• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 C
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• pp.1488-1490
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• 2002

The (Bi,Ba,Sr)$TiO_3$[BBST] thin films were fabricated on Pt/Ti/$SiO_2$/Si substrate by RF sputtering method. We investigated the effects of Ar/$O_2$ rates on the structural properties of BBST thin films. Decreasing the $O_2$ rates, the intensity of $BaBi_4Ti_4O_{15}$ and $Bi_4Ti_3O_{12}$ peaks were increased but the $(Ba_{0.5}Sr_{0.5})TiO_3$ peak was decreased. In the case of BBST thin films deposited with condition of 90/10 (Ar/$O_2$) ratio, the composition of Ba/Sr/Bi was 0.35/0.4/0.25. Also, in the BBST thin films deposited with condition of 80/20(Ar/$O_2$) ratio, the composition of Br,Sr and Ti were relatively uniform. But the component of Bi and Ti were diffused into the Pt layers.

• 한국전기전자재료학회논문지
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• 제23권10호
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• pp.752-758
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• 2010

The etching characteristics of indium tin oxide (ITO) thin films in an $O_2/BCl_3/Ar$ plasma were investigated. The etch rate of ITO thin films increased with increasing $O_2$ content from 0 to 2 sccm in $BCl_3$/Ar plasma, whereas that of ITO decreased with increasing $O_2$ content from 2 sccm to 6 sccm in $BCl_3$/Ar plasma. The maximum etch rate of 65.9 nm/m in for the ITO thin films was obtained at 2 sccm $O_2$ addition. The etch conditions were the RF power of 500 W, the bias power of 200 W, the process pressure of 15 mTorr, and the substrate temperature of $40^{\circ}C$. The analysis of x-ray photo electron spectroscopy (XPS) was carried out to investigate the chemical reactions between the surfaces of ITO thin films and etch species.

• 한국재료학회지
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• 제2권5호
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• pp.337-342
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• 1992

대향타겟트형 스파터기에서 BaO-l2Fe 복합타겟트를 사용하고 50% $O_2$+Ar 스파터가스를 사용한 반응성 프라즈마를 스펙트로스포프법으로 검진하였다. 프라즈마의 스펙트럼은 Ba, B$a^+$, Fe, FeO, F$e^+$, Ar, $Ar^+$, O, $O^+$의 피크로 이루어져 있었으며 타겟트로 부터 멀어짐에 따라 이온의 상대강도는 중성원소의 그것에 비하여 더 감소하였다.

• 한국세라믹학회지
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• 제32권7호
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• pp.799-808
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• 1995

Transparent conductive films of aluminium doped zinc oxide (AZO) have been prepared by using the DC magnetron sputtering with the ZnO : Al (Al2O3 2 wt%) oxide target oriented to c-axis. Electrical and optical properties depended upon the O2/Ar gas ratio. The optical transmittance and sheet resistance of the AZO coated glass was 60~65% and 75Ω/$\square$, respectively at the O2/Ar gas ratio of 0. With the increase of the oxygen partial pressure to 2.0$\times$10-2, they were increased to the values of 81% and 1kΩ/$\square$, respectively. The films with the resistivities of 1.2~1.4$\times$10-3 Ω.cm, mobilities of 11~13 $\textrm{cm}^2$/V.sec and carrier concentrations of 3.5$\times$1020~4.0$\times$1020/㎤ were produced at the optimum O2/Ar gas ratio, which was 0.5$\times$10-2~1.0$\times$10-2. According to XRD analysis, the films have only one peak corresponding to the (002) plane, which indicates that there is a strong preferred orientation of the films. The grain size of ZnO films were calculated to 200~320 $\AA$, which was increased with the O2/Ar gas ratio and Ar gas flowrate.

• 한국전기전자재료학회논문지
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• 제16권4호
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• pp.298-303
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• 2003

Bi$_4$-$_{x}$EU$_{x}$Ti$_3$O$_{12}$ (BET) thin films were etched by inductively coupled CF$_4$/Ar plasma. We obtained the maximum etch rate of 78 nm/min at the gas mixing ratio of CF$_4$(10%)/Ar(90%). The variation of volume density for F and Ar atoms are measured by the optical emission spectroscopy. As CF$_4$increased in CF$_4$/Ar plasma, the emission intensities of F increase, but Ar atoms decrease, which confirms our suggestion that emission intensity is proportional to the volume density of atoms. From X-ray photoelectron spectroscopy, the intensities of the Bi-O, the Eu-O and the Ti-O peaks are changed. By pure Ar plasma, intensity peak of the oxygen-metal (O-M : TiO$_2$, Bi$_2$O$_3$, Eu$_2$O$_3$) bond was seemed to disappear while the intensity of pure oxygen peak showed an opposite tendency. After the BET thin films was etched by CF$_4$/Ar plasma, the peak intensity of O-M bond increase slowly, but more quickly than that of peak belonged to pure oxygen atoms due to the decrease of Ar ion bombardment. Scanning electron microscopy was used to investigate etching Profile. The Profile of etched BET thin film was over 85$^{\circ}$./TEX>.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.62-65
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• 2001

$SrBi_2Ta_2O_{9}$ thin films were etched in inductively coupled $Cl_{2}$/$CF_{4}$/Ar plasma. The maximum etch rate was 1060 $\AA\textrm{m}$/min in $Cl_{2}$/$CF_{4}$/Ar (80). The chemical reactions on the etched surface were studied with x-ray photoelectron spectroscopy. The etching of SBT thin films in $Cl_{2}$/$CF_{4}$/Ar were etched by chemically assisted reactive ion etching. The small addition of $Cl_2$ into $CF_4$(20)/Ar(80) plasma will decrease the fluorine radicals and the increase Cl radical.

• 한국항해항만학회:학술대회논문집
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• 한국항해항만학회 2000년도 추계학술대회논문집
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• pp.29-32
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• 2000

Cerium oxide thin film has been proposed as a buffer layer between the ferroelectric film and the Si substrate in Metal-Ferroelectric-Insulator-Silicon (MFIS ) structures for ferroelectric random access memory (FRAM) applications. In this study, CeO$_2$thin films were etched with Cl$_2$/Ar gas combination in an inductively coupled plasma (ICP). The highest etch rate of CeO$_2$film is 230 $\AA$/min at Cl$_2$/(Cl$_2$+Ar) gas mixing ratio of 0.2. This result confirms that CeO$_2$thin film is dominantly etched by Ar ions bombardment and is assisted by chemical reaction of Cl radicals. The selectivity of CeO$_2$to YMnO$_3$was 1.83. As a XPS analysis, the surface of etched CeO$_2$thin films was existed in Ce-Cl bond by chemical reaction between Ce and Cl. The results of XPS analysis were confirmed by SIMS analysis. The existence of Ce-Cl bonding was proven at 176.15 (a.m.u.).

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 추계학술대회 논문집
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• pp.29-32
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• 2000

Cerium oxide thin film has been proposed as a buffer layer between the ferroelectric film and the Si substrate in Metal-Ferroelectric-Insulator-Silicon (MFIS ) structures for ferroelectric random access memory (FRAM) applications. In this study, CeO$_2$ thin films were etched with Cl$_2$/Ar gas combination in an inductively coupled plasma (ICP). The highest etch rate of CeO$_2$ film is 230 $\AA$/min at Cl$_2$/(Cl$_2$+Ar) gas mixing ratio of 0.2. This result confirms that CeO$_2$ thin film is dominantly etched by Ar ions bombardment and is assisted by chemical reaction of Cl radicals. The selectivity of CeO$_2$ to YMnO$_3$ was 1.83. As a XPS analysis, the surface of etched CeO$_2$ thin films was existed in Ce-Cl bond by chemical reaction between Ce and Cl. The results of XPS analysis were confirmed by SIMS analysis. The existence of Ce-Cl bonding was proven at 176.15 (a.m.u.).

• 대한전자공학회논문지SD
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• 제38권12호
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• pp.8-13
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• 2001

$CeO_2$ 박막은 강유전체 메모리 디바이스 응용을 위한 금속-강유전체-절연체-실리콘 전계효과 트랜지스터 구조에서의 강유전체 박막과 실리콘 기판 사이의 완충층으로서 제안되어지고 있다. 본 논문에서는 $CeO_2$ 박막을 유도 결합 플라즈마를 이용하여 $Cl_2$/Ar 가스 혼합비에 따라 식각하였다. 식각 특성을 알아보기 위한 실험조건으로는 RF 전력 600 W, dc 바이어스 전압 -200 V, 반응로 압력 15 mTorr로 고정하였고 $Cl_2$($Cl_2$+Ar) 가스 혼합비를 변화시키면서 실험하였다. $Cl_2$/($Cl_2$+Ar) 가스 혼합비가 0.2일때 $CeO_2$ 박막의 식각속도는 230 ${\AA}$/min으로 가장 높았으며 또한 $YMnO_3$에 대한 $CeO_2$의 선택비는 1.83이였다. 식각된 $CeO_2$ 박막의 표면반응은 XPS와 SIMS를 통해서 분석하였다. XPS 분석 결과 $CeO_2$ 박막의 표면에 Ce와 Cl의 화학적 반응에 의해 CeCl 결합이 존재함을 확인하였고, 또한 SIMS 분석 결과로 CeCl 결합을 확인하였다. $CeO_2$ 박막의 식각은 Cl 라디칼의 화학적 반응의 도움을 받으며 Ce 원자는 Cl과 반응을 하여 CeCl과 같은 혼합물로 $CeO_2$ 박막 표면에 존재하며 이들 CeCl 혼합물은 Ar 이온들의 충격에 의해 물리적으로 식각 되어진다.

• 한국결정성장학회지
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• 제31권2호
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• pp.73-77
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• 2021

RF 마그네트론 스퍼터링 공정에 의해 Ga-doped ZnO 박막이 O2 및 Ar 분위기 하에서 증착 조건에 따라 합성되었으며, N2 분위기에서, 600℃에서 급속열처리(RTA)를 실시하였다. 증착된 ZnO : Ga 박막에 대해 두께를 측정하였고, XRD 패턴 분석에 의해 결정상을 조사하였으며, FE-SEM, AFM 이미지에 의해 박막의 미세구조를 관찰하였다. O2 및 Ar 분위기 기체 종류별로 형성된 박막들의 증착 조건에 따라 X-선 회절 패턴의 (002)면의 세기는 상당한 차이를 나타냈다. O2 조건에서는 Ga doping이 이루어진 단일 박막의 경우에서는 강한 세기의 회절피크가 관찰되었다. O2 및 Ar 조건에서는 Ga doping이 이루어진 다층박막의 경우에서는 다소 약한 세기의 (002) 면의 피크만을 나타내었다. FE-SEM image에서는 박막의 표면입자의 크기는 두께가 증가함에 따라 입자크기가 다소 증가하는 것으로 관찰되었다. O2 및 Ar 분위기 조건 하에서, Ga doping이 이루어진 다층박막의 경우에서는, 비저항은 6.4 × 10-4Ω·cm을 나타냈고, O2 분위기 조건하에서, Ga doping이 이루어진 단일 박막의 경우에서는 저항값이 감소하였고, Ga-doped ZnO 박막의 두께가 2 ㎛로 증가하면서 저항이 감소하였으며, 1.0 × 10-3 Ω·cm의 비교적 낮은 비저항 값을 나타내었다.