• 한국전기전자재료학회논문지
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• 제19권8호
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• pp.712-716
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• 2006

NiCr thin films prepared on $SiO_2/Si$ substrates at room temperature by magnetron co-sputtering technique and then annealed in a vacuum ambient $(3{\times}10^{-6}\;Torr)\;at\;400^{\circ}C$. The grain size and crystallinity of the films increased with film thickness. The resistivity of the films slightly decreases as the film thickness increases, Temperature coefficient resistance (TCR) exhibits positive values irrespective of film thickness and TCR in the range of 50 to 400 nm thickness shows suitable values for the application of 10 dB in ${\pi}-type$ attenuators.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.341-341
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• 2012

Recently, oxide semi-conductor materials have been investigated as promising candidates replacing a-Si:H and poly-Si semiconductor because they have some advantages of a room-temperature process, low-cost, high performance and various applications in flexible and transparent electronics. Particularly, amorphous indium-gallium-zinc-oxide (a-IGZO) is an interesting semiconductor material for use in flexible thin film transistor (TFT) fabrication due to the high carrier mobility and low deposition temperatures. In this work, we demonstrated improvement of flexibility in IGZO TFTs, which were fabricated on polyimide (PI) substrate. At first, a thin poly-4vinyl phenol (PVP) layer was spin coated on PI substrate for making a smooth surface up to 0.3 nm, which was required to form high quality active layer. Then, Ni gate electrode of 100 nm was deposited on the bare PVP layer by e-beam evaporator using a shadow mask. The PVP and $Al_2O_3$ layers with different thicknesses were used for organic/inorganic multi gate dielectric, which were formed by spin coater and atomic layer deposition (ALD), respectively, at $200^{\circ}C$. 70 nm IGZO semiconductor layer and 70 nm Al source/drain electrodes were respectively deposited by RF magnetron sputter and thermal evaporator using shadow masks. Then, IGZO layer was annealed on a hotplate at $200^{\circ}C$ for 1 hour. Standard electrical characteristics of transistors were measured by a semiconductor parameter analyzer at room temperature in the dark and performance of devices then was also evaluated under static and dynamic mechanical deformation. The IGZO TFTs incorporating hybrid gate dielectrics showed a high flexibility compared to the device with single structural gate dielectrics. The effects of mechanical deformation on the TFT characteristics will be discussed in detail.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2003년도 하계학술연구발표회 및 한.일 공동심포지엄
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• pp.194-194
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• 2003

As a result of the recent miniaturization an enhancement in the performance of thin film inductors and thin film transformers, there are increased demands for the thin films with high magnetic permeability in the high frequency range, high saturation magnetization, in high electrical resistivity, and low coercive force. In order to improve high frequency properties, we will investigate anisotropy field by shape and size of pattern. The Fe-Al-O thin films of 16mm and 1 $\mu\textrm{m}$ thickness were deposited on Si wafer, using RF magnetron reactive sputtering technique with the mixture of argon and oxygen gases. The fabricating conditions are obtained in the working partial pressure of 2mTorr, O$_2$ partial pressure of 5%, input power of 400W, and Al pellets on an Fe disk with purity of 99,9%. Magnetic properties of the continuous films as followed: the 4$\pi$M$\_$s/ of 19.4kG, H$\_$c/ of 0.6Oe, H$\_$k/ of 6.0Oe and effective permeability of 2500 up to 100㎒ were obtained. In this work, we expect to enhance effect of magnetic anisotropy on patterned of Fe-Al-O thin films.

• 콘크리트학회지
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• 제9권3호
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• pp.119-126
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• 1997

최근 건설용 골재의 소비량이 증가하여 쇄석골재의 수요량이 급격히 늘어남에 따라 , 광산 현장에 적치 되어 있는 폐석을 효율적으로 활용하기 위한 연구가 활발히 진행되고 있다. 이 연구의 목적은 강원도삼화 지역에 분포하는 쇄석 골재용 석회암을 대상으로 암석 기재학적 화학적, 역학적 특성을 구명하여 건설용 골재로서의 적합성을 알아보고, 또한 부가가치가 높은 건설자재와 첨단산업소재 제품 개발의 원료로 활용할 수 있는 기초자료를 제공하는데 있다. 삼화지역에 분포하는 쇄석골재용 석회암은 크게 담회색의 세립질 석회암과 담갈색의 조립질 석회암으로 구분할 수 있었으며, 이중 양적으로 우세한 세립질 석회암은 돌로마이트가 함유되어 있어 MgO와 $SiO_2$의 함량이 높게 나타났고, 물성 및 역학적 특성을 고려할 때 보통암에 해당된다. 따라서 연구 지역의 쇄석골재용 석회암은 구성광물과 입자들의 크기 및 화학성분 등을 고려할 때, 대체로 시멘트 콘크리트용보다는 아스팔트 콘크리트용이나 도로 포장용 또는 철도용으로 이용하는 것이 더 좋을 것으로 판단된다.

• 한국자기학회지
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• 제16권4호
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• pp.197-200
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• 2006

RF magnetron reactive sputtering법으로 CoFeHfO 박막을 상온에서 제작하여 산소분압에 따른 포화자화, 보자력, 이방성자계를 조사하였다. 최적조건인 산소분압 8%에서 제조한 $Co_{39}Fe_{34}Hf_{9.5}O_{17.5}$ 박막은 포자자속밀도($4{\pi}M_s$) 19kG, 보자력($H_c$) 0.37Oe, 이방성자계($H_k$) 48.62Oe의 우수한 연자성을 나타내었다. CoFeHfO 박막의 전기비저항은 산소분압이 늘어남에 따라 증가하는 경향을 나타내었으며 우수한 연자기적 성질을 가지는 $Co_{39}Fe_{34}Hf_{9.5}O_{17.5}$ 박막의 경우, 300 ${\mu}{\Omega}cm$의 높은 전기비저항과 48.62 Oe의 높은 이방성자계 때문에 $Co_{39}Fe_{34}Hf_{9.5}O_{17.5}$박막이 고주파에서 우수한 연자기 특성을 가지는 것으로 사료된다.

• 대한화학회지
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• 제17권2호
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• pp.85-94
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• 1973

니트로 벤젠의 세가지 유도체, 즉 1.3.5-트리니트로벤젠(1.3.5-TNB), m-디니트로벤젠(m-DNB) 및 니트로벤젠(NB)등이 11종의 염기성 유기 용매 즉, ${\alpha}$-피콜린, 피리딘, 디메틸술포옥시드(DMSO), NN′-디메틸초산아미드(NN′-DMA), 테트라히드로퓨란(THF), 1,4-디옥산, 디에틸에테르, 시안화메틸, 프로필렌옥시드, 에피클로로히드린, 초산메틸등과 사염화탄소용액중에서 전하전이착물을 형성함을 자외선분광광도법에 의해 확인하고, 이들 전하전이착물의 안정도 상수를 결정하였다. Drago 와 Wayland 의 이중척도엔탈피식(double-scale-enthalpy)을 수정하여 $logK = E_AC_A+E_DC_D$식을 얻고, 이것을 써서 정전기적효과 $E_D$와 공유성효과 $C_D$값을 11종의 유기 용매에 대해 얻었다. 이 두 효과는 전하전이착물의 안정도 상수 K와 그리고 적외선 흡수 스펙트럼의 신축진동수변화 ${\Delta}{\nu}_C=O$에 영향을 주며, 특히 $C_D$ sms 안정도 상수에 비례하였고, 신축진동수변화 ${\Delta}{\nu}_{C=O}= 37.4-5.47E_D+12.1C_D$의 실험식을 얻었다. ${\pi}$결합을 가진 분자들이 전이착물을 이룰 때 정전기적효과와 공유성효과와 공유성효과가 모두 관여하며, 그밖에 결합하는 분자의 ${\pi}$궤도함수도 중요한 역할을 한다는 것을 알았다.

• Bulletin of the Korean Chemical Society
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• 제30권2호
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• pp.429-434
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• 2009

The OH($X^2{\Pi},\;{\nu}$"=0, 1) internal state distributions from the reaction of electronically ground state oxygen atoms with HSi$Cl_3$ were measured using laser-induced fluorescence. The ground-state O$(^3P_J)$ atoms with kinetic energies above the reaction barrier were produced by photolysis of N$O_2$ at 355 nm. The OH product revealed strong vibrational population inversion, P(${\nu}$"=1)/P(${\nu}$"=0) = 4.0 ${\pm}$ 0.6, and rotational distributions in both vibrational states exhibit substantial rotational excitations to the limit of total available energy. However, no preferential populations in either of the two $\Lambda$ doublet states were observed from the micropopulations, which supports a mechanism involving a direct abstraction of hydrogen by the atomic oxygen. It was also found that the collision energy between O and HSi$Cl_3$ is effectively coupled into the excitation of the internal degrees of freedom of the OH product ($$ = 0.62, and $<\;f_{rot}>$ = 0.20). The dynamics appear consistent with expectations for the kinematically constrained reaction which supports the reaction type, heavy + light-heavy $\rightarrow$ heavy-light + heavy (H + LH′ $\rightarrow$ HL + H′). The dynamics of oxygen atom collision with HSi$Cl_3$ are discussed in comparison to those with Si$H_4$.

• 한국자기학회지
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• 제1권1호
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• pp.12-16
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• 1991

F $e_{76-x}$ C $u_{1}$M $o_{x}$S $i_{14}$ $B_{9}$(x=2, 3)비정질합금의 열처리에 따른 자기적특성과 미세구조의 변화에 대해 조사하였다. 이들합금을 500 .deg. C에서 1시간 열처리한 경우, 결정화에 의해 약 20mm의 입경을 갖는 .alpha. -Fe의 초미세결정립 조직으로 변태하였으며, 이때 얻어진 합금의 실효투자율은 8~9*$10^{3}$, 보자력은 3~4A/m정도이었다. 초미세결정합금의 연자기특성을 크게 좌우하는 요소중의 하나가 입경의 크기이며, 우수 한 자성특성을 얻기위해서는 결정립의 미세화가 요구되는 것으로 알려져 있다. 이에 따라 Fe-Cu-Mo-Si-B계 합금의 경우보다 우수한 연자기특성을 얻기 위하여 2단 열처리를 행하였다. 즉, 400 .deg. C에서 1~3시간 저온 열처리 후 500 .deg. C에서 1시간 고온열처리를 하면 입경이 10nm이하로 감소하였으며, 이때 얻어진 합금의 실효투자율은 1.2~ 1.7*$10^{4}$이고 보자력은 ~2A/m이었다. 이와 같은 연자기특성의 향상은 .alpha. -Fe(Si)결정립의 미세화에 따른 평균결정자기이방성 의 감소에 기인하는 것으로 믿어진다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 1998년도 제14회 학술발표회 논문개요집
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• pp.77-77
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• 1998

Present silicon dioxide (SiOz) 떠m as intennetal dielectridIMD) layers will result in high parasitic c capacitance and crosstalk interference in 비gh density devices. Low dielectric materials such as f f1uorina뼈 silicon oxide(SiOF) and f1uoropolymer IMD layers have been tried to s이ve this problem. I In the SiOF ftlm, as fluorine concentration increases the dielectric constant of t뼈 film decreases but i it becomes unstable and wa않r absorptivity increases. The dielectric constant above 3.0 is obtain어 i in these ftlms. Fluoropolymers such as polyte$\sigma$따luoroethylene(PTFE) are known as low dielectric c constant (>2.0) materials. However, their $\alpha$)Or thermal stability and low adhesive fa$\pi$e have h hindered 야1리ru뚱 as IMD ma따"ials. 1 The concept of a plasma processing a찌Jaratus with 비gh density plasma at low pressure has r received much attention for deposition because films made in these plasma reactors have many a advantages such as go여 film quality and gap filling profile. High ion flux with low ion energy in m the high density plasma make the low contamination and go어 $\sigma$'Oss피lked ftlm. Especially the h helicon plasma reactor have attractive features for ftlm deposition 야~au똥 of i앙 high density plasma p production compared with other conventional type plasma soun:es. I In this pa야Jr, we present the results on the low dielectric constant fluorocarbonated-SiOF film d밑JOsited on p-Si(loo) 5 inch silicon substrates with 00% of 0dFTES gas mixture and 20% of Ar g gas in a helicon plasma reactor. High density 띠asma is generated in the conventional helicon p plasma soun:e with Nagoya type ill antenna, 5-15 MHz and 1 kW RF power, 700 Gauss of m magnetic field, and 1.5 mTorr of pressure. The electron density and temperature of the 0dFTES d discharge are measUI벼 by Langmuir probe. The relative density of radicals are measured by optic허 e emission spe따'Oscopy(OES). Chemical bonding structure 3I피 atomic concentration 따'C characterized u using fourier transform infrared(FTIR) s야3띠"Oscopy and X -ray photonelectron spl:’따'Oscopy (XPS). D Dielectric constant is measured using a metal insulator semiconductor (MIS;AVO.4 $\mu$ m thick f fIlmlp-SD s$\sigma$ucture. A chemical stoichiome$\sigma$y of 야Ie fluorocarbina$textsc{k}$영-SiOF film 따~si야영 at room temperature, which t the flow rate of Oz and FTES gas is Isccm and 6sccm, res야~tvely, is form려 야Ie SiouFo.36Co.14. A d dielec$\sigma$ic constant of this fIlm is 2.8, but the s$\alpha$'!Cimen at annealed 5OOt: is obtain려 3.24, and the s stepcoverage in the 0.4 $\mu$ m and 0.5 $\mu$ m pattern 킹'C above 92% and 91% without void, res야~tively. res야~tively.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.228.2-228.2
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• 2014

Characteristics of high Fermi velocity, high mechanical strength, and transparency offer tremendous advantages for using graphene as a promising transparent conducting material [1] in electronic devices. Although graphene is a prospective candidate for touch sensor with strong mechanical properties [2] and flexibility, only few investigations have been carried out in the field of sensor as a device form. In this study, we suggest ultra-highly sensitive and transparent graphene touch sensor fabricated by single layer graphenes. One of the graphene layers is formed in the top panel as a disconnected graphene beam transferred on PDMS, and the other of the graphene layer is formed with line-patterning on the bottom panel of triple structure PET/PI/SiO2. The touch sensor shows characteristics of flexible. Its transmittance is approximately 75% where transmittance of the top panel and the bottom panel are 86.3% and 87%, respectively, at 550 nm wavelength. Sheet resistance of each graphene layer is estimated as low as $971{\Omega}/sq$. The results show that the conductance change rate (${\Delta}C/C0$) is $8{\times}105$ which depicts ultra-high sensitivity. Moreover, reliability characteristic confirms consistent behavior up to a 100-cycle test.