• Title/Summary/Keyword: $SiO_2/Si$ interface

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Synthesis and Properties of Coating Agents for Automobile Parts Using Water-born Polyurethane, Polysiloxane, and UHMWPP Powder (수분산 폴리우레탄, 폴리실록산, UHMWPP 분말을 이용하여 제조한 자동차 부품용 코팅제 합성 및 물성 연구)

  • Yong-Sung Kim;Sung-Jin Park;Young-hwan Kim;Hyejin Kim;Choong-Sun Lim;Bong-kuk Seo
    • Journal of Adhesion and Interface
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    • v.24 no.4
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    • pp.124-130
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    • 2023
  • For automotive coating agents that require little change in characteristics due to changes in external temperature, changes in noise characteristics due to changes in the external environment are very important. Therefore, soft polyurethane with excellent cold resistance, weather resistance, and abrasion resistance, and polysiloxane whose -OH terminated and side chains are modified with amines, are widely used. In this study, coating agents was prepared by adding water-born polyurethane, polysiloxane, ultra high molecular weight polypropylene (UHMWPP) powder, carbon black, and a matting agent to determine the effect of each resin component on noise. To study the effect of each resin component on noise, a coating agent was prepared by adding water-born polyurethane, polysiloxane, UHMWPP powder, carbon black, and a matting agent. The hard/soft segment ratio of water-born polyurethane, the main component of the coating, was 27.1%/72.9%, and the ratio of amino siloxanes to hydroxy-terminated polysiloxane was 2:7, which produced the least noise. The difference in friction coefficient was large when the friction body moves at high speed. When UHMWPP powder replaced SiO2, noise decreased and gloss also decreased.

Surface Morphology of PEO-treated Ti-6Al-4V Alloy after Anodic Titanium Oxide Treatment (ATO 처리후, 플라즈마 전해 산화 처리된 Ti-6Al-4V 합금의 표면 형태)

  • Kim, Seung-Pyo;Choe, Han-Cheol
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2018.06a
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    • pp.75-75
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    • 2018
  • Commercially pure titanium (CP-Ti) and Ti-6Al-4V alloys have been widely used in implant materials such as dental and orthopedic implants due to their corrosion resistance, biocompatibility, and good mechanical properties. However, surface modification of titanium and titanium alloys is necessary to improve osseointegration between implant surface and bone. Especially, when titanium oxide nanotubes are formed on the surface of titanium alloy, cell adhesion is greatly improved. In addition, plasma electrolytic oxide (PEO) coatings have a good safety for osseointegration and can easily and quickly form coatings of uniform thickness with various pore sizes. Recently, the effects of bone element such as magnesium, zinc, strontium, silicon, and manganese for bone regeneration are researching in dental implant field. The purpose of this study was researched on the surface morphology of PEO-treated Ti-6Al-4V alloy after anodic titanium oxide treatmentusing various instruments. Ti-6Al-4V ELI disks were used as specimens for nanotube formation and PEO-treatment. The solution for the nanotube formation experiment was 1 M $H_3PO_4$ + 0.8 wt. % NaF electrolyte was used. The applied potential was 30V for 1 hours. The PEO treatment was performed after removing the nanotubes by ultrasonics for 10 minutes. The PEO treatment after removal of the nanotubes was carried out in the $Ca(CH_3)_2{\cdot}H_2O+(CH_3COO)_2Mg{\cdot}4H_2O+Mn(CH_3COO)_2{\cdot}4H_2O+Zn(CH_3CO_2)_2Zn{\cdot}2H_2O+Sr(CH_2COO)_2{\cdot}0.5H_2O+C_3H_7CaO_6P$ and $Na_2SiO_3{\cdot}9H_2O$ electrolytes. And the PEO-treatment time and potential were 3 minutes at 280V. The morphology changes of the coatings on Ti-6Al-4V alloy surface were observed using FE-SEM, EDS, XRD, AFM, and scratch tester. The morphology of PEO-treated surface in 5 ion coating solution after nanotube removal showed formation or nano-sized mesh and micro-sized pores.

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Improvement of Reliability by Using Fluorine Doped Tin Oxide Electrode for Ta2O5 Based Transparent Resistive Switching Memory Devices

  • Lee, Do Yeon;Baek, Soo Jung;Ryu, Sung Yeon;Choi, Byung Joon
    • Journal of Applied Reliability
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    • v.16 no.1
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    • pp.1-6
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    • 2016
  • Purpose: Fluorine doped tin oxide (FTO) bottom electrode for $Ta_2O_5$ based RRAM was studied to apply for transparent resistive switching memory devices owing to its superior transparency, good conductivity and chemical stability. Methods: $ITO/Ta_2O_5/FTO$ (ITF) and $ITO/Ta_2O_5/Pt$ (ITP) devices were fabricated on glass and Si substrate, respectively. UV-visible (UV-VIS) spectroscopy was used to examine transparency of the ITF device and its band gap energy was determined by conventional Tauc plot. Electrical properties, such as electroforming and voltage-induced RS characteristics were measured and compared. Results: The device with an FTO bottom electrode showed good transparency (>80%), low forming voltage (~-2.5V), and reliable bipolar RS behavior. Whereas, the one with Pt electrode showed both bipolar and unipolar RS behaviors unstably with large forming voltage (~-6.5V). Conclusion: Transparent and conducting FTO can successfully realize a transparent RRAM device. It is concluded that FTO electrode may form a stable interface with $Ta_2O_5$ switching layer and plays as oxygen ion reservoir to supply oxygen vacancies, which eventually facilitates a stable operation of RRAM device.

A study on the improvement of the contact of interface and the prevention of the charge recombination (투명전도성 막의 표면처리를 통한 계면 접촉 향상 및 재결합 방지 연구)

  • Seo, Hyun-Woong;Hong, Ji-Tae;Son, Min-Kyu;Kim, Jin-Kyoung;Shin, In-Young;Kim, Hee-Je
    • Proceedings of the KIEE Conference
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    • 2009.07a
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    • pp.1258_1259
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    • 2009
  • 염료감응형 태양전지 (dye-sensitized solar cell; DSC)는 경제성 한계에 달한 Si 태양전지를 대체할 수 있는 유력한 후보로서, 지금까지 많은 연구개발로 큰 효율향상을 기록했다. 다양한 연구 분야 중에서도, 투명전도성 막과 전해질 층간의 접촉으로 발생하는 전자의 재결합을 막기 위해 삽입하는 compact layer는 ZnO dip-coating, $TiCl_4$ dip-coating, Ti sputtering 등 다양한 제조방법이 제시되었다. 본 연구에서는 $TiCl_4$ 용액을 이용해 spin-coating 방법으로 $TiO_2$ compact layer를 제조하는 시도를 했다. 기존 dip-coating 방법과의 비교를 통해서 본 연구의 spin-coating 방법에 의한 효과를 확인한 결과, standard DSC 대비 33.4%, dip-coating 방법으로 compact layer를 삽입한 DSC 대비 6%의 효율 향상을 기록했다.

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The Shear Bond Strength of Resin to Electroforming Gold according to the Surface Treatment (표면처리방법에 따른 Electroforming Gold와 레진과의 전단결합강도)

  • You, Byung-Il;Chang, Mun-Suk;Yoon, Tae-Ho;Park, Ju-Mi;Park, Charn-Woon
    • Journal of Dental Rehabilitation and Applied Science
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    • v.22 no.2
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    • pp.125-136
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    • 2006
  • Statement of problem. The success of the bonding between electroforming gold and resin is dependent on the surface-conditioning technique but its effective technique has net been studied widely. Purpose. The purpose of the study was to evaluate the bond strength between the electroforming gold and resin with varying the surface-conditioning technique. Materials and methods. Sixty rectangular shaped metal specimens were made and one side of each specimen were gold hard plated. The sand-blasted specimens were divided into four experimental groups with fifteen specimens in each group and were treated as follows. Group 1: Silicoating (Rocatec, 3M ESPE)+ Sinfony (3M ESPE), Group 2: SR Link+ SR Adoro (Ivoclar Vivadent), Group 3: Tin plating (Microtin, Danville Engineering)+ SR Link+ SR Adoro, Group 4: Tin plating (Micro tin, Danville Engineering)+ Silicoating (Rocatec)+ Sinfony. Shear bond strength at metal-resin interface were measured using universal testing machine. Energy Dispersive x-ray analysis was done and scanning electron microscope images were taken and observed. Results and Conclusion. The following conclusions were drawn. 1. The mean shear bond strength values in order were 11.69MPa (Group 2), 22.35MPa (Group 3), 22.40MPa (Group 1) and 27.71MPa (Group 4). There was no significant difference in Group 1, Group 3 and Group 4(P>0.05). 2. In the EDX line analysis, the Au was detected on the surface of all specimen. $SnO_2$ showed on the surface of Group 2 and $SiO_2$ was detected on the surface of Group 1. 3. Increasing of roughness by sandblasting(Group 2), formation of micro-irregularities and tin crystals by electrolytic tin plating(Group 3) and formation of surface irregularities and $SiO_2$ layer(Group 1,4) were observed in SEM photo. 4. Tin plating(Group 3) and Rocatec treatment(Group 1) showed clinically effective shear bond strength(>20MPa), but when the two surface conditioning method were used together higher bond strength were achieved.

SHEAH BOND STRENGTH OF VENEERING CERAMIC TO ELECTROFORMED GOLD WITH THREE DIFFERENT SURFACE TREATMENT (표면처리방법에 따른 전기성형금속의 도재결합강도)

  • Kim Cheol;Lim Jang-Seop;Jeon Young-Chan;Jeong Chang-Mo;Jeong Hee-Chan
    • The Journal of Korean Academy of Prosthodontics
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    • v.43 no.5
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    • pp.599-610
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    • 2005
  • Purpose: The success of the bonding between electroformed gold and ceramic is dependent on the surface treatment of the pure gold coping. The purpose of this study was to evaluate the bonding strength between the electroformed gold and ceramic with varying surface treatment. Materials and methods: A total of 32 disks,8 were using conventional ceramometal alloy, 24 were using electroforming technique as recommended by manufacturer, were prepared. 24 electroformed disks were divided 3 groups according to surface treatment, i.e. 50 microns aluminium oxide sandblasting(GES-Sand), gold bonder treatment(GES-Bond) and $Rocatec^{TM}$ system(GES-Rocatec). For control group of conventional alloy 50 microns aluminium oxide treatment was done(V-Supragold). Energy dispersive x-ray analysis and scanning electron microscope image were observed. Using universal testing machine, shear bond strength and bonding failure mode at metal-porcelain interface were measured. Results and Conclusion: The following conclusions were drawn: 1. In the energy dispersive x-ray analysis, the Au was main component in electroformed gold(99.9wt%). After surface treatment, a little amount of $Al_2O_3(2.4wt%)$ were found in GES-Sand, and $SiO_2(4wt%)$ in GES-Bond. In GES-Rocatec, however, a large amount of $SiO_2(17.4wt%)$ were found. 2. In the scanning electron microscopy, similar pattern of surface irregu larities were observed in V-Supragold and GES-Sand. In GES-Bond, surface irregularities were increased and globular ceramic particles were observed. In GES-Rocatec, a large amount of silica particles attached to metal surface with increased surface irregularities were observed. 3. The mean shear bond strength values(MPa) in order were $22.9{\pm}3.7(V-Supragold),\;22.1{\pm}3.8(GES-Bond),\;20.1{\pm}2.8(GES-Rocatec)\;and\;13.0{\pm}1.4(GES-Sand)$. There was no significant difference between V-Supragold, GES-Bond, and GES-Rocatec. (P>0.05) 4. Most bonding failures modes were adhesive type in GES-Sand. However, in V-Supragold, GES-Bond and GES-Rocatec, cohesive and combination failures were commonly observed. From the result, with proper surface treatment method electroformed gold may have enough strength compare to conventional ceramometal alloy.

The study on characteristics and fabrications of ferroelectric $LiNbO_3$ thin films using RF sputtering (RF스퍼터링법을 이용한 강유전체 $LiNbO_3$ 박막의 제작과 특성연구)

  • Choi, Y.S.;Jung, S.M.;Choi, S.W.;Yi, J.
    • Proceedings of the KIEE Conference
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    • 1998.07d
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    • pp.1352-1354
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    • 1998
  • $LiNbO_3$ transistor showed relatively stable characteristic, low interface trap density, and large remanent polarization. This paper reports ferroelectric $LiNbO_3$ thin films grown directly on p-type Si(100) substrates by 13.56 MHz rf magnetron sputtering system for FRAM applications. To take advantage of low temperature requirement for growing films, we deposited $LiNbO_3$ films lower than $300 ^{\circ}C$. RTA(Rapid Thermal Anneal) treatment was performed for as-deposited films in an oxygen atmosphere at $600^{\circ}C$ for 60 sec. We learned from X-ray diffraction that the RTA annealed films were changed from amorphous to poly-crystalline $LiNbO_3$ which exhibited (012), (015), and (022) orientations. The I-V characteristics of $LiNbO_3$ films before and after anneal treatment showed that RTA improved the leakage current of films. The leakage current density of films decreased from $10^{-5}$ to $10^{-7} A/cm^2$ at room temperature measurement. Breakdown electric field of the films exhibited higher than 500 kV/cm. The C-V curves showed the clockwise hysteresis represents ferroelectric switching characteristics. From C-V curves, we calculated dielectric constant of thin film $LiNbO_3$ as 27.5 which is close to that of bulk value.

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Optical Probing of Electronic Interaction between Graphene and Hexagonal Boron Nitride (hBN)

  • Ahn, Gwanghyun;Kim, Hye Ri;Ko, Taeg Yeoung;Choi, Kyoungjun;Watanabe, Kenji;Taniguchi, Takashi;Hong, Byung Hee;Ryu, Sunmin
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.213-213
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    • 2013
  • Even weak van der Waals (vdW) adhesion between two-dimensional solids may perturbtheir various materials properties owing to their low dimensionality. Although the electronic structure of graphene has been predicted to be modified by the vdW interaction with other materials, its optical characterization has not been successful. In this report, we demonstrate that Raman spectroscopy can be utilized to detect a few % decrease in the Fermi velocity ($v_F$) of graphene caused by the vdW interaction with underlying hexagonal boron nitride (hBN). Our study also establishes Raman spectroscopic analysis which enables separation of the effects by the vdW interaction from those by mechanical strain or extra charge carriers. The analysis reveals that spectral features of graphene on hBN are mainly affected by change in vF and mechanical strain, but not by charge doping unlike graphene supported on $SiO_2$ substrates. Graphene on hBN was also found to be less susceptible to thermally induced hole doping.

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Interface Functional Materials for Improving the Performance and Stability of Organic Solar Cell (유기태양전지의 효율 및 수명 향상을 위한 기능성 계면 소재 연구)

  • Hong, Kihyon;Park, Sun-Young;Lim, Dong Chan
    • Applied Chemistry for Engineering
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    • v.25 no.5
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    • pp.447-454
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    • 2014
  • Organic solar cells (OSCs) have intensively studied in recent years due to their advantages such as cost effectiveness and possibility of applications in flexible devices. In spite of the high power conversion efficiency (PCE) of 10 %, the OSCs still have a draw back of their low environmental stability due to the oxidization of aluminum cathode and etching of transparent conducting oxide as electrode. To solve these problems, the inverted structured OSCs (I-OSCs) having greatest potential for achieving an improvement of device performances are suggested. Therefore, there are a lot of studies to develope of interface layer based on organic/inorganic materials for the electron transport layer (ETL) and passivation layer, significant advancements in I-OSCs have driven the development of interface functional materials including electron transport layer. Recent efforts to employing 2D/3D zinc oxide (ZnO) based ETL into I-OSCs have produced OSCs with a power conversion efficiency level that matches the efficiency of ~9 %. In this review, the technical issues and recent progress of ZnO based ETL in I-OSCs to enhancement of device efficiency and stability in terms of materials, process and characterization have summarized.

Effects of Iron, Silicon and Zinc Contained in Molten Aluminum on Aluminizing of Cast Iron (주철 소지상에 용융알루미늄 도금시 철 규소 및 아연의 영향)

  • Choi, Chong-Sool;Moon, Sung-Wuck
    • Journal of the Korean institute of surface engineering
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    • v.20 no.4
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    • pp.144-153
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    • 1987
  • In the case of dipping the Ni-Resist cast iron into molten aluminum with iron content, the thickness of intermetallic compound was remarkably increased with increasing iron content. The thickness was shown by following equation in the range of 1-3% iron content; $x=22.5t^{1/2}+4.47{\cdot}t{\cdot}(Fe%)$. where, x is thickness(${\mu}m$), t the time (minute), Fe% the iron w/o. When the Ni-Resist cast iron was dipped into the molten aluminum containing zinc content, the intermetallic compound thickness was also increased with increasing zinc contents. And thickness was represented by the following equation in the range of 2-10% zinc content; $x=3.46t^{1/2}+0.27{\cdot}t{\cdot}(Zn%)$. However, in the case of dipping the Ni-resist cast iron into molten aluminum with silicon content, the thickness of intermetallic compound was decreased with increasing silicon content, as shown in the following equation; $x=7.17t^{1/2}-0.15{\cdot}t{\cdot}(Si%)$. The intermetallic compound formed onto Ni-Resist cast iron was identified to be $FeAl_3\;and\;Fe_3Al$. As the result of hardness measurement, the peak hardness appeared in the intermetallic compound at near interface of the cast iron and the compound.

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