• Journal of the Korean Vacuum Society
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• v.9 no.4
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• pp.346-352
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• 2000

We investigated the oxidation behavior of poly $Si_{1-x}Ge_x$ films (X=0.15, 0.42) at $700^{\circ}C$ in wet oxidation ambients and analyzed the oxide by XPS, RBS, and cross-sectional TEM. In the case of poly $Si_{0.85}Ge_{0.15}$ films, $SiO_2$ was formed on the poly $Si_{1-x}Ge_x$ films and Ge was rejected from growing oxide, subsequently leading to the increase of Ge content. In the case of poly $Si_{0.58}Ge_{0.42}$ films, we found that $SiO_2-GeO_2$ were formed on the poly $Si_{1-x}Ge_x$ films due to high Ge content. Finally, we proposed the oxidation model of poly $Si_{1-x}Ge_x$ films.

• Horticultural Science & Technology
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• v.33 no.6
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• pp.860-868
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• 2015

The effect of Si supplied during plant cultivation on tolerance to high temperature stress in Euphorbia pulcherrima Willd. 'Ichiban' was investigated. Rooted cuttings were transplanted into 10-cm pots and a complete nutrient solution, containing 0 or $50mg{\cdot}L^{-1}$ Si as either $K_2SiO_3$, $Na_2SiO_3$, or $CaSiO_3$, was supplied through subirrigation or weekly foliar applications. After two months of cultivation, plants were placed in an environment-controlled chamber and subjected to $35{\pm}1^{\circ}C$ (high temperature) conditions for 18 days. Enhanced specific activities of enzymatic antioxidants (APX) and suppressed specific activities of non-enzymatic antioxidants (ELP) were observed in the high temperature-stressed plants with Si application. The Fv/Fm (maximum quantum yield of photosystem II), photosynthetic rate, and Si contents in the shoot increased in the treatments of $K_2SiO_3$ and $Na_2SiO_3$ supplied through subirrigation. The Si-treated plants had more tolerance of high temperature stress than the control plants. Of the Si sources and application methods tested, $K_2SiO_3$ and $Na_2SiO_3$ supplied through subirrigation were found to be the most effective in enhancing tolerance to high temperature stress.

• Korean Chemical Engineering Research
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• v.44 no.6
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• pp.609-613
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• 2006

Ba2-xSrxSiO4:Eu2+ phosphor particles with the high photoluminescence (PL) intensity under long wavelength ultraviolet (UV) were prepared by spray pyrolysis. The photoluminescence, morphological and crystalline characteristics of $Ba_{2-x.}Sr_{x.}SiO_4:Eu^{2+}$ phosphor particles prepared by spray pyrolysis were investigated. $Ba_{2-x.}Sr_{x.}SiO_4:Eu^{2+}$ phosphor particles prepared by spray pyrolysis had various colors from bluish green to yellow by changing the ratio of barium and strontium of the host material. In case of x=0, the main emission peak of $Ba_2SiO_4:Eu^{2+}$ phosphor was 500 nm. In case of x=2, the main emission peak of $Sr_2SiO_4:Eu^{2+}$ phosphor was 554nm. $Ba_{2-x.}Sr_{x.}SiO_4:Eu^{2+}$ phosphor particles obtained by spray pyrolysis had spherical shape and hollow structure. On the other hand, the post-treated $Ba_{2-x.}Sr_{x.}SiO_4:Eu^{2+}$ phosphor particles had large size and irregular shape. The $Ba_{1.488}Sr_{0.5}SiO_4:Eu_{0.012}{^{2+}}$ phosphor particles had the maximum PL intensity after post-treatment at temperature of $1300^{\circ}C$ for 3h under reduction atmosphere.

• Journal of the Semiconductor & Display Technology
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• v.6 no.2 s.19
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• pp.15-18
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• 2007

Effects of $O_2$ flow during deposition on Si crystallization at low substrate temperature were studied. Silicon thin films were prepared on $SiO_2$ substrates in a low-pressure chemical vapor deposition chamber using a mixture of $SiH_4$ and $H_2$. In some cases $O_2$ was intentionally introduced during deposition. Growth of poly silicon was observed at the substrate temperature as low as $480^{\circ}C$ when $O_2$ was flowed during deposition implying that crystallization of Si was enhanced by $O_2$ flow. On the other hand, $O_2$ flow did not show any significant effects at higher substrate temperature, where deposition rate is relatively fast. Enhancement mechanism of Si crystallization by $O_2$ flow was suggested from these results.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.26-31
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• 2023

We investigated the impact of NF₃ / H₂O remote plasma dry cleaning conditions on the SiO₂ etching rate at different preparation states during the fabrication of ultra-large-scale integration (ULSI) devices. This included consideration of factors like Si crystal orientation prior to oxidation and three-dimensional structures. The dry cleaning process were carried out varying the parameters of pressure, NF₃ flow rate, and H₂O flow rate. We found that the pressure had an effective role in controlling anisotropic etching when a thin SiO₂ layer was situated between Si₃N₄ and Si layers in a multilayer trench structure. Based on these observations, we would like to provide further guidelines for implementing the dry cleaning process in the fabrication of semiconductor devices having 3D structures.

• Journal of the Korean Ceramic Society
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• v.37 no.11
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• pp.1044-1050
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• 2000

ZnO-Pr$_{6}$O$_{11}$-Co$_3$O$_4$-CaO 사성분계에 SiO$_2$를 0.4at%까지 첨가하여 1180, 1200 및 125$0^{\circ}C$에서 소성하여 미세구조 및 전기적인 특성을 조사하였다. 소성온도 120$0^{\circ}C$ 이상에서 치밀한 시편을 얻을 수 있었고, Si는 주로 입계에 분포하고 있으며, SiO$_2$첨가는 결정립성장을 억제하였다. 이 현상은 고상소결만이 일어나 120$0^{\circ}C$에서 소결된 시편과 액상소결이 일어난 125$0^{\circ}C$에서 소결된 시편 모두에서 관찰되었으며, SiO$_2$첨가에 의한 기공의 증가에 기인하는 것으로 판단된다. SiO$_2$의 첨가에 의해 바리스터의 비선형계수가 크게 변화하였으며, 시편의 소성과정이 고상소결인 경우 비선형계수가 증가한 반면 액상소결인 경우에는 감소하였다. 적절한 양의 SiO$_2$(약 0.3at%)를 첨가하여 액상이 형성되지 않는 120$0^{\circ}C$에서 소성하여 80 이상의 비선형계수를 갖는 바리스터를 제조할 수 있었다.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.12
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• pp.59-64
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• 1996

InSb MIS devices prepared by remote PECVD SiO$_{2}$ were fabricated. The SiO$_{2}$ films on InSb were deposited at atemperature range of 67~190$^{\circ}$C. The effects of deposition temperature on the structural characteristics of the SiO$_{2}$ films evaluated Auger electron spectroscopy showed that atomic raito of silicon to oxygen was 0.5 and composition toms were distributed uniformaly throuout the oxide film. The transition region is about 100$\AA$ for SiO$_{2}$/InSb interface. The leakage current density at 1MV/cm and the breakdownelectric field of the MiS device using SiO$_{2}$ film deposited at 105$^{\circ}$C were about 22 nA/cm$^{2}$ and 3.5MV/cm, respectively. The interface-state density at mid-bandgap extracted from 1 MHz high frequency C-V measurement was about 2X10$^{11}$ cm$^{-2}$eV$^{-1}$.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.3
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• pp.117-125
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• 1996

The variation of the interfacial and the electrical properties of SiO$_{2}$TiW layers as a function of anneal temperature was extensively investigated. During the deposition of SiO$_{2}$ on TiW chemical bonds such as SiO$_{2}$, TiW, WO$_{3}$, WO$_{2}$ TiO$_{2}$ Ti$_{2}$O$_{5}$ has been created at the SiO$_{2}$/TiW interface. At the anneal temperature of 300$^{\circ}C$, WO$_{3}$ and TiO$_{2}$ bonds started to break due to the reduction phenomena of W and Ti and simultaneously the metallic W and Ti bonds started to create. Above 500$^{\circ}C$, a part of Si-O bonds was broken and consequently Ti/W silicide was formed. Form the current-voltage characteristics of Al/Sico$_{2}$(220$\AA$)/TiW antifuse structure, it was found that the breakdown voltage of antifuse device wzas decreased with increasing annealing temperature for SiO$_{2}$(220$\AA$)/TiW layer. When r, the insulating property of antifuse device of the deterioration of intermetallic SiO$_{2}$ film, caused by the influw of Ti and W.W.

• Journal of the Korean Ceramic Society
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• v.30 no.2
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• pp.123-130
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• 1993

Dispersed type Al2O3-SiC composite powders were synthesized from Al-isopropoxide (Al(i-OC3H7)3) and Si(OC2H5)4 precursors by hydrolysis of mixed alkoxides and carbothermal reaction method. The characteristics of the synthesized (dispersed type) Al2O3-SiC composite powders were investigated using XRD, SEM, TEM, BET and particle size analyzer. Carbothermal reaction to produce Al2O3-SiC composite was completed in 10h at 135$0^{\circ}C$ on 3~4㎤/s (0.21~0.28cm/s) of H2 flow rate and about 1/1 of carbon/oxides(=SiO2＋Al2O3) molar ratio. The synthesized powders were observed to have the mean particle size range of 0.4~1.26${\mu}{\textrm}{m}$ and showed finer particle size with increasing SiC content.

• Journal of the Korean Ceramic Society
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• v.40 no.7
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• pp.657-661
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• 2003

The elastic moduli or fracture strengths of multi-layered film (SiO$_2$/po1y-Si/SiN/SiO$_2$, 2.77 $\mu\textrm{m}$ thick), CVD diamond film (1.6 $\mu\textrm{m}$ thick), SiO$_2$ film (1.0 $\mu\textrm{m}$ thick) and SiN film (0.43 $\mu\textrm{m}$ thick) made for the membrane of ink-jet printer head were measured with cantilever beam bending method using nanoindenter after fabricating in the form of micro cantilever beam (${\mu}$-CLB). And the elastic moduli of ${\mu}$-CLB of SiO$_2$ film and SiN film were compared with the value of each film on silicon substrate determined with nanoindentation method. The results showed that the modulus and strength of multi-layered film decrease from 68.08 ㎬ and 2.495 ㎬ to 56.53 ㎬ and 1.834 ㎬, respectively as the width of CLB increases from 18.5 $\mu\textrm{m}$ to 58.5 $\mu\textrm{m}$. And the elastic moduli of SiO$_2$ and SiN films measured with ${\mu}$-CLB bending method are 68.16 ㎬ and 215.45 ㎬, respectively and the elastic moduli of these films on silicon substrate measured with nanoindentation method are 98.78 ㎬ and 219.38 ㎬, respectively. These results show that with ${\mu}$-CLB bending technique, moduli can be measured to within 2%.