• Bulletin of the Korean Chemical Society
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• v.31 no.8
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• pp.2158-2162
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• 2010

Studies on the molecular construction and structures of $M(NO_3)_2$ (M = Cu(II), Ni(II)) complexes with 1,2-bis(dimethyl-3-pyridylsilyl)ethane (L) have been carried out. Formation of each molecular skeleton appears to be primarily associated with a suitable combination of bidentate N-donors of L and coordinating nature of octahedral metal(II) ions: [$Cu(NO_3)_2(L)_2$] yields a 2-dimensional sheet structure consisting of 44-membered $Cu_4L_4$ skeleton whereas $[Ni(L)_2(H_2O)_2](NO_3)_2$ produces an interpenetrated 3-dimensional structure consisting of 66-membered cyclohexanoid ($M_6L_6$) skeleton. The Cu(II) ion prefers nitrate whereas the Ni(II) ion prefers water molecules as the fifth and the sixth ligands.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.253-253
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• 2007

압전 액츄에이터 및 초음파진동자의 응용범위가 넒어짐에 따라 변위량, 응력 등을 개선시키기 위해 전기기계결합계수 kp 및 압전 d상수가 종전보다 큰 재료가 요구되고 있으며, 초음파진동자나 압전 모터와 같이 마찰에 의한 열손실이 많이 발생하는 액츄에이터에 적용할 큰 기계적품질계수롤 가지는 저손실 압전 액츄에이터 및 초음파진동자용 재료가 필요한 실정이다. PZT계 세라믹스는 높은 유전상수와 압전특성으로 전자세라믹스분야에서 가장 널리 사용되어지고 있지만, $1200^{\circ}C$이상의 높은 소결온도 때문에 $1000^{\circ}C$ 부근에서 급격히 휘발되는 PbO로 인한 환경오염과 기본조성의 변화로 인한 압전특성의 저하가 문제시 되고 있다. $Pb(Ni_{1/3}Nb_{2/3})O_3$는 약 $-120^{\circ}C$정도의 큐리온도룰 가지는 강유전체로 Pb(Zr, Ti)$O_3$계 세라믹스에 치환 시 유전상수와 전기기계결합계수를 개선시키는 대표적인 성분이다. 따라서 본 연구에서는 저온소결 저손실의 적층형 압전 액츄에이터를 개발하기 위해 PMS-PMN-PZT계 세라믹스에 $Pb(Ni_{1/3}Nb_{2/3})O_3$ 세라믹스를 치환하고 $Li_2CO_3$와 $Na_2CO_3$ ZnO를 소결조재로 사용하여 저온소결 하였으며 PNN 치환량에 따른 결과를 관찰 하였다.

• Korean Journal of Materials Research
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• v.19 no.8
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• pp.417-420
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• 2009

This study develops a highly transparent ohmic contact using phosphorus doped ZnO with current spreading for p-GaN to increase the optical output power of nitride-based light-emitting diodes (LEDs). The phosphorus doped ZnO transparent ohmic contact layer was prepared by radio frequency magnetron sputtering with post-deposition annealing. The transmittance of the phosphorus doped ZnO exceeds 90% in the region of 440 nm to 500 nm. The specific contact resistance of the phosphorus doped ZnO on p-GaN was determined to be $7.82{\times}10^{-3}{\Omega}{\cdot}cm^2$ after annealing at $700^{\circ}C$. GaN LED chips with dimensions of $300\times300{\mu}m$ fabricated with the phosphorus doped ZnO transparent ohmic contact were developed and produced a 2.7 V increase in forward voltage under a nominal forward current of 20 mA compared to GaN LED with Ni/Au Ohmic contact. However, the output power increased by 25% at the injection current of 20 mA compared to GaN LED with the Ni/Au contact scheme.

• Journal of the Korean Ceramic Society
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• v.52 no.3
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• pp.197-203
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• 2015

The colorization of $Zn_2SiO_4$ crystal glazes was investigated by adding nucleating seeds with various coloring agents. The addition of color fixing agents such as $Fe_2O_3$, $MnO_2$, and NiO with seeds caused changes in the colors of glazes. The crystallinity and crystal size were dependent on glaze composition and firing schedules. By controlling coloring agents and firing schedules, it was possible to create various colors and sizes of crystals in a zinc-based crystalline glaze.

• Journal of the Korean Magnetics Society
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• v.7 no.1
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• pp.13-18
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• 1997

The effects of the various raw material composition and sintered temperature on the physical properties of Ni-Zn ferrite have been investigated. They turned out to be spinel structure by X-ray diffraction and the size of grain from microscope was from 6 ${\mu}{\textrm}{m}$ to 16 ${\mu}{\textrm}{m}$. As the sintering temperature was increased from 1030 $^{\circ}C$ to 1070 $^{\circ}C$, the initial permeability and magnetic induction has increased and the both of Q factor and coercive force has decreased. The coercive force and curie temperature were almost the same at each specimen. Their values were about 0.20 Oe and 220 $^{\circ}C$. The frequency of specimen will used in the range from 400 kHz to 20 MHz. The basic composition of $Ni_{0.14}Zn_{0.64}Cu_{0.22}Fe_2O_4$ (specimen B) sintered at 1050 $^{\circ}C$ shows the best results at magnetic induction($B_r & B_m$).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.257-260
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• 2003

In this study, the structural, dielectric and piezielectric properities of $xPb(Mg_{1/3}Nb_{2/3})O_3-(0.5-x)Pb(Ni_{1/3}Nb_{2/3})O_3-0.5Pb(Zr_{0.3}Ti_{0.7})O_3$ ceramics were investigated with the substitution of $PbMg_{1/3}Nb_{2/3}O_3$. The results showed that the substitution of the $PbMg_{1/3}Nb_{2/3}O_3$ was effective in increasing the dielectric constant and electromechanical coupling factor $(K_p)$. The dielectric constant, dielectric loss and Kp showed the highest values of 4293, 2.4%, 0.59 relatively, when the substitution of amount of $PbMg_{1/3}Nb_{2/3}O_3$ was 5 mol%.

• Korean Chemical Engineering Research
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• v.48 no.2
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• pp.157-163
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• 2010

A new etchant formulation was developed in this study to increase the shadow mask production rate, utilizing the $Fe(ClO_4)_3$ as an additive in the aqueous $FeCl_3$ solution. The shadow mask etch rate increased substantially with the increase of $Fe(ClO_4)_3$ concentration in the etchant. The etch rate difference between Ni and Invar steel was also reduced with the addition of $Fe{(ClO_4)_3}$ for most of the operating conditions, which was caused by the enhanced etch rate of both Ni and Fe by the new etchant. The increase in etch rate with the addition of $Fe(ClO_4)_3$ to aqueous ferric chloride solution was attributed to the superior electron transfer capability of $ClO^{4-}$ ion to that of $Cl^-$ ion.

• Progress in Superconductivity and Cryogenics
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• v.23 no.3
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• pp.37-40
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• 2021

Nickel (Ni) is a kind of the rare earth resources. Since Ni-containing waste is drained after several plating operations in the factories, the effective recycling technique has been expected to be introduced. An actual magnetic separation technique using HTS bulk magnet generating the strong magnetic field has succeeded in collecting the paramagnetic slurry containing Ni-sulphate coarse crystals which were fabricated from the Ni-plating waste. The Ni compound in the collected slurry was identified as NiSO₄/6H₂O, showing slight differences in the particle size and magnetic susceptibility between the samples attracted and not-attract to the magnetic pole. This preferential extraction suggests us a novel recycling method of Ni resource because the compound is capable of recycling back to the plating processes as a raw material.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.115-115
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• 1999

GaN는 직접천이형 wide band gap(3.4eV) 반도체로서 청색/자외선 발광소자 및 고출력 전자장비등에의 응용성 때문에 폭넓게 연구되고 있다. 이러한 넓은 분야의 응용을 위해서는 열 적으로 안정된 Ohmic contact을 반드시 실현되어야 한다. n-type GaN의 경우에는 GaN계면에서의 N vacancy가 n-type carrier로 작용하기 때문에 Ti, Al, 같은 금속을 접합하여 nitride를 형성함에 의해서 낮은 접촉저항을 갖는 Ohmic contact을 하기가 쉽다. 그러나 p-type의 경우에는 일 함수가 크고 n-type와 다르게 nitride가 형성되지 않는 금속이 Ohmic contact을 할 가능성이 많다. 시료는 HF(HF:H2O=1:1)에서 10분간 초음파 세척을 한 후 깨끗한 물에 충분히 헹구었다. 그런 후에 고순도 Ar 가스로 건조시켰다. Pd와 Ni은 열적 증착법(thermal evaporation)을 사용하여 p-GaN에 상온에서 증착하였다. 현 연구에서는 열처리에 의한 Pd의 clustering을 줄이기 위해서 wetting이 좋은 Ni을 Pd 증착 전과 후에 삽입하였으며, monchromatic XPS(x-ray photoelectron spectroscopy) 와 SAM(scanning Auger microscopy)을 사용하여 열처리 전과 40$0^{\circ}C$, 52$0^{\circ}C$ 그리고 695$0^{\circ}C$에서 3분간 열처리 후의 온도에 따른 morphology 변화, 계면반응(interfacial reaction) 및 벤드 휨(band bending)을 비교 연구하였다. Nls core level peak를 사용한 band bending에서 Schottky barrier height는 Pd/Ni bi-layer 접합시 2.1eV를, Ni/Pd bi-layer의 경우에 2.01eV를 얻었으며, 이는 Pd와 Ni의 이상적인 Schottky barrier height 값 2.38eV, 2.35eV와 비교해 볼 때 매우 유사한 값임을 알 수 있다. 시료를 후열처리함에 의해 52$0^{\circ}C$까지는 barrier height는 큰 변화가 없으나, $650^{\circ}C$에서 3분 열처리 후에 0.36eV, 0.28eV 만큼 band가 더 ？을 알 수 있었다. Pd/Ni 및 Ni/Pd 접합시 $650^{\circ}C$까지 후 열 처리 과정에서 계면에서 matallic Ga은 온도에 비례하여 많은 양이 형성되어 표면으로 편석(segregation)되어지나, In-situ SAM을 이용한 depth profile을 통해서 Ni/Pd, Pd/Ni는 증착시 uniform하게 성장함을 알 수 있었으며, 후열처리 함에 의해서 점차적으로 morphology 의 변화가 일어나기 시작함을 볼 수 있었다. 이는 $650^{\circ}C$에서 열처리 한후의 ex-situ AFM을 통해서 재확인 할 수 있었다. 이상의 결과로부터 GaN에 Pd를 접합 시 심한 clustering이 형성되어 Ohoic contact에 문제가 있으나 Pd/Ni 혹은 Ni/Pd bi-layer를 사용함에 의해서 clustering의 크기를 줄일 수 있었다. Clustering의 크기는 Ni/Pd bi-layer의 경우가 작았으며, $650^{\circ}C$ 열처리 후에 barrier height는 Pd/Ni bi-layer의 경우에도 Ni의 영향을 받음을 알 수 있었다.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.26 no.2
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• pp.225-236
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• 2016

Objectives: Nanomaterials have been used in various fields. As use of nanoproducts is increasing, workers dealing with nanomaterials are also gradually increasing. Exposure assessments for nanomaterials have been carried out for protection of worker's health in workplace. Exposure studies were mainly focused on manufacturing processes, but these studies on after-treatment processes such as refinement, weighing, and packing were insufficient. So, we investigated exposure characteristics of particles during after-treatment processes of $Al_2O_3$ fibers and Ni powders. Methods: Mass-production of Ni powder process was carried out in enclosed capture-type canopy hood. In a developing stage, $Al_2O_3$ was handled with a local ventilation unit. Exposure characteristics of particles were investigated for $Al_2O_3$ fiber and Ni powder processes during the periods of 10:00 to 16:00, 20 May 2014 and 13:00 to 16:00, 21 May 2014, respectively. Three real-time aerosol instruments were utilized in exposure assessment. A scanning mobility particle sizer(SMPS, nanoscan, model 3910, TSI) and an optical particle counter(OPC, portable aerosol spectrometer, model 1.109, Grimm) were used to determine the particle size distribution in the size range of 10-420 nm and $0.25-32{\mu}m$, respectively. In addition, a nanoparticle aerosol monitor(NAM, model 9000, TSI) was used to measure lung-deposited nanoparticle surface area. Membrane filters(isopore membrane filter, pore size of 100 nm) were also used for air sampling for the FE-SEM(model S-5000H, Hitachi) analysis using a personal sampling pump(model GilAir Plus by 2.5 L/min, Gilian). Conclusions: For Ni powder after-treatment process, only 27% increase in particle concentration was found during the process. However, for $Al_2O_3$ fiber after-treatment process, significant exposure(1.56-3.34 times) was observed during the process.