• 제목/요약/키워드: $SO_2$ deposition

검색결과 569건 처리시간 0.035초

Low Temperature PECVD for SiOx Thin Film Encapsulation

  • Ahn, Hyung June;Yong, Sang Heon;Kim, Sun Jung;Lee, Changmin;Chae, Heeyeop
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.198.1-198.1
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    • 2016
  • Organic light-emitting diode (OLED) displays have promising potential to replace liquid crystal displays (LCDs) due to their advantages of low power consumption, fast response time, broad viewing angle and flexibility. Organic light emitting materials are vulnerable to moisture and oxygen, so inorganic thin films are required for barrier substrates and encapsulations.[1-2]. In this work, the silicon-based inorganic thin films are deposited on plastic substrates by plasma-enhanced chemical vapor deposition (PECVD) at low temperature. It is necessary to deposit thin film at low temperature. Because the heat gives damage to flexible plastic substrates. As one of the transparent diffusion barrier materials, silicon oxides have been investigated. $SiO_x$ have less toxic, so it is one of the more widely examined materials as a diffusion barrier in addition to the dielectric materials in solid-state electronics [3-4]. The $SiO_x$ thin films are deposited by a PECVD process in low temperature below $100^{\circ}C$. Water vapor transmission rate (WVTR) was determined by a calcium resistance test, and the rate less than $10.^{-2}g/m^2{\cdot}day$ was achieved. And then, flexibility of the film was also evaluated.

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용융탄산염형 연료전지의 전해질 매트릭스에 관한 연구 (Cold Rolling Process for the Matrix Fabrication of the Mcfc)

  • 박상길;노창주
    • 수산해양기술연구
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    • 제27권2호
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    • pp.125-131
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    • 1991
  • Electrolyte matrix fabrication process can be classifed as hot pressing, tape casting, callendering, electrophoretic deposition. however, these have limits in practice. Hot pressing is cumbersome method, because of careful heating and cooling. Furthermore, the perfected tile is so fragile that it is difficult to fit in a cell. Therefore this method is not adequate for mass production of the electrolyte matrix. Using electrophoretic deposition method, a very thin matrix can be made, but many attempts of the electrolyte embeding were found to be failure. Tape casting and callendering methods are employed in most of the matrix fabrication for the present. But these methods require lots of water as a solvent, so that coating of the LiAlO sub(2) with electrolyte is difficult. Recently, hot roll milling method has been developed and the perfected matrix was proved to be free from crack. The method, however, needs a roller to make a matrix and a perfected matrix is carefully striped off from the cooled roller. Therefore, this method requires a long time due to the cooling process. The author proposes a cold rolling process. On this method, heated slurry of the LiAlO sub(2) mixed with binder, is rolled with a cold roller. The heated slurry dose not adhere to the roller, since contacted hot slurry is rapidly solidified. Therefore fabrication speed is increased, without getting rid of merits of the hot rolling process.

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Chemical Bath Deposition법에 의해 제조된 CdS 박막의 특성

  • 공선미;소우빈;김은호;정지원
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2009년도 제38회 동계학술대회 초록집
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    • pp.294-294
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    • 2010
  • CdS는 $CuInSe_2$계, CdTe계 이종접합 태양전지의 junction partner로 많이 이용되어 왔다. CdS는 전극으로 쓰일 뿐만 아니라 빛을 투과시키는 창문층으로 사용되어 높은 변환 효율을 나타낸다. 이종접합 태양전지에서 창문층은 가시광 영역에서 광투과율이 높고, 전기적으로 비저항이 낮아야 에너지 손실 없이 태양광을 광흡수층까지 투과시킬 수 있다. CdS 박막은 CBD법(solution growth technique), 진공증착법(vacuum evaporation), 스퍼터법(sputtering), 스프레이 열분해법(spray pyrolysis), 전착법(electrodeposition)에 의해 제조되고, 그 중 용액성장법(solution growth technique)이라고도 불리는 CBD법(chemical bath deposition)을 이용하여 CdS 박막을 제조하였다. CBD법은 다른 방법에 비해 제조 과정이 비교적 간단할 뿐만 아니라 제조 단가가 저렴하고, 넓은 면적의 박막 제조가 가능하며 재현성도 우수하다는 장점이 있다. CdS 박막을 제조하기 위한 cadmuim 이온공급원으로는 $CdSO_4$를 사용하였고 sulfur 이온공급원으로는 $SC(NH_2)_2$를 사용하였다. CBD법에서 박막의 물성에 영향을 미칠 수 있는 요인인 sulfur 이온공급원과 cadmium 이온공급원의 비, 용액의 온도, pH를 변화시켜 CdS 박막을 제조하였다. 각각의 조건에 의해 제조된 CdS의 박막의 두께는 Tencor P-1을 이용하여 측정되었고, UV-Visible spectrometer를 이용하여 파장에 따른 광투과율을 측정하였다. CdS 박막의 결정 구조를 조사하기 위해 X선 회절분석(XRD ; X-ray diffraction)을 하였고, AFM(Atomic Force Microscope)으로 표면 특성을 관찰하였다.

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화학습식공정을 이용한 CIGS 태양전지용 Cd-free 버퍼층 박막 제조 및 특성 분석 (Preparation and Characterization of Cd-Free Buffer Layer for CIGS by Chemical Bath Deposition)

  • 황대규;전동환;성시준;김대환;이동하;강진규
    • 한국태양에너지학회:학술대회논문집
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    • 한국태양에너지학회 2012년도 춘계학술발표대회 논문집
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    • pp.146-148
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    • 2012
  • In our study, we have focused on optimizing good quality of ZnS buffer layer by chemical bath deposition (CBD) from a bath containing $ZnSO_4$, Thiourea and Ammonia in aqueous solution onto CIGS solar cells. The influence of deposition parameter such as pH, deposition temperature, stirring speed played a very important role on transmission, homogeneity, crystalline of ZnS buffer layer. The transmission spectrum showed a good transmission characteristic above 80% invisible spectral region. CIGS thin flim solar cell with ZnS buffer layer has been realized with the efficiency of 14.2%.

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Susceptor design by numerical analysis in horizontal CVD reactor

  • Lee, Jung-Hun;Yoo, Jin-Bok;Bae, So-Ik
    • 한국결정성장학회지
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    • 제15권4호
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    • pp.135-140
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    • 2005
  • Thermal-fluid analysis was performed to understand the thermal behavior in the horizontal CVD reactor thereby to design a susceptor which has a uniform deposition rate during silicon EPI growing. Four different types of susceptor designs, standard (no hole susceptor), hole $\sharp$1 (240 mm), hole $\sharp$2 (150 mm) and hole $\sharp$3 (60 mm), were simulated by CFD (Computational Fluid Dynamics) tool. Temperature, gas flow, deposition rate and growth rate were calculated and analyzed. The degree of flatness of EPI wafer loaded on the susceptor was computed in terms of silicon growth rate. The simulation results show that the temperature and thermal distribution in the wafer are greatly dependent on inner diameter of hole susceptor and demonstrate that the introduction of hole in the susceptor can degrade wafer flatness. Maximum temperature difference appeared around holes. As the diameter of the hole decreases, flatness of the wafer becomes poor. Among the threes types of susceptors with the hole, optimal design which resulted a good uniform flatness ($5\%$) was obtained when using hole $\sharp$1.

Photoelectrochemical Deposition of CdZnSe Thin Films on the Se-Modified Au Electrode

  • Ham, Sun-Young;Jeon, So-Yeon;Lee, Ungki;Paeng, Ki-Jung;Myung, No-Seung
    • Bulletin of the Korean Chemical Society
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    • 제29권5호
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    • pp.939-942
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    • 2008
  • Photoelectrochemical deposition of CdZnSe thin films on the Se-modified Au electrode using electrochemical quartz crystal microgravimetry (EQCM) and voltammetry is described. Corrosion of pre-deposited Se electrodes by illumination at a fixed potential resulted in $Se^{2-}$ species, which was manifest from the EQCM frequency changes. $Se^{2-}$ species generated from the photocorrosion reacted with $Cd^{2+}$ and $Zn^{2+}$ ions in the electrolyte to form CdZnSe films on the Au electrode. The effect of electrolyte composition on the composition and band gap of CdZnSe films was studied in detail. Also, photoelectrochemistry, EDX, Raman spectroscopy were used for the characterization of CdZnSe thin films.

Heterogeneous Catalysts Fabricated by Atomic Layer Deposition

  • Kim, Young Dok
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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    • pp.128-128
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    • 2013
  • Fabrication of heterogeneous catalysts using Atomic Layer Deposition (ALD) has recently been attracting attention of surface chemists and physicists. In this talk, I will present recent results about structures and chemical activities of various catalysts prepared by ALD, particularly focusing on Ni-based catalysts. Ni has been considered as potential catalysts for $CO_2$ reforming of methane (CRM); however, Ni often undergoes rapid decrease in catalytic activity with time, and therefore, application of Ni as catalysts for CRM has been regarded as difficult so far. Deactivation of Ni catalysts during CRM reaction is from either coke formation on Ni surface or sintering of Ni particles during reaction. Two different strategies have been used for enhancing stability of Ni-based catalysts; $TiO_2$ nanoparticles were deposited on micrometer-size Ni particles by ALD, which turned out to reduce coke formation on Ni surfaces. Ni nanoparticles deposited by ALD on mesoporous silica showed high activity and long-term stability from CRM without coke deposition and sintering during CRM reaction. Ni-based catalysts have been also used for oxidation of toluene, which is one of the most notorious gases responsible for sick-building syndrome. It was shown that onset-temperature of Ni catalysts for toluene oxidation is as low as $120^{\circ}C$. At $250\circ}C$, total oxidation of toluene to $CO_2$ with a 100% conversion was found.

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furnace 열처리와 질소 플라즈마 처리에 의한 유기화학증착법을 이용한 선택적 구리 증착 (Selective Cu-MOCVD by Furnace Annealing and N$_{2}$ Plasma Pretreatment)

  • 곽성관;정관수
    • 대한전자공학회논문지SD
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    • 제37권3호
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    • pp.27-33
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    • 2000
  • 선택성을 향상시키기 위해서 BPSG(Borophosphosilicate glass) 위에 형성한 TiN 패턴을 로(furnace) 열처리와 질소 플라즈마 처리를 한 후 유기 화학 기상 증착법(MOCVD; Metal Organic Chemical Vapor Deposition)으로 구리 박막을 증착하였다. 먼저 650℃∼750℃에서 열처리한 후 150℃에서 구리 박막을 증착시켰을 때 750℃에서 열처리한 경우 TiN 표면 위에만 선택적으로 구리 증착이 일어났다. 질소 플라즈마 처리를 한 경우도 마찬가지로 BPSG 위에 구리 핵 형성이 억제됨을 알 수 있었다. 플라즈마 처리 온도를 증가시킬수록 BPSG 위의 구리 핵 형성이 더 효과적으로 억제되었다. 열처리와 플라즈마 처리 후 증착된 기판 표면을 TOF-SIMS(Time-of-Flight Secondary Ion Mass Spectrometry)로 분석하였을 때 플라즈마 처리가 BPSG 표면의 구리 증착 작용기인 0-H(hydroxyl)기를 제거하여 구리의 선택성이 향상되었다고 해석하였다.

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DEMS(Diethoxymethylsilane) precursor를 이용한 PECVD 저유전물질 박막증착연구 (The study on low dielectric thin film deposition using DEMS precursor by PECVD)

  • 강민구;김대희;김영철;서화일
    • 반도체디스플레이기술학회지
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    • 제7권4호
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    • pp.35-39
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    • 2008
  • We studied deposition of low-k SiOCH dielectric film by PECVD. DEMS(diethoxymethlysilane) precursor, which has two ethoxy groups along with one methyl group attached to the silicon atoms, was used as precursor. The SiOCH film was deposited as a function of oxygen flow rates ranging from 0 to 100sccm. The deposition rate($\AA$/min) of SiOCH film was increased due to the increase of oxygen radical as a function of $O_2$ flow rates. The dielectric constant was decreased from 3.0 to 2.77, as the film was annealed at $450^{\circ}C$ for 30 min. So, it could account that the dielectric constant changes sensitively with $O_2$ flow rates. Also, the leakage current of the annealed film exhibited stable curve than that of asdeposited. These results were caused by the increase of Si-O-Si group and decrease of Si-CH group and OH group within the film by annealing.

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화학 용액 증착법으로 얻어진 $Bi_{4-x}Pr_{0.7}Ti_3O_{12}$ 박막의 강유전성과 미세구조에 관한 연구 (Ferroelectric Properties and Microstructure of Pr-Substituted Bismuth Titanate Prepared by Chemical Solution Deposition)

  • 강동균
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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    • pp.290-291
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    • 2006
  • The effect of praseodymium substitution on the ferroelectric properties of $Bi_4Ti_3O_{12}$ thin films have been investigated. Ferroelectric Pr-substituted $Bi_4Ti_3O_{12}$ thin films were fabricated by chemical solution deposition onto Pt/Ti/$SiO_2$/Si substrates. The structure and morphology of the films were analyzed using Xray diffraction, and scanning electron microscopy, respectively. About 200-nm-thick BPT films grown at $720^{\circ}C$ exhibited a polycrystalline structure and showed excellent ferroelectric properties with a remanent polarization ($2P_r$) of $28.21\;{\mu}C/cm^2$ at an applied voltage of 5 V. The films a1so demonstrate fatigue-free behavior up to $10^{11}$ read/write switching cycles with 1 MHz bipolar pulses at an electric field of ${\pm}5\;V$.

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