• 전기전자학회논문지
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• 제24권2호
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• pp.409-418
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• 2020

본 논문에서는 Si/SiO₂/Si₃N₄/SiO₂ 적층 구조를 갖는 Si₃N₄ 립-광도파로 기반의 다중모드 간섭기를 활용하는 집적광학 소산파 바이오센서에 대해서 서술하였다. 다중모드 간섭기의 이론적 배경에 대해서 검토하였고, 전산해석을 통해서 다중모드 간섭기 구조와 설계과정을 제시하였다. 다중모드 간섭기의 제원 (길이, 폭)이 소자 성능에 어떻게 영향을 미치는지 분석하였다. 분석물질의 굴절률 변화가 다중모드 간섭기의 모드 패턴형성 위치와 출력 광파워에 많은 영향을 미치고 있음을 확인하였고, 이 특성을 적용할 경우 집적광학 바이오센서로 활용 가능함을 입증하였다.

• 한국표면공학회지
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• 제38권3호
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• pp.89-94
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• 2005

We investigate the reaction stability of cobalt and nickel with side-wall materials of $SiO_2\;and\;Si_3N_4$. We deposited 15nm-Co and 15nm-Ni on $SiO_2(200nm)/p-type$ Si(100) and $Si_3N_4(70 nm)/p-type$ Si(100). The samples were annealed at the temperatures of $700\~1100^{\circ}C$ for 40 seconds with a rapid thermal annealer. The sheet resistance, shape, and composition of the residual materials were investigated with a 4-points probe, a field emission scanning electron microscopy, and an AES depth profiling, respectively. Samples of annealed above $1000^{\circ}C$ showed the agglomeration of residual metals with maze shape and revealed extremely high sheet resistance. The Auger depth profiling showed that the $SiO_2$ substrates had no residual metallic scums after $H_2SO_4$ cleaning while $Si_3N_4$ substrates showed some metallic residuals. Therefore, the $SiO_2$ spacer may be appropriate than $Si_3N_4$ for newly proposed Co/Ni composite salicide process.

• 한국전기전자재료학회논문지
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• 제15권4호
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• pp.301-307
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• 2002

Direct bonded SOI wafer pairs with $Si ll SiO_2/Si_3N_4 ll Si$ the heterogeneous insulating layers of SiO$_2$-Si$_3$N$_4$are able to apply to the micropumps and MEMS applications. Direct bonding should be executed at low temperature to avoid the warpage of the wafer pairs and inter-diffusion of materials at the interface. 10 cm diameter 2000 ${\AA}-SiO_2/Si(100}$ and 560 $\AA$- ${\AA}-Si_3N_4/Si(100}$ wafers were prepared, and wet cleaned to activate the surface as hydrophilic and hydrophobic states, respectively. Cleaned wafers were pre- mated with facing the mirror planes by a specially designed aligner in class-100 clean room immediately. We employed a heat treatment equipment so called fast linear annealing(FLA) with a halogen lamp to enhance the bonding of pre mated wafers We kept the scan velocity of 0.08 mm/sec, which implied bonding process time of 125 sec/wafer pairs, by varying the heat input at the range of 320~550 W. We measured the bonding area by using the infrared camera and the bonding strength by the razor blade clack opening method, respective1y. It was confirmed that the bonding area was between 80% and to 95% as FLA heat input increased. The bonding strength became the equal of $1000^{\circ}C$ heat treated $Si ll SiO_2/Si_3N_4 ll Si$ pair by an electric furnace. Bonding strength increased to 2500 mJ/$\textrm{m}^2$as heat input increased, which is identical value of annealing at $1000^{\circ}C$-2 hr with an electric furnace. Our results implies that we obtained the enough bonding strength using the FLA, in less process time of 125 seconds and at lowed annealing temperature of $400^{\circ}C$, comparing with the conventional electric furnace annealing.

• 한국세라믹학회지
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• 제36권10호
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• pp.1102-1107
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• 1999

SiC-Si3N4 composites were prepared by mixing $\alpha$-Si3N4 powder to $\alpha$-SiC powder in the range of 10 to 30 vol% with 10vol% interval. 6wg% Al2O3 and 6wt% Y2O3 were respectively added as sintering aids. Hot pressing was performed at 1,80$0^{\circ}C$ for 1 hour with 25 MPa pressure. In the case of adding 20vol% of $\alpha$-Si3N4 powder the relative density to theoretical value and the flexural strength were 99.1% and 34,420 MPa respectively and the worn amount was 2.09$\times$10-3 mm2 which were the highest values in the all range of he composition. Although the composite containig 10 vol% of $\alpha$-Si3N4 powder showed the highest fracture toughness(KIC) of 4.65MN/m3/2 the reduction of the wear resistance in this composite is likely to be affected by the homogeneity and the uniformity of the grain coalescence and growth during the sintering process.

• 한국세라믹학회지
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• 제31권1호
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• pp.69-73
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• 1994

Si3N4 ceramics could be densified above 3.2g/㎤ with pressureless sintering at below 178$0^{\circ}C$ by coating Si3N4 and Y2O3 powder with an alumina sol. Substitution a portion of Al2O3 with AlN improved densification. Additional milling of the coated powder in large improvement in bending strength greater than 800 MPa (4-point).

• 한국재료학회지
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• 제5권6호
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• pp.699-705
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• 1995

질화규소 요업체에서 입계상의 변화가 파괴인성에 미치는 영향에 대해 살펴보았다 실험에는 Si$_3$N$_4$-Y$_2$O$_3$-SiO$_2$(YS)계와 Si$_3$N$_4$-Y$_2$O$_3$-A1$_2$O$_3$(YA) 계를 사용하였으며, 175$0^{\circ}C$에서 Can/HIP 처리한 후 1800~200$0^{\circ}C$ 온도구간에서 열처리시키면서 입계상의 변화에 따른 파괴인성의 변화를 조사하였다. 열처리 온도구간에서 입계상이 비정질상만으로 존재하였던 YA계의 경우는 열처리 온도가 증가되어 입성장됨에 따라 파괴인성 값이 증가되었으나, 190$0^{\circ}C$ 이상에서 열처리될 때 입계상이 결정상에서 비정질상으로 변화하였던 YS계의 경우는 오히려 파괴인성 값이 급격히 감소되었다. YS계에서 파괴인성의 급격한 저하는 열처리 온도 증가에 따라 입계상이 결정상과 비정질상의 공존 상태에서 비정질상만의 상태로 전이하며 파괴거동에 영향을 미쳤기 때문이라고 생각된다.

• 센서학회지
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• 제16권3호
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• pp.240-245
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• 2007

AlN thin film for SAW filter application was deposited on (100) silicon, sapphire, $Si_{3}N_{4}$/Si, and $Al_{2}O_{3}$/Si substrates by reactive magnetron sputtering method, respectively. The structural characteristics were dependent on the structure of substrates. Scanning Electron Microscope (SEM), X-ray Diffraction (XRD) and Atomic Force Microscope (AFM) have been used to analyze structural properties and preferred orientation of AlN thin films. Preferred orientation and SAW characteristic of AlN were improved by insertion of $Al_{2}O_{3}$ buffer layer. Insertion loss of SAW devices using AlN/Si and AlN/$Al_{2}O_{3}$/Si were about 33.27 dB and 30.20 dB, respectively.

• 한국세라믹학회지
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• 제38권1호
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• pp.22-27
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• 2001

$\beta$-Si$_3$N$_4$종자입자 첨가가 소결조제로 Y-Mg-Si-Al-O-N계 oxynitride glass를 사용하여 일축가압 소결을 행한 SiC-Si$_3$N$_4$복합재료의 미세구조와 기계적 특성에 미치는 영향을 고찰하였다. 길게 자란 $\beta$-Si$_3$N$_4$입자들과 등방성의 $\beta$-SiC 입자들이 균일하게 분포된 미세구조를 얻었다. $\beta$-Si$_3$N$_4$종자입자 함량이 증가함에 따라 SiC-Si$_3$N$_4$복합재료의 강도와 파괴인성이 증가하였고, 이는 복합화에 기인하는 결함크기의 감소와 길게 자란 $\beta$-Si$_3$N$_4$입자에 의한 균열가교 및 균열회절 등에 기인하였다. SiC-70 wt% Si$_3$N$_4$복합재료의 대표적인 강도와 파괴인성은 각각 770 MPa과 6.2 MPa.m$^{1}$2/ 이었다.

• 멤브레인
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• 제14권4호
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• pp.312-319
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• 2004

졸겔법에 의해 Si(OC$_2$$H_5$/)$_4$-($CH_3$O)$_3$B-C$_2$$H_5$OH-$H_2O$계로부터 다공성의 SiO$_2$-B$_2$O$_3$ 막을 제조하였다. SiO$_2$-B$_2$O$_3$막의 특성을 BET, IR spectrophotometer, X-ray diffractometer, SEM 과 TEM을 사용하여 조사하였다. $700^{\circ}C$에서 얻어진 SiO$_2$-B$_2$O$_3$ 막의 평균 기공직경은 0.0048 $\mu\textrm{m}$이고, 표면적은 354.398 $m^2$/g이었으며, 입자의 크기는 7 nm인 무정형의 다공체이었다. SiO$_2$-B$_2$O$_3$ 막의 수소/질소 혼합 기체 분리 특성은 기체분리 압력을 달리하여 조사하였다. $25^{\circ}C$, ΔP 155.15cmHg에서 수소/질소 혼합 기체를 분리하여 본 결과 SiO$_2$-B$_2$O$_3$ 막의 수소에 대한 real separation factor($\alpha$)는 4.68이었다. 그리고 투과셀의 압력차(ΔP)값이 증가할수록 real separation factor($\alpha$), head separation factor($\beta$), tail separation factor((equation omitted))값이 증가하였다.

• 한국공작기계학회논문집
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• 제11권3호
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• pp.86-92
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• 2002

In this study, experiments were carried out to investigate the characteristics of grinding and wear process of diamond wheel far ceramic materials. Normal component of grinding resistance of $Al_2$O$_3$ was less then that of $Si_3 N_4$ and $ZrO_2$. This seems to be the characteristics of ceramic tools on work pieces both of high hardness. For the case of $Si_3 N_4$ and $ZrO_2$, as the mesh number of wheel increases, the surface roughness decreases. For the case of $Al_2 O_3$, the surface roughness does not decreases. Specific binding energy decreases as the material removal rate per unit time increases. For the case of $Si_3 N_4$ and $ZrO_2$, grinding is carried out by abrasive wear processes. For the case of $Al_2 O_3$, grinding is carried out by grain shedding process due to brittle fracture.