• Title/Summary/Keyword: $Ni_3$Al

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An in vitro evaluation of the accuracy of four electronic apex locators using stainless-steel and nickel-titanium hand files

  • Gehlot, Paras Mull;Manjunath, Vinutha;Manjunath, Mysore Krishnaswamy
    • Restorative Dentistry and Endodontics
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    • v.41 no.1
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    • pp.6-11
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    • 2016
  • Objectives: The purpose of this in vitro study was to evaluate the accuracy of working length (WL) determination of four electronic apex locators (EALs), namely, Root ZX (RZX), Elements diagnostic unit and apex locator (ELE), SybronEndo Mini Apex locator (MINI) and Propex pixi (PIXI) using Stainless steel (SS) and nickel-titanium (NiTi) hand files. The null hypothesis was that there was no difference between canal length determination by SS and NiTi files of 4 EALs. Materials and Methods: Sixty extracted, single rooted human teeth were decoronated and the canal orifice flared. The actual length (AL) was assessed visually, and the teeth were embedded in an alginate model. The electronic length (EL) measurements were recorded with all four EALs using SS and NiTi files at '0.5' reading on display. The differences between the AL and EL were compared. Results: The results obtained with each EAL with SS and NiTi files were compared with AL. A paired sample t test showed that there was a statistical significant difference between EAL readings with SS and NiTi files for RZX and MINI (p < 0.05). The accuracy of RZX, ELE, MINI and PIXI within ${\pm}0.5 mm$ of AL with SS/NiTi files were 93.3%/70%, 90%/91.7%, 95%/68.3%, and 83.3%/83.3%, respectively. Conclusions: The results of this study indicate that Root ZX was statistically more accurate with NiTi files compared to SS files, while MINI was statistically more accurate with SS files compared to NiTi files. ELE and PIXI were not affected by the alloy type of the file used to determine WL.

A Study on Unidirectionally Solidified Ni-base Eutectic Composites (일방향응고(一方向凝固)시킨 Ni기(基) 초내열(超耐熱) 공정복합재료(共晶複合材料)에 관(關)한 연구(硏究))

  • Lee, Joo-Hong;Hong, Yeong-Hwan;Hong, Jong-Hwi
    • Journal of Korea Foundry Society
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    • v.8 no.4
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    • pp.437-445
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    • 1988
  • The effect of interlamellar spacing on microstructural stability at high temperature was studied for unidirectionally solidified ternary $Ni\;/\;Ni_3Al-Ni_3$ Nb and binary $Ni-Ni_3Nb$ eutectic composite. The interlamellar spacing of both alloy systems were varied with the growth rate according to $"{\lambda}^2R=constant"$ relationship. As a result of isothermal heat treatments at high temperature it was considered that coarsening of lamellar structure was due to concentration gradient between the tip with a relatively small radius of curvature and the side of the thick lamellae with a larger radius of the opposite sign. Fault density was increased as the interlamellar spacing decreased. Therefore it is also considered that the higher coarsening rate of the specimen with the smaller interlamellar spacing was due to higher fault density. And the diference of coarsening rate between $Ni\;/\;Ni_3Al-Ni_3Nb$ and $Ni-Ni_3Nb$ eutectic composites was not observed when the interlamellar spacing was similar in size. This means that the presence of ${\gamma}'$ in ${\gamma}\;/\;{\gamma}'\;-{\delta}$ eutectic had no b arrier effect to diffusion through the ${\gamma}$ matrix.

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Distribution Behavior of Ni between CaO-SiO2-Al2O3-MgO Slag and Cu-Ni Alloy (CaO-SiO2-Al2O3-MgO 슬래그와 Cu-Ni합금 사이의 Ni 분배거동)

  • Han, Bo-Ram;Sohn, Ho-Sang
    • Resources Recycling
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    • v.24 no.1
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    • pp.35-42
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    • 2015
  • To obtain the fundamental information on the dissolution of nickel into the slag in the pyrometallurgical processes for treatment of wasted PCB, the distribution ratios of nickel between CaO-$SiO_2-Al_2O_3$-MgO slag and copper-5 wt%Ni alloy were measured at 1623 K to 1823 K under a controlled $CO_2$-CO atmosphere. The distribution ratio of Ni increased linearly with increasing oxygen partial pressure. Therefore, the dissolution reaction of nickel into the slags could be described by the following equation; $$Ni(l)_{metal}+\frac{1}{2}O_2(g)NiO(l)_{slag}$$ The distribution ratio of Ni increased linearly with increasing content of basic oxides(CaO and MgO) in slag. However, the distribution ratio of Ni decreased linearly with increasing temperature. From these results, the empirical equation of distribution ratio of Ni was obtained by the following equation from the analysis of experimental conditions by multiple regression. $${\log}L_{Ni}=0.4000{\log}P_{O2}-5.1{\times}10^{-4}T+0.3375\(\frac{X_{CaO}+X_{MgO}}{X_{SiO2}}\)$$

The Effect of Surface Modification with La-M-O (M = Ni, Li) on Electrochemical Performances of Li[Ni0.8Co0.15Al0.05]O2 Cathode

  • Ryu, Jea-Hyeok;Kim, Seuk-Buom;Park, Yong-Joon
    • Bulletin of the Korean Chemical Society
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    • v.30 no.3
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    • pp.657-660
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    • 2009
  • The surface of $Li[Ni_{0.8}Co_{0.15}Al_{0.05}]O_2$ cathode particle was modified by lanthanum based oxide to improve electrochemical property and thermal stability. The XRD pattern of surface layer was indexed with that of $La_4NiLiO_8$. The discharge capacity of modified electrode was higher than that of pristine sample, specially at fast charge-discharge rate and high cut-off voltage. In the DSC profile of the charged sample, the generation of heat by exothermic reaction was decreased by surface modification. Such enhancement may by attributed to the presence of stable lanthanum based oxide, which effectively suppressd the reaction between electrode and electrolyte on the surface of $Li[Ni_{0.8}Co_{0.15}Al_{0.05}]O_2$ electrode.

Study on the Synthesis by the Combustion Mettled and the Electrochemical Properties of $LiNi_{1-y}M_yO_2(M=Al,\;Zn\;and\;Ti)$ for the Development of Cathode Material with Large Discharge Capacity (고용량 양극재료 개발을 위한 연소법에 의한 $LiNi_{1-y}M_yO_2(M=Al,\;Zn\;and\;Ti)$의 합성과 전기화학적 특성에 관한 연구)

  • 권익현;김훈욱;송명엽
    • 한국전기화학회:학술대회논문집
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    • 2004.06a
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    • pp.293-296
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    • 2004
  • 고용량 $LiNi_{1-y}M_yO_2$(M=Al, Zn and Ti, y=0.000, 0.005, 0.010, 0.025, 0.050 and 0.100) 양극재료를 합성하기 위하여 연소법을 사용하였다. 합성한 시료들을 X-선회절 분석, 미세구조관찰, 전자침미세분석(EPMA)을 하였다. battery 충${\cdot}$방전기를 사용하여 리튬의 삽입${\cdot}$추출 반응으로 인하여 나타나는 충${\cdot}$방전 곡선의 변화를 조사하였고, 합성한 각 시편에 대해 충${\cdot}$방전 싸이클 수에 따른 방전용량의 변화를 조사하였다. XRD pattern 분석결과 모든 조성에서 $R\bar{3}m$ 구조를 보여주었다. Ni 자리에 Al, Zn, Ti를 치환한 결과 방전용량은 감소하였으나 M=Al 시료는 싸이클 특성이 증가하였다.

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Formation and conductivity of oriented $LaNiO_3$ thin films on Si and $Al_2O_3$ substrates (Si와 $Al_2O_3$ 기판에 대한 $LaNiO_3$ 박막의 배향성 형성과 도전도)

  • Kim, Dae-Young;Park, Min-Seok;Son, Se-Mo;Lee, Myoung-Kyo;Kim, Kang-Eun;Chung, Su-Tae
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.07b
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    • pp.799-802
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    • 2003
  • [ $LaNiO_3$ ](LNO) thin films were deposited on various substrates as Si and $Al_2O_3$ by sol-gel process using lanthanum nitrate and nickel acetate. The structure and orientation of the films were characterized by X-ray diffraction. The orientation factors of films on Si(100), Si(111), $SiO_2/Si(100)$ and $Al_2O_3$were 97%, 63%, 73%, and 24% respective. The conductivity was $7.6{\times}10^{-3}{\Omega}{\cdot}cm$ with 10 times coating at Si(100) substrate.

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A Study on Fabrication of Conductor Patterns on AlN Ceramic Surface by Laser Direct Writing (레이저 직접묘화법에 의한 AlN 기판상의 전도성 패턴 제작에 관한 연구)

  • Lee, Je-Hoon;Seo, Jung;Han, Yu-Hee
    • Laser Solutions
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    • v.3 no.2
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    • pp.25-33
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    • 2000
  • One of perspective direction of microfabrication is direct laser writing technology that allows to create metal, semiconductive and dielectric micropatterns on substrate surface. In this work, a two step method, the combination of seed forming process, in which metallic Al seed was selectively generated on AlN ceramic substrate by direct writing technique using a pulsed Nd : YAG laser and subsequent electroless Ni plating on the activated Al seed, was presented. The effects of laser parameters such as pulse energy, scanning speed and pulse frequency on shape of Alseed and conductor line after electroless Ni plating were investigated. The nature of the laser activated surface is analyzed from XPS data. The line width of this metallic Al and Ni is analyzed using SEM. As a results, Al seed line with 24㎛ width and 100㎛ isolated line space is obtained. Finally, laser direct writing can be applied in the field between thin and thick film technique in electronic industry.

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Tunneling Magnetoresistance in Si/$SiO_2$/NiFe/$Al_2$$O_3$/Co Thin Films (Si/$SiO_2$/NiFe/$Al_2$$O_3$/Co 박막의 투과자기저항 특성 연구)

  • 현준원;백주열
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.14 no.11
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    • pp.934-940
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    • 2001
  • Magnetic properties were investigated for Si/SiO$_2$/NiFe(300 )/A1$_2$O$_3$(t)/Co(200 ) junction related with the parameters of $Al_2$O$_3$. Insulating $Al_2$O$_3$ layer was formed by depositing a 5~40 thick Al layer, followed by a 90~120s RF plasma oxidation in an $O_2$ atmosphere. Magnetoresistance was not observed for tunnel junction with 5~10 thick Al layer, but magnetoresistance was observed large for tunnel junction with 15~40 thick Al layer. Oxidation time did not largely influence magnetoresistance. Tunnel magnetoresistance effect depended on magnetization behavior of two ferromagnetic layers. Tunneling junction was confirmed through nonlinear I-V curve. In this work, tunneling magnetoresistance(TMR) up to 30 % was observed. This apparent TMR is an artifact of the nonuniform current flow over the junction in the cross geometry of the electrodes.

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