• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2008.06a
• /
• pp.15-15
• /
• 2008

산화물 반도체가 실리콘 기반의 기술을 대체할 새로운 기술로써 주목을 받기 시작하면서, 산화아연을 이용한 박막트랜지스터가 많은 주목을 받고 있다. 여기에 기존의 $SiO_2$를 대체할 새로운 High-k Material에 대한 연구 또한 진행되고 있는데, 이들의 가장 큰 문제점중 하나는 Interface Charge Trap이며, 그에 따른 결과로 히스테리시스 특성이 나타나게 되고, 이는 소자의 신뢰성에 큰 걸림돌이 되고 있다. 이번 연구에서는, High-k Material들 중의 하나인, $HfO_2$를 게이트 절연막으로 사용함에 있어서 Interface Charge Trap이 발생하는 문제를 해결하고자 하며, Low-k Material중에서 비교적 높은 유전상수를 갖는 $Al_2O_3$를 Buffer Layer로써 사용하여, 히스테리시스 특성을 향상 시켰다.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.48 no.6
• /
• pp.410-415
• /
• 1999

$Ba_{1-x}Sr_xTiO_3$ thin films with various ratio of Sr (X = 0.4, 0.5, 0.6) were grown $Pt/TiN/SiO_2/Si$ subastrate by RF magnetron sputtering deposition. As, Ag, and Cu films were deposited on $Ba_{1-x}Sr_xTiO_3$ thin films as top electrodes by using a thermal evaporator. The electrical properties of $Ba_{1-x}Sr_xTiO_3$ thin films for various compositions were characterized and the physical properties at interface between $Ba_{1-x}Sr_xTiO_3$ thin films and top electrodes were evaluated in terms of the work function difference. At x =0.5, the degradation of capacitance is lower to the other compositions. As negative biasapplied, the specimen with Cu top electrode has board saturation region and low leakage current since work function of Cu is bigger than other electrodes.$ Ba_{0.5}Sr_{0.5}TiO_3$ thin films with Cu top electrode, the dielectric constant was measured to the value of 354 at 1 kHz and the leakage current was obtained to the value of $5.26\times10^{-6}A/cm2$ at the forward bias of 2 V.

• Journal of Adhesion and Interface
• /
• v.20 no.4
• /
• pp.155-161
• /
• 2019

Understanding charge transport anisotropy at the interface of conjugated nanostructures basically gives insight into structure-property relationship in organic field-effect transistors (OFET). Here, the anisotropy of the field-effect mobility at the interface between 6,13-bis(triisopropylsilylethynyl) pentacene (TIPS-pentacene) single crystal with cofacial molecular stacks in a-b basal plane and SiO gate dielectric was investigated. A solvent exchange method has been used in order for TIPS-pentacene single crystals to be grown on the surface of SiO₂ thin film, corresponding to the charge accumulation at the interface in OFET structure. In TIPS-pentacene OFET, the anisotropy ratio between the highest and lowest measured mobility is revealed to be 5.2. By analyzing the interaction of a conjugated unit in TIPS-pentacene with the nearest neighbor units, the mobility anisotropy can be rationalized by differences in HOMO-level coupling and hopping routes of charge carriers. The theoretical estimation of anisotropy based on HOMO-level coupling is also consistent with the experimental result.

• Journal of Korea Foundry Society
• /
• v.11 no.4
• /
• pp.293-302
• /
• 1991

Aluminum alloy matrix composites reinforced with various amounts of $Al_2O_3$ short fibers have been produced by a combined technique of rheo-compocasting and hot extrusion. Distribution of fibers in the composites fabricated by rheo-compocasting was relatively uniform. A good degree of uniaxial fiber alignment has been achieved by hot extrusion, but a lot of fibers fractured during extrusion. The tendency of fiber fracturing increases as the aspect ratio and the amount of fibers increase. Relatively good bonding between fiber and matrix was obtained by the formation of $MgAl_2O_4$ and Mg(Al, Fe)$_2O_4$ at the interface between fiber and matrix. In extruded composites, fiber-strengthening effect was relatively small since a lot of fibers fractured during hot extrusion. On the other hand, dispersion strengthening effect may increase. In order to improve the fiber strengthening effect, it is important to optimize the extrusion condition with consideration of metal flow in extrusion die.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1998.11a
• /
• pp.9-12
• /
• 1998

Film characteristics of thin reoxidized nitrided oxides were investigated by SIMS analysis and C-V method in order to use the gate dielectric for charge-trap type NVSMs instead of ONO stacked layers. Nitric oxide(NO) annealed film has the nitrogen content sharply peaked at the Si-SiO$_2$ interface, while it is broad for nitrous oxide($N_2$O) ambient. The nitrogen peak concentration increased with anneal temperature and time. The position of nitrogen content in the oxide layer was due to be precisely controlled. For the films annealed NO ambient at 80$0^{\circ}C$ for 30min. followed by reoxidized at 85$0^{\circ}C$, the maximum memory window of 3.5V was obtained and the program condition was +12V, 1msec for write and -l3V, 1msec for erase.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.21 no.8
• /
• pp.687-694
• /
• 2008

This paper is focused on the improvement of MOS device reliability related to deuterium process. The injection of deuterium into the gate oxide film was achieved through two kind of method, high-pressure annealing and low-energy implantation at the back-end of line, for the purpose of the passivation of dangling bonds at $SiO_2/Si$ interface. Experimental results are presented for the degradation of 3-nm-thick gate oxide ($SiO_2$) under both negative-bias temperature instability (NBTI) and hot-carrier injection (HCI) stresses using P and NMOSFETs. Annealing process was rather difficult to control the concentration of deuterium. Because when the concentration of deuterium is redundant in gate oxide excess traps are generated and degrades the performance, we found annealing process did not show the improved characteristics in device reliability, compared to conventional process. However, deuterium ion implantation at the back-end process was effective method for the fabrication of the deuterated gate oxide. Device parameter variations under the electrical stresses depend on the deuterium concentration and are improved by low-energy deuterium implantation, compared to conventional process. Our result suggests the novel method to incorporate deuterium in the MOS structure for the reliability.

• Journal of Nuclear Fuel Cycle and Waste Technology(JNFCWT)
• /
• v.3 no.3
• /
• pp.177-181
• /
• 2005

Yellowish uranium compounds were enriched at the interface between a Ca-bentonite block and a waste glass, containing about $20\%$ uranium oxide, in contact with the block due to the dissolution of uranium by a synthetic granitic groundwater in Ar atmosphere. The uranium compound formed for 6 years leach time was identified as a beta-uranophane $[Ca(UO_2)_2(SiO_{3}OH)_{2}5H_{2}O]$ using XRD, IR and mass spectrometer. The solubility of the beta-uranophane was measured to be about $10^{-6}\;mole/L$ in de-mineralized water at $80^{\circ}C$.

• Electrical & Electronic Materials
• /
• v.16 no.9
• /
• pp.63.1-63
• /
• 2003

Catalytic chemical vapor deposition (Cat-CVD) has been developed to deposit alumina(Al$_2$O$_3$) thin films on silicon (Si) crystal using N$_2$ bubbled tir-methyl aluminium [Al(CH$_3$)$_3$, TMA] and molecular oxygen (O$_2$) as source species and tungsten wires as a catalyzer. The catalyzer dissociated TMA at approximately 600$^{\circ}C$ The maximum deposition rate was 18 nm/min at a catalyzer temperature of 1000 and substrate temperature of 800$^{\circ}C$. Metal oxide semiconductor (MOS) diodes were fabricated using gates composed of 32.5-nm-thick alumina film deposited as a substrate temperature of 400oC. The capacitance measurements resulted in a relatively dielectric constant of 7, 4, fixed charge density of 1.74*10e12/$\textrm{cm}^2$, small hysteresis voltage of 0.12V, and very few interface trapping charge. The leakage current was 5.01*10e-7 A/$\textrm{cm}^2$ at a gate bias of 1V.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1998.06a
• /
• pp.235-238
• /
• 1998

Ferroelectric $LiNbO_3$ thin films were grown directly on Si(100) substrates by 13.55MHz RF magnetron sputtering system using a ceramic target ($Nb_2O_5/Li_2C0_3$ = 51.4/48.6). Because high temperature process have to avoided to prevent degradation of the interface (insulator/Si), $LiNbO_3$ thin films were deposited below $300^{\circ}C$. After as-deposited films were performed RTA treatments in an oxygen ambient at $600^{\circ}C$ for 60s, electrical measurements performed films before and after anneal treatment. In high field region, the leakage current density of the films after annealing was deceased about 4order and the resistivity of these was increased to about 5\times 10^{11} \Omega \cdot cm$ at 500kV/cm. In accumulation region of C-V curve, we calculated dielectric constant of thin film $LiNbO_3$ as 27.9 which is close to that of bulk value.

• Korean Journal of Materials Research
• /
• v.9 no.11
• /
• pp.1129-1136
• /
• 1999

TIN films were prepared on Si(100) substrate by ICP-CVD(inductive1y coupled plasma enhanced chemical vapor deposition) using TEMAT(tetrakis ethylmethamido titanium : Ti$[\textrm{N}\textrm{(CH)}_{3}\textrm{C}_{2}\textrm{H}_{5}]_{4}$) precursor at various deposition conditions. Phase, microstructure, and the electrical properties of TIN films were characterized by x-ray diffraction (XRD), x-ray photoelectron spectroscopy (XPS), high resolution transmission electron microscopy (HRTEM) and electrical measurements. Polycrystalline TiN films with B1 structure were grown at temperatures over $200^{\circ}C$. Preferentially oriented along TiN(111) films were obtained at temperatures over $300^{\circ}C$ with the flow rates of 10, 5, and 5 sccm for TEMAT, $\textrm{N}_{2}$ and Ar gas. The TiN/Si(100) interface was flat and no chemical reaction between TIN and $\textrm{SiO}_2$ was found. The resistivity, carrier concentration and the carrier mobility for the TiN sample prepared at $500^{\circ}C$ are 21 $\mu\Omega$cm, 9.5$\times\textrm{10}^{18}\textrm{cm}^{-3}$ and $462.6\textrm{cm}^{2}$/Vs, respectively.