• Title/Summary/Keyword: $SiO_x$ thin film

검색결과 467건 처리시간 0.036초

광화학기상성장법에 의한 Si 기판상에서의 TaO$_{x}$ 박막 제작에 관한 연구 (Fabrication of TaOx Thin Film on Si-Substrate by Photo-CVD Method)

  • 한봉명;김수용;김경식
    • 한국표면공학회지
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    • 제25권3호
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    • pp.126-132
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    • 1992
  • Recent VLSI requires materials with high dielectric constant in order to reduce their storage capacitor areas. Thin TaOx film was formed from Ta(OCH3)5 by photo-CVD method at a low temperature. The result shows that the film obtained by photo-CVD method is this study has good step coverage, high dielectric constant (20-25) and low leakage current. The high strong peaks from Ta(4f), Ta(4d), and O(ls) levels were observed by XPS analysis. From the diffraction pattern and TEM prcture analysis, the TaOx thin film was observed to be amorphous. This kind of the deposition method could be considered to be a very promising method applied to VLSI.

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유기 금속 화학 증착법에 의한 $(Ba_{1-x},\;Sr_x)TiO_3$ 박막의 제조 및 전기적 특성 (Preparation and Electrical Properties of $(Ba_{1-x},\;Sr_x)TiO_3$ Thin Film by Metal-Organic Chemical Vapor Deposition)

  • 윤종국;윤순길
    • 한국재료학회지
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    • 제5권7호
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    • pp.816-819
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    • 1995
  • 저압 유기금속 화학 증탁법에 의하여 Pt/Ti/SiO$_2$/Si 기판위에 (Ba$_{1-x}$ , Sr$_{x}$)TiO/$_3$박막이 제조 되었다. 제조된 BST 박막의 결정화도는 증착온도가 증가함에 따라 (100)방향으로 우선 성장하였다. 90$0^{\circ}C$에서 증착한 BST 박막은 100kHz의 주파수에서 유전상수가 365, 유전손실이 0.052를 나타내었다. 인가전계에 따라 축전용량의 변화가 작은 상유전 특성을 보였으며 0.2MV/cm인가 전계에서 축적 전하 밀도(charge storage density)는 60fC/$\mu\textrm{m}$$^2$을, 0.15MV/cm인가 전계 영역에서 누설 전류밀도(leakage current density)는 20nA/$\textrm{cm}^2$을 나타냈다.냈다.

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대향타겟식 스퍼터링 장치의 공정 조건에 따른 SiO2 가스 차단막의 특성 (Characteristics of SiO2 Gas Barrier Films as a Function of Process Conditions in Facing Target Sputtering (FTS) System)

  • 배강;왕태현;손선영;김화민;홍재석
    • 한국전기전자재료학회논문지
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    • 제22권7호
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    • pp.595-601
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    • 2009
  • For the silicon oxide $(SiO_x)$ films prepared by using the facing target sputtering (FTS) apparatus that was manufactured to enhance the preciseness of the fabricated thin-film and sputtering yield rate by forming a higher-density plasma in the electrical discharge space for using it as a thin-film passivation system for flexible organic light emitting devices (FOLEDs). The deposition characteristics were investigated under various process conditions, such as array of the cathode magnets, oxygen concentration$(O_2/Ar+O_2)$ introduced during deposition, and variations of distance between two targets and working pressure. We report that the optimum conditions for our FTS apparatus for the deposition of the $SiO_x$ films are as follows: $d_{TS}\;and\;d_{TT}$ are 90mm and 120mm, respectively and the maximum deposition rate is obtained under a gas pressure of 2 mTorr with an oxygen concentration of 3.3%. Under this optimum conditions, it was found that the $SiO_x$ film was grown with a very high deposition rate of $250{\AA}$/min by rf-power of $4.4W/cm^2$, which was significantly enhanced as compared with a deposition rate (${\sim}55{\AA})$/min) of the conventional sputtering system. We also reported that the FTS system is a suitable method for the high speed and the low temperature deposition, the plasma free deposition, and the mass-production.

$SrTiO_{3}$ 세라믹 박막의 Ca 치환량에 따른 특성 (Properties wRh Ca Substitutional Contents of $SrTiO_{3}$ Ceramic Thin Film)

  • 김진사;오용철;조춘남;신철기;송민종;최운식;박민순;김충혁
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제54권9호
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    • pp.397-402
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    • 2005
  • The ($Sr_{1-x}Ca_x)TiO_3(SCT)$ thin films are deposited on Pt-coated electrode (Pt/TiN/SiO$_{2}$Si) using RF sputtering method with substitutional contents of Ca. The optimum conditions of RF power and Ar/O$_{2}$ ratio were 140(W) and 80/20, respectively. Deposition rate of SCT thin film was about $18.75{\AA}$/min. The dielectric constant was increased with increasing the substitutional contents of Ca, while it was decreased if the substitutional contents of Ca exceeded over $15[mol\%]$. The capacitance characteristics had a stable value within $\pm4[\%]$ in temperature ranges of $-80\~+90[^{\circ}C]$. All SCT thin films used in this study show the phenomena of dielectric relaxation with the increase of frequency, and the relaxation frequency is observed above 200[kHz].

Semi-Permanent Hydrophilization of Polyester Textile by Polymerization and Oxidation Using Atmospheric Pressure Dielectric Barrier Discharge (APDBD)

  • Se Hoon Shin;Yoon Kee Kim
    • 한국재료학회지
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    • 제33권4호
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    • pp.115-123
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    • 2023
  • In this paper, we report and discuss the semi-permanently hydrophilic (SPH) treatment of polyester fabric using plasma polymerization and oxidation based on atmospheric pressure dielectric barrier discharge (APDBD) technology. SiOxCy(-H) was coated on polyester fabric using Hexamethylcyclotrisiloxane (HMCTSO) as a precursor, and then plasma oxidation was performed to change the upper layer of the thin film to SiO2-like. The degradation of hydrophilicity of the SPH polyester fabrics was evaluated by water contact angle (WCA) and wicking time after repeated washing. The surface morphology of the coated yarns was observed with scanning electron microscopy, and the presence of the coating layer was confirmed by measuring the Si peak using energy dispersive x-ray spectroscopy. The WCA of the SPH polyester fabric increased to 50 degrees after 30 washes, but it was still hydrophilic compared to the untreated fabric. The decrease in hydrophilicity of the SPH fabric was due to peeling of the SiOxCy(-H) thin film coated on polyester yarns.

Sol-Gel법에 의한 Pb(Zr,Ti)$O_3$ 박막의 제조 및 유전 특성 (Preparation and Dielectric properties of the Pb(Zr,Ti)$O_3$ Thin Film by Sol-Gel Method)

  • 정장호;박인길;류기원;이성갑;이영희
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1995년도 하계학술대회 논문집 C
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    • pp.1022-1024
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    • 1995
  • In this study, $Pb(Zr_xTi_{1-x})O_3$(x=0.65, 0.52, 0.35) thin films were fabricated by Sol-Gel method. A stock solution with excess Pb 10[mol.%] of $Pb(Zr_xTi_{1-x})O_3$ was made and spin-coated on the Pt/$SiO_2$/Si substrate at 4000[rpm] for 30[sec.]. Coated specimens were dried on the hot-plate at $400[^{\circ}C]$ for 10[min.]. Sintering temperature and time were $500{\sim}800[^{\circ}C]$ and $1{\sim}60$[min.]. To investigate crystallization condition, PZT thin films were analyzed with sintering temperature, time and composition by the XRD. The microstructure of thin films were investigated by SEM. The ferroelectric perovskite phases precipitated under the sintering of $700[^{\circ}C]$ for 1 hour. In the PZT(52/48) composition, dielectric constant and dielectric loss were 2133, 2.2[%] at room temperature, respectively.

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BTMSM/$O_2$ 고유량으로 증착된 low-k SiOCH 박막의 전기적인 특성 (Electrical characteristics of low-k SiOCH thin film deposited by BTMSM/$O_2$ high flow rates)

  • 김민석;황창수;김홍배
    • 반도체디스플레이기술학회지
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    • 제7권1호
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    • pp.41-45
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    • 2008
  • We studied the electrical characteristics of low-k SiOCR interlayer dielectric(ILD) films fabricated by plasma enhanced chemical vapor deposition (PECVD). The precursor bis-trimethylsilylmethane (BTMSM) was introduced into the reaction chamber with the various flow rates. The absorption intensities of Si-O-$CH_x$, bonding group and Si-$CH_x$, bonding group changed synchronously for the variation of precursor flow rate, but the intensity of Si-O-Si(C) responded asynchronously with the $CH_x$, combined bonds. The SiOCH films revealed ultra low dielectric constant around 2.1(1) and reduced further below 2.0 by heat treatments.

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유기반도체용 고성능 박막 봉지재의 제조 및 평가 (Fabrication and Characterization of High-Performance Thin-Film Encapsulation for Organic Electronics)

  • 김남수
    • 대한기계학회논문집B
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    • 제36권10호
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    • pp.1049-1054
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    • 2012
  • 유기전자재료의 발전으로 박막화, 유연화, 경량화가 가능하면서, 저가의 생산비용으로 제조 될 수 있는 유기반도체의 개발 및 상용화에 대한 연구가 활발히 이루어지고 있다. 하지만, 유기반도체를 구성하는 유기재료 및 전극재료가 미량의 수분과 반응으로 성능이 저하되는 문제로 상용화의 큰 걸림돌이 되고 있다. 따라서 유기재료 및 전극을 동작환경의 수분으로부터 보호할 수 있는 고성능 투습 방지막 개발에 대한 연구가 많이 진행되고 있다. 본 연구에서는 $SiO_x$/parylene 및 $SiN_x$/parylene 구조를 이용한 다중 구조의 고성능 박막 봉지막을 개발하고, 개발된 박막을 Ca-corrosion test를 이용하여 수분투과율을 측정하였다. 또한 박막 봉지재를 유기태양전지에 적용하여 유기태양전지의 수명과 투습특성과의 관계를 확인하였다.

ICPCVD방법에 의한 나노기공을 갖는 Si-O-C 박막의 형성에 관한 연구 (A study on the structure of Si-O-C thin films with films size pore by ICPCVD)

  • Oh, Teresa
    • 한국정보통신학회:학술대회논문집
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    • 한국해양정보통신학회 2002년도 추계종합학술대회
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    • pp.477-480
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    • 2002
  • ULSI(ultra large scaled integrated circuits)의 고집적화와 고속화를 위한 다층 배선 기술 중에서 층간 절연막의 특성을 향상시켜주는 것은 매우 중요한 요소이다. 소자의 소형화에 따른 절연층의 용량에 의한 신호의 지연을 방지하고 금속배선간의 상호간섭을 막아주기 위해서 현재 요구되는 0.13$\mu\textrm{m}$급 소자의 경우에서는 유전율이 매우 낮은 k$\leq$2.0인 층간 절연막이 필요하게 된다. 이러한 차세대 반도체 소자의 층간 절연물질로서 사용될 유력한 저유전 물질로 Nanoporous silica(k=1.3~2.5)를 적용하려는 연구가 진행되고 있다(1)-(3). 그러한 물질 중에 하나가 organosilicate films이 있는데 carbon-doped oxides, silicon-oxicarbides, carbon-incorporated silicon oxide film, organic-inorganic hybrid type Si-O-C thin films 혹은 organic-inorganic hybrid silica materials 등으로 불린다. 이에 본 연구에서는 nano-pore를 갖는 유무기 하이브리드 구조의 저유전 박막을 BTMSM/O$_2$의 혼합된 precursor를 사용하여 ICPCVD 방법에 의해 형성하였다. 총 유량을 20sccm이 되도록 하여 $O_2$:BTMSM(Ar)의 유량비를 변화시키며, 작업진공도는 300mTorr였다. 기판은 가열하지 않고, p-type Si(100) 위에 Si-O-C-H 박막을 형성하였다. 열적안정성을 조사하기 위하여 30$0^{\circ}C$, 40$0^{\circ}C$, 50$0^{\circ}C$에서 30분간 열처리하여 비교 분석하였다. 형성된 박막의 특성은 XPS로 분석하여 유전상수와의 상관관계를 조사하였다.

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Physical and Chemical Investigation of Substrate Temperature Dependence of Zirconium Oxide Films on Si(100)

  • Chun, Mi-Sun;Moon, Myung-Jun;Park, Ju-Yun;Kang, Yong-Cheol
    • Bulletin of the Korean Chemical Society
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    • 제30권11호
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    • pp.2729-2734
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    • 2009
  • We report here the surface behavior of zirconium oxide deposited on Si(100) substrate depending on the different substrate temperatures. The zirconium oxide thin films were successfully deposited on the Si(100) surfaces applying radio-frequency (RF) magnetron sputtering process. The obtained zirconium oxide films were characterized by X-ray photoelectron spectroscopy (XPS) for study about the chemical environment of the elements, X-ray diffraction (XRD) for check the crystallinity of the films, spectroscopic ellipsometry (SE) technique for measuring the thickness of the films, and the morphology of the films were investigated by atomic force microscope (AFM). We found that the oxidation states of zirconium were changed from zirconium suboxides ($ZrO_{x,y}$, x,y < 2) (x; higher and y; lower oxidation state of zirconium) to zirconia ($ZrO_2$), and the surface was smoothed as the substrate temperature increased.