• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.1
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• pp.16-22
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• 2023

In a solar cell, degradation refers to the decrease in performance parameters caused by defects originated due to various causes. During the fabrication process of solar cells, degradation is generally related to the processes such as passivation or firing. There exist sources of many types of degradation; however, the exact cause of Light and elevated Temperature Induced Degradation (LeTID) is yet to be determined. It is reported that the degradation and the regeneration occur due to the recombination of hydrogen and an arbitrary substance. In this paper, we report the deposition of Al₂O₃ and SiN_X on silicon wafers used in the Passivated Emitter and Rear Contact (PERC) solar structure and its degradation pattern. A higher degradation rate was observed in the sample with single layer of Al₂O₃ only, which indicates that the degradation is affected by the presence or the absence of a passivation thin film. In order to alleviate the degradation, optimization of different steps should be carried out in consideration of degradation in the solar cell fabrication process.

• Korean Journal of Materials Research
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• v.10 no.9
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• pp.601-606
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• 2000

Nickel mono-silicide(NiSi) shows no increase of resistivity as the line width decreases below 0.15$\mu\textrm{m}$. Furthermore, thin silicide can be made easily and restrain the redistribution of dopants, because NiSi in created through the reaction of one nickel atom and one silicon atom. Therefore, we investigated the deposition condition of Ni films, heat treatment condition and basic properties of NiSi films which are expected to be employed for sub-0.15$\mu\textrm{m}$ class devices. The nickel silicide film was deposited on the Si wafer by using a dc-magnetron sputter, then annealed at the temperature range of $150~1000^{\circ}C$. Surface roughness of each specimen was measured by using a SPM (scanning probe microscope). Microstructure and qualitative composition analysis were executed by a TEM-EDS(transmission electron microscope-energy dispersive x-ray spectroscope). Electrical properties of the materials at each annealing temperature were measured by a four-point probe. As the results of our study, we may conclude that; 1. SPM can be employed as a non-destructive process to monitor NiSi/NiSi$_2$ transformation. 2. For annealing temperature over $800^{\circ}C$, oxygen pressure $Po_2$ should be kept below $1.5{\times}10^{-11}torr$ to avoid oxidation of residual Ni. 3. NiSi to $NiSi_2$ transformation temperature in our study was $700^{\circ}C$ from the four-point probe measurement.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.73-73
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• 2009

트렌지스터의 채널 길이가 줄어듦에 따라 절연층으로 쓰이는 $SiO_2$의 두께는 얇아져야 한다. 이에 따라 얇아진 절연층에서 터널링이 발생하여 누설전류가 증가하게 되어 소자의 오동작을 유발한다. 절연층에서의 터널링을 줄여주기 위해서는 High-K와 같은 유전율이 높은 물질을 이용하여 절연층의 두께를 높여주어야 한다. 최근에 각광 받고 있는 High-K의 대표적인 물질은 $HfO_2$, $ZrO_2$와 $Al_2O_3$등이 있다. $HfO_2$, $ZrO_2$와 $Al_2O_3$는 $SiO_2$보다 유전상 수는 높지만 밴드갭 에너지, 열역학적 안정성, 재결정 온도와 같은 특성 면에서 $SiO_2$를 완전히 대체하기는 어려운 실정이다. 최근 연구에 따르면 기존의 High-K물질에 금속을 첨가한 금속산화물의 경우 밴드갭 에너지, 열역학적 안정성, 재결정 온도의 특성이 향상되었다는 결과가 있다. 이 금속 산화물 중 $HfAlO_3$가 대표적이다. $HfAlO_3$는 유전상수 18.2, 밴드캡 에너지 6.5 eV, 재결정 온도 $900\;^{\circ}C$이고 열역학적 안전성이 개선되었다. 게이트 절연층으로 사용될 수 있는 $HfAlO_3$는 전극과 기판사이에 적층구조를 이루고 있어, 이방성 식각인 건식 식각에 대한 연구가 필요하다. 본 연구는 $BCl_3$/Ar 유도결합 플라즈마를 이용하여 $HfAlO_3$ 박막의 식각 특성을 알아보았다. RF Power 700 W, DC-bias -150 V, 공정압력 15 mTorr, 기판온도 $40\;^{\circ}C$를 기본 조건으로 하여, $BCl_3$/Ar 가스비율, RF Power, DC-bias 전압, 공정압력에 의한 식각율 조건과 마스크물질과의 선택비를 알아보았다. 플라즈마 분석은 Optical 이용하여 진행하였고, 식각 후 표면의 화학적 구조는 X-ray Photoelectron Spectroscoopy(XPS) 분석을 통하여 알아보았다.

• Journal of the Korean institute of surface engineering
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• v.38 no.2
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• pp.65-68
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• 2005

The effect of crystal orientation and microstructure on the mechanical properties of $TaN_x$ was investigated. $TaN_x$ films were grown on $SiO_2$ substrates by ultrahigh vacuum unbalanced magnetron sputter deposition in mixed $Ar/N_2$ discharges at 20 mTorr (2.67 Pa) and at $350^{\circ}C$. Unlike the Ti-N system, in which TiN is the terminal phase, a large number of N-rich phases in the Ta-N system could lead to layers which had nano-sized lamella structure of coherent cubic and hexagonal phases, with a correct choice of nitrogen fraction in the sputtering mixture and ion irradiation energy during growth. The preferred orientations and the micro-structure of $TaN_x$ layers were controlled by varing incident ion energy $E_i\;(=30eV\~50eV)$ and nitrogen fractions $f_{N2}\;(=0.1\~0.15)$. $TaN_x$ layers were grown on (0002)-Ti underlayer as a crystallographic template in order to relieve the stress on the films. The structure of the $TaN_x$ film transformed from Bl-NaCl $\delta-TaN_x$ to lamellar structured Bl-NaCl $\delta-TaN_x$ + hexagonal $\varepsilon-TaN_x$ or Bl-NaCl $\delta-TaN_x$ + hexagonal $\gamma-TaN_x$ with increasing the ion energy at the same nitrogen fraction $f_{N2}$. The hardness of the films also increased by the structural change. At the nitrogen fraction of $0.1\~0.125$, the structure of the $TaN_x$ films was changed from $\delta-TaN_x\;+\;\varepsilon-TaN_x\;to\;\delta-TaN_x\;+\;\gamma-TaN_x$ with increasing the ion energy. However, at the nitrogen fraction of 0.15 the film structure did not change from $\delta-TaN_x\;+\;\varepsilon-TaN_x$ over the whole range of the applied ion energy. The hardness increased significantly from 21.1 GPa to 45.5 GPa with increasing the ion energy.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.173-173
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• 2010

$Bi_4Ti_3O_{12}$ ($B_4T_3$) is a unique ferroelectric material that has a relatively high dielectric constant, high Curie temperature, high breakdown strength, and large spontaneous polarization. As a result this material has been widely studied for many applications, including nonvolatile ferroelectric random memories, microelectronic mechanical systems, and nonlinear-optical devices. Several reports have appeared on the use of Mn dopants to improve the electrical properties of $B_4T_3$ thin films. Mn ions have frequently been used for this purpose in thin films and multilayer capacitors in situations where intrinsic oxygen vacancies are the major defects. However, no systematic study of the optical properties of $B_4T_3$ films has appeared to date. Here, we report optical data for these films, determined by spectroscopic ellipsometry (SE). We also report the effects of thermal annealing and Mn doping on the optical properties. The SE data were analyzed using a multilayer model that is consistent with the original sample structure, specifically surface roughness/$B_4T_3$ film/Pt/Ti/$SiO_2$/c-Si). The data are well described by the Tauc-Lorentz dispersion function, which can therefore be used to model the optical properties of these materials. Parameters for reconstructing the dielectric functions of these films are also reported. The SE data show that thermal annealing crystallizes $B_4T_3$ films, as confirmed by the appearance of $B_4T_3$ peaks in X-ray diffraction patterns. The bandgap of $B_4T_3$ red-shifts with increasing Mn concentration. We interpret this as evidence of the existence deep levels generated by the Mn transition-metal d states. These results will be useful in a number of contexts, including more detailed studies of the optical properties of these materials for engineering high-speed devices.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.188.1-188.1
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• 2015

For present investigation Fe/MgO/Fe/Co multilayer stack is grown on Si substrate using e-beam evaporation in ultrahigh vacuum. This stack is irradiated perpendicularly by 120 MeV $Ag^{8+}$ at different fluences ranging from $1{\times}10^{11}$ to $1{\times}10^{13}ions/cm^2$ in high vacuum using 15UD Pelletron Accelerator at Inter University Accelerator Centre, New Delhi. Magnetic measurements carried out on pre and post irradiated stacks show significant changes in the shape of perpendicular hysteresis which is relevant with previous observation of re-orientation of magnetic moment along the direction of ion trajectory. However increase in plane squareness may be due to the modification of interface structure of stacks. X-ray reflectivity measurements show onset of interface roughness and interface mixing. X-ray diffraction measurements carried out using synchrotron radiation shows amorphous nature of MgO and Co layer in the stack. Peak corresponding body centered Fe [JCPDS-06-0696] is observed in X-ray diffraction pattern of pre and post irradiated stacks. Peak broadening shows granular nature of Fe layer. Estimated crystallite size is $22{\pm}1nm$ for pre-irradiated stack. Crystallite size first increases with irradiation then decreases. Structural quality of these stacks was further studied using transmission electron microscopic measurements. Thickness from these measurements are 54, 36, 23, 58 and 3 nm respectively for MgO, Fe, MgO, Fe+Co and Au layers in the stack. These measurements envisage poor crystallinity of different layers. Interfaces are not clear which indicate mixing at interface. With increase fluence mixing and diffusion was increased in the stack. X-ray absorption spectroscopic measurements carried out on these stacks show changes of Fe valence state after irradiation along with change of O(2p)-metal (3d) hybridized state. Valence state change predicts oxide formation at interface which causes enhanced in-plane magnetization.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.169-169
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• 2008

To keep pace with scaling trends of CMOS technologies, high-k metal oxides are to be introduced. Due to their high permittivity, high-k materials can achieve the required capacitance with stacks of higher physical thickness to reduce the leakage current through the scaled gate oxide, which make it become much more promising materials to instead of $SiO_2$. As further studying on high-k, an understanding of the relation between the etch characteristics of high-k dielectric materials and plasma properties is required for the low damaged removal process to match standard processing procedure. There are some reports on the dry etching of different high-k materials in ICP and ECR plasma with various plasma parameters, such as different gas combinations ($Cl_2$, $Cl_2/BCl_3$, $Cl_2$/Ar, $SF_6$/Ar, and $CH_4/H_2$/Ar etc). Understanding of the complex behavior of particles at surfaces requires detailed knowledge of both macroscopic and microscopic processes that take place; also certain processes depend critically on temperature and gas pressure. The choice of $BCl_3$ as the chemically active gas results from the fact that it is widely used for the etching o the materials covered by the native oxides due to the effective extraction of oxygen in the form of $BCl_xO_y$ compounds. In this study, the surface reactions and the etch rate of $Al_2O_3$ films in $BCl_3/Cl_2$/Ar plasma were investigated in an inductively coupled plasma(ICP) reactor in terms of the gas mixing ratio, RF power, DC bias and chamber pressure. The variations of relative volume densities for the particles were measured with optical emission spectroscopy (OES). The surface imagination was measured by AFM and SEM. The chemical states of film was investigated using X-ray photoelectron spectroscopy (XPS), which confirmed the existence of nonvolatile etch byproducts.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1345-1346
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• 2007

다양한 게이트 절연막의 펜타신 박막 트랜지스터의 전기적 특성을 atomic force microscope (AFM), X-선 회절을 사용하여 분석하였다. 펜타신 박막 트랜지스터는 thermal evaporator 방법을 사용하여 여러 폴리며 기판위에 제작하였다. Hexamethylsilasane (HMDS), polyvinyl acetate (PVA), polymethyl methacrylate (PMMA)등의 폴리머 기판을 사용하여 다양한 온도에서 증착시켰다. 이 때 PMMA위에 증착시킨 펜타신의 경우가 가장 큰 그레인 크기를 보였고, 가장 적은 트랩 농도를 보였다. 그리고 상부 전극 구조를 가진 박막 트랜지스터를 HMDS 처리를 한 $SiO_2$와 PMMA 절연막을 사용하여 제작하고 비교하였다. 이때 PMMA기판 위에 제작한 트랜지스터는 전계효과 이동도가 ${\mu}_{FET}=0.03cm^{2}/Vs$ 이고, 문턱이전 기울기 0.55V/dec, 문턱전압 $V_{th}=-6V$, on/off 전류비 $>10^5$의 전기적 특성을 보였고, $SiO_2$ 기판위에 제작한 트랜지스터는 전계효과 이동도 ${\mu}_{FET}=0.004cm^{2}/Vs$, 문턱이전 기울기 0.518 V/dec, 문턱전압 $V_{th}=5V$, on/off 전류비 $>10^4$의 전기적 특성을 보였다.

• Korean Journal of Materials Research
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• v.11 no.3
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• pp.215-220
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• 2001

Amorphous Ti-Si-N films of approximately 200 and 650 thickness were reactively sputtered on Si wafers using a dc magnetron sputtering system at various $N_2$/Ar flow ratios. Their barrier properties between Cu (750 ) and Si were investigated by using sheet resistance measurements, XRD, SEM, RBS, and AES depth profiling focused on the effect of the nitrogen content in Ti-Si-N thin film on the Ti-Si-N barrier properties. As the nitrogen content increases, first the failure temperature tends to increase up to 46 % and then decrease. Barrier failure seems to occur by the diffusion of Cu into the Si substrate to form Cu$_3$Si, since no other X- ray diffraction intensity peak (for example, that for titanium silicide) than Cu and Cu$_3$Si Peaks appears up to 80$0^{\circ}C$. The optimal composition of Ti-Si-N in this study is $Ti_{29}$Si$_{25}$N$_{46}$. The failure temperatures of the $Ti_{29}$Si$_{25}$N$_{465}$ barrier layers 200 and 650 thick are 650 and $700^{\circ}C$, respectively.ely.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.1244-1247
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• 2004

For obtaining the best panel quality of color filter on array(COA) architecture in TFF LCD, we investigated the influence of deposition temperature, $O_2$ flow, thickness on the optical transmittance, wet etching and adhesion properties of IZO deposited onto each color photo resist(red, green, blue). Average transmittance of the pixel single layer in the visible range(between 380 and 780nm) was mainly affected by thickness and showed maximum at 1250 ${\AA}$ while the thickness showing peak transparency in each R, G, B wavelength was different. The relation was calculated by using bi-layer transmission and reflectance model, which corresponded to experimental data very well. The adhesion of IZO deposited on each color PR was found to have enhanced value except red PR case, compared to that of IZO which was deposited on $SiN_x$. Wet etching pattern linearity was decreased as the thickness increased. The thickness of IZO was one of vital factors in order to optimize overall pixel process for fabricating COA structure.