addition.

• Proceedings of the KIEE Conference
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• 1983.07a
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• pp.225-226
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• 1983

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.297-297
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• 2008

Buffer layers play an important role in the development of high critical current density coated conductor. $LaMnO_3$, $SrTiO_3$ and $BaZrO_3$ buffer layers were compatible with MgO surfaces and also provide a good template for growing high current density REBCO(RE=Rare earth) films. Systematic studies on the influences of pulsed laser deposition parameters (deposition temperature, deposition pressure, processing gas, laser energy density, etc.) on microstructure and texture properties of $LaMnO_3$, $SrTiO_3$ and $BaZrO_3$ films as buffer layer deposited on ion-beam assisted deposition MgO (IBAD_MgO) template by pulse laser deposition method, were carried out. These results will be presented together with the discussion on the possible use of this material in HTS coated conductor as buffer.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.59-59
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• 2008

Pb(Zr,Ti)$O_3$(PZT)는 현재 가장 우수한 압전특성을 가진 압전 재료로써, 압전효과와 역압전효과를 이용한 압전 액추에이터, 압전 트랜스듀서, 센서, 레조네이터 등의 활동에 대한 연구과 활발하게 이루어 지고 있다. 그러나 압전성이 우수한 PZT 세라믹스들은 Pb 성분이 포함되어 있기 때문에 환경오염뿐 아니라, 경제적인 측면에서도 많은 문제점을 가지고 있어 최근에는 유해원소인 Pb를 포함하지 않는 친환경 압전 세라믹스에 관한 연구가 활발히 진행되고 있다. (Na, K)$NbO_3$은 뛰어난 특성을 가지고 있어 Pb를 기본조성으로 하는 압전세라믹스를 대체할 수 있는 대표적인 물질중의 하나로 알려져 있다. 그러나, potassium의 수분과의 반응성과, 소결시 휘발로 인해 높은 소결밀도의 NKN을 제조하기 어렵다. 이러한 단점을 보안하기 위해 Hot pressing, Hot forging, SPS 등 여러가지 방법을 이용하여 연구가 수행되고 있지만, 고가의 제조공정을 이용해야만 한다. 본 연구에서는 $BaSrTiO_3$의 새로운 고용체를 추가시켜 기본 NKN 조성보다 소결밀도, 유전 및 압전특성을 향상시키고자 하였다.