• Title/Summary/Keyword: $SiO_2$Microstructure

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Crack Path Behavior of SiC Based Tools for Spectacle Lens Cutting (렌즈절삭용 탄화규소계 공구의 크랙전파 거동)

  • Lee, Young-Il
    • Journal of Korean Ophthalmic Optics Society
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    • v.11 no.2
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    • pp.85-89
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    • 2006
  • To research of the improved mechanical properties of materials for spectacle lens cutting, SiC and TiC were used as the main powder. Also, $Al_2O_3$ and $Y_2O_3$ was included as a sintering additive. The weight ratio of the alumina($Al_2O_3$) to yttria($Y_2O_3$) was set to 1:1. The materials for spectacle lens cutting were fabricated by hot-pressing at $1810^{\circ}C$ for 1h and subsequently annealed at $1860^{\circ}C$ for 3, 6 and 12h to initiated grain growth. The longer annealing time is, the bigger the grain size is. The microstructures were observed by scanning electron microscopy (SEM). The SEM images were quantitatively analyzed by image analysis (Image-Pro Plus, Media Cybernetics, Maryland, U.S.A.). Crack deflection by elongated SiC grains was most frequently observed as the dominant toughening mechanism. Crack deflection was generally observed for elongated SiC grains with aspect ratio(AR) > 2.5 and grain thickness < $2.3{\mu}m$. Crack bridging was also observed as one of the operating toughness mechanism.

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Structural and Electrical Properties of BiFeO3 Thin Films by Eu and V Co-Doping (Eu와 V 동시 도핑에 의한 BiFeO3 박막의 구조와 전기적 특성)

  • Chang, Sung-Keun;Kim, Youn-Jang
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.32 no.3
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    • pp.229-233
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    • 2019
  • Pure $BiFeO_3$ (BFO) and (Eu, V) co-doped $Bi_{0.9}Eu_{0.1}Fe_{0.975}V_{0.025}O_{3+{\delta}}$ (BEFVO) thin films were deposited on $Pt(111)/Ti/SiO_2/Si(100)$ substrates by chemical solution deposition. The effects of co-doping were observed by X-ray diffraction, Raman spectroscopy, and scanning electron microscopy (SEM). The electrical properties of the BEFVO thin film were improved as compared to those of the pure BFO thin film. The remnant polarization ($2P_r$) of the BEFVO thin film was approximately $26{\mu}C/cm^2$ at a maximum electric field of 1,190 kV/cm with a frequency of 1 kHz. The leakage current density of the co-doped BEFVO thin film ($4.81{\times}10^{-5}A/cm^2$ at 100 kV/cm) was two orders of magnitude lower than of that of the pure BFO thin film.

Microstructure and Dielectric Properties of SCT Thin Film with Annealing Temperature (열처리 온도에 따른 SCT 박막의 미세구조 및 유전특성)

  • 김진사;조춘남;신철기;박건호;최운식;이성일;이준웅
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.11a
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    • pp.244-247
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    • 1999
  • The(Sr$\sub$0.85/Ca$\sub$0.15/) TiO$_3$(SCT) thin films are deposited on Pt-coated electrode(Pt/TiN/SiO$_2$/Si) using RF sputtering method. The composition of SCT thin films deposited on Si substrate at room temperature is close to stoichiometry(1.102 in A/B ratio). Also, SCT thin films deposited on Pt-coated electrodes have the cubic perovskite structure and polycrystalline state. The maximum dielectric constant of SCT thin films is obtained by annealing at 600[$^{\circ}C$].The dielectric constant changes almost linearly in temperature ranges of -80~+90[$^{\circ}C$].

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Integration of Ba0.5Sr0.5TiO3Epitaxial Thin Films on Si Substrates and their Dielectric Properties (Si기판 위에 Ba0.5Sr0.5TiO3 산화물 에피 박막의 집적화 및 박막의 유전 특성에 관한 연구)

  • Kim, Eun-Mi;Moon, Jong-Ha;Lee, Won-Jae;Kim, Jin-Hyeok
    • Journal of the Korean Ceramic Society
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    • v.43 no.6 s.289
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    • pp.362-368
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    • 2006
  • Epitaxial $Ba_{0.5}Sr_{0.5}TiO_3$ (BSTO) thin films have been grown on TiN buffered Si (001) substrates by Pulsed Laser Deposition (PLD) method and the effects of substrate temperature and oxygen partial pressure during the deposition on their dielectric properties and crystallinity were investigated. The crystal orientation, epitaxy nature, and microstructure of oxide thin films were investigated using X-Ray Diffraction (XRD) and Transmission Electron Microscopy (TEM). Thin films were prepared with laser fluence of $4.2\;J/cm^2\;and\;3\;J/cm^2$, repetition rate of 8 Hz and 10 Hz, substrate temperatures of $700^{\circ}C$ and ranging from $350^{\circ}C\;to\;700^{\circ}C$ for TiN and oxide respectively. BSTO thin-films were grown on TiN-buffered Si substrates at various oxygen partial pressure ranging from $1{\times}10^{-4}$ torr to $1{\times}10^{-5}$ torr. The TiN buffer layer and BSTO thin films were grown with cube-on-cube epitaxial orientation relationship of $[110](001)_{BSTO}{\parallel}[110](001)_{TiN}{\parallel}[110](001)_{Si}$. The crystallinity of BSTO thin films was improved with increasing substrate temperature. C-axis lattice parameters of BSTO thin films, calculated from XRD ${\theta}-2{\theta}$ scans, decreased from 0.408 m to 0.404 nm and the dielectric constants of BSTO epitaxial thin films increased from 440 to 938 with increasing processing oxygen partial pressure.

Fabrication of Nd-Substituted Bi4Ti3O12 Thin Films by Metal Organic Chemical Vapor Deposition and Their Ferroelectrical Characterization

  • Kim, Hyoeng-Ki;Kang, Dong-Kyun;Kim, Byong-Ho
    • Journal of the Korean Ceramic Society
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    • v.42 no.4
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    • pp.219-223
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    • 2005
  • A promising capacitor, which has conformable step coverage and good uniformity of thickness and composition, is needed to manufacture high-density non-volatile FeRAM capacitors with a stacked cell structure. In this study, ferroelectric $Bi_{3.61}Nd_{0.39}Ti_3O_{12}$ (BNdT) thin films were prepared on $Pt(111)/TiO_2/SiO_2/Si$ substrates by the liquid delivery system MOCVD method. In these experiments, $Bi(ph)_{3}$, $Nd(TMHD)\_{3}$ and $Ti(O^iPr)_{2}(TMHD)_{2}$ were used as the precursors and were dissolved in n-butyl acetate. The BNdT thin films were deposited at a substrate temperature and reactor pressure of approximately $600^{\circ}C$ and 4.8 Torr, respectively. The microstructure of the layered perovskite phase was observed by XRD and SEM. The remanent polarization value (2Pr) of the BNdT thin film was $31.67\;{\mu}C/cm^{2}$ at an applied voltage of 5 V.

Solution-Processed Indium Oxide Transistors

  • Facchetti, Antonio;Kim, Hyun-Sung;Byrne, Paul D.;Marks, Tobin J.
    • 한국정보디스플레이학회:학술대회논문집
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    • 2009.10a
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    • pp.995-997
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    • 2009
  • $In_2O_3$ thin-film transistors (TFTs) were fabricated on various dielectrics [$SiO_2$ and self-assembled nanodielectrics (SANDs)] by spin-coating a $In_2O_3$ film precursor solution consisting of methoxyethanol (solvent), ethanolamine (EAA, base), and $InCl_3$ as the $In^{3+}$ source. Importantly, an optimized film microstructure characterized by the high-mobility $In_2O_3$ 004 phase, is obtained only within a well-defined base: $In^{3+}$ molar ratio. The greatest electron mobilities of ~ 44 $cm^2$, for EAA:$In^{3+}$ molar ratio = 10, $V^{-1}s^{-1}$, is measured for $n^+$-Si/SAND/$In_2O_3$/Au devices. This result combined with the high $I_{on}:I_{off}$ ratios of ~ $10^6$ and very low operating voltages (< 5 V) is encouraging for high-speed applications.

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Property and formation behavior of TiAlSiWN nanocomposite coating layer by the AIP process (AIP 공정 적용 TiAlSiWN 나노 복합체 코팅층의 형성 거동 및 특성 평가)

  • Lee, Jeong-Han;Park, Hyeon-Guk;Jang, Jun-Ho;Hong, Seong-Gil;O, Ik-Hyeon
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2018.06a
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    • pp.97.2-97.2
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    • 2018
  • This study formed a hard TiAlSiWN coating layer using Ti, Al, Si and W raw powders that were mechanically alloyed and refined. The TiAlSi and TiAlSiW coating targets were fabricated using a single PCAS process in a short time with the optimal sintering conditions. The coating targets were deposited on the WC substrate by forming coating layers using TiAlSiN and TiAlSiWN nitride nano-composite structures with an AIP process. The properties of the nitride nano-composite coating layers were compared according to the addition of W. The microstructure of the nitride nano-composite coating layer was analyzed, focusing on the distribution of the crystalline phases, amorphous phases ($Si_3N_4$), and growth orientation of the columnar crystal depending on the addition of W. The mechanical properties of the coating layers were exhibited a hardness of approximately $3,000kg/mm^2$ and adhesion of about 117.77N in the TiAlSiN. In particular, the TiAlSiWN showed excellent properties with a hardness of more than $4,300kg/mm^2$ and an adhesion of about 181.47N.

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The Influence of Sintering Atmosphere on the Reduction Behaviour of Refractory Bricks and the Basic Properties of $UO_{2}$ Pellet

  • Lee, Seung-Jae;Kim, Kyu-Tae;Chung, Bum-Jin
    • The Korean Journal of Ceramics
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    • v.4 no.4
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    • pp.279-285
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    • 1998
  • The $UO_2$ pellets are usually sintered under hydrogen gas atmosphere. Hydrogen gas may cause unexpected early failure of the refractory bricks in the sintering furnace. In this work, nitrogen was mixed with hydrogen to investigate the effect of nitrogen gas on a failure machanism of the refractory bricks and on the microstructure of the $UO_2$ pellet. The hydrogen-nitrogen mixed gas experiments show that the larger nitrogen the mixed gas contains, the less the refractory materials are reduced by hydrogen. The weight loss measurements at $1400^{\circ}C$ for fire clay and chamotte refractories containing high content of $SiO_2$ indicate that the weight loss rate for the mixed gas is about half of that for the hydrogen gas. Based on the thermochemical analyses, it is proposed that the weight loss is caused by hydrogen-induced reduction of free $SiO_2$ and/or $SiO_2$ bonded to $Al_2O_3$ in the fire clay and chamotte refractories. However, the retardation of the hydrogen-induced $SiO_2$ reduction rate under the mixed gas atmosphere may be due to the reduction of the surface reaction rate between hydrogen gas and refractory materials in proportion to volume fraction of nitrogen gas in the mixed gas. On the other hand, the mixed gas experiments show that the test data for $UO_2$ pellet still meet the related specification values, even if there exists a slight difference in the pellet microstructural parameters between the cases of the mixed gas and the hydrogen gas.

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A Study on the Preparation and Dielectric Properties of the PLZT Thin Films. (PLZT박막의 제조 및 유전 특성에 관한 연구)

  • 박준열;박인길;이성갑;이영희
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1995.05a
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    • pp.187-191
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    • 1995
  • Thin film of the (Pb$\_$1-x/La.sub x/)(Zr$\_$0.25/Ti/Sub 0.48/) O$_3$(x=0~13[at%]) were prepared by Sol - Gel method. Multi-layer PLZT thin films were fabricated by spin-coating on Pt/Ti/SiO$_2$/Si substrate. The crystallinity and microstructure of the films were investigated with the sintering condition. At the sintering temperature of of 600[$^{\circ}C$], the perovskite phase was dominat. PLZT(11/52/48)thin films sintered at 600[$^{\circ}C$], 1[hr] had good dielectric constant (1236), dielectric loss (2.2[%]), remanent polarization (1.38[${\mu}$C/$\textrm{cm}^2$] and coercive field(16.86[ kV/cm]) respectively.

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Poling-dependent Ferroelectric Properties of SBN30 Thin Films (분극에 의한 SBN30 박막의 강유전특성 변화)

  • Jang, Jae-Hoon;Lee, Dong-Gun;Lee, He-Young
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.11a
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    • pp.309-312
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    • 2002
  • Ferroelectric $Sr_{0.3}Ba_{0.7}Nb_{2}O_{6}$ (SBN30) thin films were deposited on Pt/Ti/$SiO_{2}$/Si(100) substrates by ion beam sputtering. During annealing treatment at $750^{\circ}C$, poling was attempted by applying dc voltage bias across polished surfaces. Phase relation, microstructure and crystallization behavior were examined using XRD and FE-SEM. Ferroelectric hysteresis characteristics were also determined where both remanent polarization and coercive values decreased with the increase of bias voltage. The measured remanent polarization and coercive field values at 5 V and 10 V bias were $36{\mu}C/cm^2$, $10{\mu}C/cm^2$ and 100kV /cm, 80kV /cm, respectively.

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