• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.582-585
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• 2004

Pb0.5Sr0.5TiO3 (PST) thin films were fabricated by the alkoxide-based sol-gel process using spin-coating method on Pt/Ti/SiO2/Si substrate. The PST films annealed from 500C to 650C for 1h show a perovskite phase and dense microstructure with a smooth surface. The grain size and dielectric constant of PST films increases with the increase in annealing temperature, which reduces the SiO2 equivalent thickness of the PST film. The crystallinity or internal strain in the PST thin films analyzed from the diffraction-peak widths correlate well with the decrease in the dielectric losses. The dielectric constants and dielectric loss (%) of the PST films annealed at 650c (teq : 0.89 nm) were 549 and 0.21%, respectively.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.5
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• pp.303-308
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• 1999

Dielectric thin films of PLT(28) ($(Pb_{0.72}La_{0.28})Ti_{0.93}O_3$) have been deposited on $Pt/Ti/SiO_2/Si$ substrates in situ by a laser ablation. We have systematically changed the laser fluence from 0.4 J/$cm^2$ to 3 J/$cm^2$, and deposition temperature from $450^{\circ}C\; to\; 700^{\circ}C$. The surface morphology was changed from planar grain structure to columnar structure as the nucleation energy was increased. The PLT thin film with columnar structure showed good dielectric properties. The deposition temperature influenced on nucleation energy much stronger than the laser energy density did.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.12
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• pp.1108-1114
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• 1998

$BaTiO_3$ thin films preferred c-axis orientation for the potential application of ferroelectric memory devices were deposited on silicon substrates(100) by RF sputtering and annealed at 800 and 900[$^{\circ}C$] in air. The BT(100)/BT(110) peak ratio of the sputtered sample was decreased with post-annealing in air. According to increasing with annealing temperature and time, the peak ratio of BT(100)/BT(110) was decreased and the surface density of thin film was high. Dielectric characteristics of $BaTiO_3$ thin film was measured as a function of annealing temperature and frequency. The dielectric constants were increased with annealing and decreased with frequency by space charge polarization and dipole polarization below 600[kHz]. The remanent polarization and coercive field in P-E hysteresis loop of $BaTiO_3$thin film were increased with the annealing temperature in air. The remanent polarization and coercive filed annealed at 800[$^{\circ}C$] for 1hr were 1.2[$\mu$C/$cm^2$] and 200[kV/cm]

• Journal of the Korean Ceramic Society
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• v.37 no.11
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• pp.1051-1057
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• 2000

TiO$_2$와 CeO$_2$박막을 Si 위에 증착한 후 MOCVD법에 의해 PbTiO$_3$박막을 증착하여 MFIS 구조를 형성하였다. 절연층의 후열처리가 절연층 및 MFIS 구조의 전기적 특성에 미치는 영향을 관찰하기 위해 산소분위기와 $600^{\circ}C$~90$0^{\circ}C$의 온도범위에서 후 열처리를 행하였고, C-V 특성 및 누설전류 특성을 분석하였다. CeO$_2$와 TiO$_2$박막의 유전상수는 증착 직후 6.9와 15였으며, 90$0^{\circ}C$ 열처리를 행한 후 약 4.9와 8.8로 감소하였다. 누설전류밀도 역시 증착 직후 각각 7$\times$$10^{-5}$ A/$ extrm{cm}^2$와 2.5$\times$$10^{-5}$ A/$\textrm{cm}^2$에서 90$0^{\circ}C$ 열처리를 거친 후에 약 4$\times$$10^{-8}$ A/$\textrm{cm}^2$와 4$\times$$10^{-9}$ A/$\textrm{cm}^2$로 감소하였다. Ellipsometry 시뮬레이션을 통해 계산된 계면층의 두께는 90$0^{\circ}C$에서 약 115$\AA$(CeO$_2$) 및 140$\AA$(TiO$_2$)까지 증가하였다. 계면층은 MFIS 구조에서 강유전층에 인가되는 전계를 감소시켜 항전계를 증가시켰고, charge injection을 방지하여 Al/PbTiO$_3$/CeO$_2$(90$0^{\circ}C$, $O_2$)/Si 구조의 경우 $\pm$2 V~$\pm$10 V의 측정범위에서 memory window가 계속 증가하는 것을 보여주었다.

• Korean Journal of Materials Research
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• v.8 no.12
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• pp.1152-1157
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• 1998

The PZT films were deposited on the Pt/Ti/$SiO_2$/Si substrates using multi- target DC magnetron reactive sputtering. The perovskite single phase with the composition close to the stoichiometric one, was obtained even at high substrate temperature of $540^{\circ}C$ by 2-step method, which is that PZT film was deposited for a short time at low substrate temperature ($480^{\circ}C$) to promote the nucleation of perovskite phase by reducing the volatility of Pb oxide molecules, followed by the deposition at the elevated temperature to suppress the excess incorporation of Pb component in the PZT film. This two-step method, in combination with the RTA treatment, gives rise to good electrical properties of the deposited PZT films: remanent polarifaion,$18\mu$C/$\textrm{cm}^2$; coercive field, 45kV/cm; leakage current of 10$^{-4}$ A/$\textrm{cm}^2$ at high electric field of -500kV/cm.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.10
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• pp.802-807
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• 2001

The (S $r_{0.85}$C $a_{0.15}$)Ti $O_{3}$(SCT) thin films are deposited on Pt-coated electrode (Pt/TiN/ $SiO_2$/Si) using RF sputtering method. The composition of SCT thin films deposited on Si substrate at woom temperature is close to stoichiometry(1.102 in A/B ratio). The maximum dielectric constant of SCT thin films is obtained by annealing at 600[$^{\circ}C$]. The capacitance characteristics had a stable value within $\pm$4[%]. The drastic decrease of dielectric constant and increase of dielectric loss in SCT thin films is observed above 200[kHz]. SCT thin films used in this study show the phenomena of dielectric relaxation with the increase of frequencey.cey.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.114-118
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• 2001

졸-겔법으로 Pt/Ti/$SiO_2$/Si 기판위에 $Bi_{3.7}$/$La_{0.75}$$Ti_3O_{12}$(BLT) 강유전체 박막을 형성하였다. As-coated BLT 박막은 $600^{\circ}C$의 후속 열처리온도에서 결정화 되었으며 전형적인 Bi 층상 페롭스카이트 결정구조를 나타내었다. 또한 후속 열처리온도를 증가함에 따라 결정성이 향상되었다. $700^{\circ}C$의 온도에서 후속 열처리된 BLT 박막의 비 유전상수($\varepsilon_{r}$)와 유전손실($\textrm{tan}\delta$)은 5KHz 주파수에서 약 402와 0.04를 각각 나타내었다 $800^{\circ}C$에서 후속 열처리된 BLT박막의 경우 5V의 인가 전압에서 잔류분극 2Pr($Pr^{+}$-$Pr^{-}$)값은 약 32.5$\mu$C/$Cm^2$을 나타내었다.

• Nuclear Engineering and Technology
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• v.52 no.1
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• pp.1-13
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• 2020

At present, the Department of Energy (DOE) in Unite State are directing the efforts of developing accident tolerant fuel (ATF) technology. As the first barrier of nuclear fuel system, the material selection of fuel rod cladding for ATFs is a basic but very significant issue for the development of this concept. The advanced cladding is attractive for providing much stronger oxidation resistance and better in-pile behavior under sever accident conditions (such as SBO, LOCA) for giving more coping time and, of course, at least an equivalent performance under normal condition. In recent years, many researches on in-plie or out-pile physical properties of some suggested cladding materials have been conducted to solve this material selection problem. Base on published literatures, this paper introduced relevant research backgrounds, objectives, research institutions and their progresses on several main potential claddings include triplex SiC, FeCrAl and MAX phase material Ti3SiC2. The physical properties of these claddings for their application in ATF area are also reviewed in thermohydraulic and mechanical view for better understanding and simulating the behaviors of these new claddings. While most of important data are available from publications, there are still many relevant properties are lacking for the evaluations.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.9 no.3
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• pp.576-581
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• 2005

In this paper. the a-Si:H TFT using ferroelectric of $SrTiO_3$ as a gate insulator is fabricated on glass. High k gate dielectric is required for on-current, threshold voltage and breakdown characteristics of TFT Dielectric characteristics of ferroelectric are superior to $SiO_2$ and $Si_3N_4$. Ferroelectric increases on-current and decreases threshold voltage of TFT and also ran improve breakdown characteristics.$SrTiO_4$ thin film is deposited by e-beam evaporation. Deposited films are annealed for 1 hour in N2 ambient at $150^{\circ}C\~600^{\circ}C$. Dielectric constant of ferroelectric is about 60-100 and breakdown field is about IMV/cm. In this paper, the TFT using ferroelectric consisted of double layer gate insulator to minimize the leakage current. a-SiN:H, a-Si:H (n-type a-Si:H) are deposited onto $SrTiO_3$ film to make MFNS(Metal/ferroelectric/a-SiN:H/a-Si:H) by PECVD. In this paper, TFR using ferroelectric has channel length of$8~20{\mu}m$ and channel width of $80~200{\mu}m$. And it shows that drain current is $3.4{\mu}A$at 20 gate voltage, $I_{on}/I_{off}$ is a ratio of $10^5\~10^8,\;and\;V_{th}$ is$4\~5\;volts$, respectively. In the case of TFT without having ferroelectric, it indicates that the drain current is $1.5{\mu}A$ at 20gate voltage and $V_{th}$ is $5\~6$ volts. If properties of the ferroelectric thin film are improved, the performance of TFT using this ferroelectric thin film can be advanced.

• Journal of the Korean Ceramic Society
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• v.37 no.10
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• pp.1008-1013
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• 2000

SrTi $O_3$(001) 단결정 기판 위에 졸-겔 스핀코팅으로 $SrBi_2(Ta,Nb)_2O_9$ 박막을 도포하고 그 결정화 과정을 고온 X-선 회절분석 (HTXRD)으로 추적하면서 Pt(111)/Ti/ $SiO_2$/Si 위에 성장한 박막과 비교하였다. SrTi $O_3$(001) 단결정 기판 위에 도포된 $SrBi_2Nb_2O_{9}$ 박막은 fluorite-like phase와 같은 transient phase를 거치지 않고 곧바로 순수한 $SrBi_2Nb_2O_9$ 상으로 결정화가 시작되었으며 결정화가 시작되는 온도인 ${\sim}540^{\circ}C$부터 c축 배향성장하였다. 또한 $SrB i_2(Ta,Nb)_2O_9$ 박막은 Ta/Nb 비에 관계없이 $SrTiO_3$(001) 위에서 모두 $(00{\ell})$로 배향되었으며, 코팅 횟수가 늘어나 필름의 두께가 증가함에 따라 c축 배향성은 미세한 감소를 보였다. $SrBi_2Nb_2O_9/SrTiO_3$단면을 TEM으로 관찰한 결과 $SrBi_2Nb_2O_9$은 대체로 불규칙한 크기의 다결정체로 되어 있었으나 계면 부근에서는 [001]$_{SBN}$//[001]$_{SrTi}$ $O_3$/, [100]$_{SBN}$//[100]$_{SrTi}$ $O_3$/라는 결정학적 관계를 가지며 에피탁샬 성장했음을 알 수 있었다.있었다.