• Title/Summary/Keyword: $N_2O$ generation

Search Result 269, Processing Time 0.032 seconds

A Decomposition Algorithm for a Local Access Telecommunication Network Design Problem

  • Cho, Geon
    • Journal of the Korean Operations Research and Management Science Society
    • /
    • v.23 no.2
    • /
    • pp.29-46
    • /
    • 1998
  • In this paper, we develop detailed algorithms for implementing the so-called Limited Column Generation procedure for Local Access Telecommunication Network(LATN) design problem. We formulate the problem into a tree-partitioning problem with an exponential number of variables. Its linear programming relaxation has all integral vertices, and can be solved by the Limited Column Generation procedure in just n pivots, where n is the number of nodes in the network. Prior to each pivot. an entering variable is selected by detecting the Locally Most Violated(LMV) reduced cost, which can be obtained by solving a subproblem in pseudo-polynomial time. A critical step in the Limited Column Generation is to find all the LMV reduced costs. As dual variables are updated at each pivot, the reduced costs have to be computed in an on-line fashion. An efficient implementation is developed to execute such a task so that the LATN design problem can be solved in O(n$^2$H), where H is the maximum concentrator capacity. Our computational experiments indicate that our algorithm delivers an outstanding performance. For instance, the LATN design problem with n=150 and H=1000 can be solved in approximately 67 seconds on a SUN SPARC 1000 workstation.

  • PDF

Process Optimization of PECVD SiO2 Thin Film Using SiH4/O2 Gas Mixture

  • Ha, Tae-Min;Son, Seung-Nam;Lee, Jun-Yong;Hong, Sang-Jeen
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2012.02a
    • /
    • pp.434-435
    • /
    • 2012
  • Plasma enhanced chemical vapor deposition (PECVD) silicon dioxide thin films have many applications in semiconductor manufacturing such as inter-level dielectric and gate dielectric metal oxide semiconductor field effect transistors (MOSFETs). Fundamental chemical reaction for the formation of SiO2 includes SiH4 and O2, but mixture of SiH4 and N2O is preferable because of lower hydrogen concentration in the deposited film [1]. It is also known that binding energy of N-N is higher than that of N-O, so the particle generation by molecular reaction can be reduced by reducing reactive nitrogen during the deposition process. However, nitrous oxide (N2O) gives rise to nitric oxide (NO) on reaction with oxygen atoms, which in turn reacts with ozone. NO became a greenhouse gas which is naturally occurred regulating of stratospheric ozone. In fact, it takes global warming effect about 300 times higher than carbon dioxide (CO2). Industries regard that N2O is inevitable for their device fabrication; however, it is worthwhile to develop a marginable nitrous oxide free process for university lab classes considering educational and environmental purpose. In this paper, we developed environmental friendly and material cost efficient SiO2 deposition process by substituting N2O with O2 targeting university hands-on laboratory course. Experiment was performed by two level statistical design of experiment (DOE) with three process parameters including RF power, susceptor temperature, and oxygen gas flow. Responses of interests to optimize the process were deposition rate, film uniformity, surface roughness, and electrical dielectric property. We observed some power like particle formation on wafer in some experiment, and we postulate that the thermal and electrical energy to dissociate gas molecule was relatively lower than other runs. However, we were able to find a marginable process region with less than 3% uniformity requirement in our process optimization goal. Surface roughness measured by atomic force microscopy (AFM) presented some evidence of the agglomeration of silane related particles, and the result was still satisfactory for the purpose of this research. This newly developed SiO2 deposition process is currently under verification with repeated experimental run on 4 inches wafer, and it will be adopted to Semiconductor Material and Process course offered in the Department of Electronic Engineering at Myongji University from spring semester in 2012.

  • PDF

Synthesis and Antitumor Evaluation of cis-(1,2-Diaminoethane) dichloroplatinum (II) Complexes Linked to 5- and 6-Methyleneuracil and -uridine Analogues

  • Kim, Jack-C.;Lee, Min-Hwa;Choi, Soon-Kyu
    • Archives of Pharmacal Research
    • /
    • v.21 no.4
    • /
    • pp.465-469
    • /
    • 1998
  • The search for platinum (II)-based compounds with improved therapeutic properties was prompted to design and synthesize a new family of water-soluble, third generation cis-diaminedichloroplatinum (II) complexes linked to uracil and uridine. Six heretofore unreported uracil and uridine-platinum (II) complexes are; [N-(uracil-5-yl-methyl)ethane-1,2-di-amine]dichloroplatinum (II) (3a), [N-(uracil-6-yl-methyl)ethane-1,2-diaminel dichloroplatinum (II) (3b), t[N-($2^1$, $3^1$,$5^1$-tri-O-acetyl)uridine-5-yl-methyl] ethane-1,2-diamineldichloroplatinum (II) (6a), {[N-($2^1$,$3^1$, $5^1$-tri-O-acetyl) uridine-6-yl-methyl]ethane-1,2-diamine)dichloroplatinum (II) (6b),[N-(uridine- 5-yl-methyl)ethane-1,2-diamine]dichloroplatinum (II) (7a), [N-(uridine-6-yl- methyl)ethane-1,2-diamine]dichloroplatinum (II) (7b). These analogues were prepared from the key starting materials, 5-chloromethyluracil (1a) and 6-chloromethyluracil (1b) which were reacted with ethylenediamine to afford the respective 5-[(2-aminoethyl)aminol methyluracil (2a) and 6-[(2-aminoethyl)amino]methyluracil (2b). The cis-platin complexes 3a and 3b were obtained through the reaction of the respective 2a and 2b with potassium tetrachloroplatinate (II). The heterocyclic nucleic acid bases 1a and 1b were efficiently introduced on the .betha.-D-ribose ring via a Vorbruggen-type nucleoside coupling procedure with hexamethyldisilazane, trimethylchlorosilane and stannic chloride under anhydrous acetonitrile to yield the stereospecific .betha.-anomeric 5-chloromethyl- $2^1$,$3^1$,$5^1$-tri-O-acetyluridine (4a) and 6-chloromethyl-$2^1$,$3^1$,$5^1$-tri-O-acetyluridine (4b), respectively. The nucleosides 4a and 4b were coupled with ethylenediamine to provide the respective 5-[(amino-ethyl)aminolmethyl-$2^1$,$3^1$,$5^1$-tri-O-acetyluridine (5a) and 6-[(aminoethyl)amino] methyl-$2^1$,$3^1$,$5^1$-tri-O-acetyluridine (5b). The diamino-uridines 5a and 5b were reacted with potassium tetrachloroplatinate (II) to give the novel nucleoside complexes, 6a and 6b, respectively which were deacetylated into the free nucleosides, 7a and 7b by the treatment with CH$_{3}$ONa. The cytotoxic activities were evaluated against three cell lines (FM-3A, P-388 and J-82) and none of the synthesized compounds showed any significant activity.

  • PDF

Synthesis of a series of cis-diamminaedichloro-platinum (II) Complexes Linked to Uracil and Uridine as Candidate An-titumor Agents.

  • Kim, Jack-C.;Kim, Mi-Hyang;Kim, Seon-Hee;Choi, Soon-Kyu
    • Archives of Pharmacal Research
    • /
    • v.18 no.6
    • /
    • pp.449-453
    • /
    • 1995
  • The search for patinum (II)-based compounds with improved therapeutic properties was prompted to design and synthesize a new family of water-soluble, third generation cis-diamminedichlorplatinum (II) complexes linked to uracil and uridine. Six heretofore undescribed uracil and uridine-platinum (II) complexes are ; [N-(2-aminoethyl)uracil-5-carboxamide]dichloroplatinum (II)(3a), [N-2(2-aminoethyl)uracil-6-carboxmide]dichloroplatinum (II) (3b),[5-(2-aminorthyl)carbamoyl-2',3',5',-tri-O-acetyluridine] dichloroplatinum (II) (6b), [5-(2-aminoethyl)-carbamoyl]-2',3',5',-tri-O-acetyluridine] dichloroplatinum (II) (6b), [5-(2-aminoethyl)carbamoylu-ridine]dihloroplatinum (II) (7a), [6-(2-aminoethyl)carbamoyluridine]dichloroplatinum (II) (7b). These analogues were prepared from the key starting materials, 5-carboxyuracil (1a) and 6-carboxyuracil (1b) which were reacted with ethylenediamine to afford the respective N-(2-aminoethyl)uracil-5-carboxmide (2a) land N-(2-aminoethyl)uracil-6-carboxamide (2b). The cisplatin complexes 3a and 3b were obtained through the reaction of the respective 2a and 2b ficiently introduced on the .betha.-D-ribose ring via a Vorbruggen-type nucleoside coupling procedure with hexamethyldisilazane, trimethylchlorosilane and stannicchloride under anhydrous acetonitfile to yield the sterospecific .betha.-anomeric 5-carboxy-2',3',5'-tri-O-acetyluridine (4a) and 6-carboxy-2',3',5'-tri-O-acetyluridine (4b), respective 5-(2-aminoethyl)carbamoyl-2',3',5'-tri-O-acetyluridine (5a) and 6-(2-aminoethyl)carbamoyl-2',3',5'-tri-O-acetyluridine (5b). The diamino-uridines 5a and 5b were reacted with potassium tetrachloroplatinate (II) to give the novel nucleoside complexes, 6a and 6b respectively which were deacetylated into the free nucleosides, 7a and 7b by the treatment with CH/sub 3/ONa. The antitumor activities were evaluated against three cell lines (K-562, FM-3A and P-388).

  • PDF

Abnormal Grain Growth in Ferrites

  • Ito, Shigeru
    • Proceedings of the Korean Institute of Resources Recycling Conference
    • /
    • 1999.09a
    • /
    • pp.1-63
    • /
    • 1999
  • Generation of abnormally large grains in the microstructure of small grains has been investigated on some ferrites. Some fractions of large grains were observed in the microstructure of sintered ZnFe$_2$O$_4$, Mn-ZnFe$_2$O$_4$, Fe$_3$O$_4$(in N$_2$) and MnFe$_2$O$_4$(in air). On the other hand, the large grains were not observed in NiFe$_2$O$_4$ and CoFe$_2$O$_4$, independent of calcining and sintering conditions. The large grains seem to be generated in such ferrites that are easy to vary their compositions or valencies at high temperatures. As the sintering proceeded, the number of large grains was increasing to form a continuous structure consisting of large grains, while the size of large grains did not increase remarkably. In addition, the growth of small grains was also very slow during the generation of the large grains. The large grains appeared to be suddenly generated after some induction periods. Avrami equation could be applied to the relation between net volume of large grains and sintering time. Thus, the grain boundaries may be strongly stabilized when the large grains are generated. The large grain in generated by the local activation of the stabilized grain boundaries, which is caused by the variation of compositions or valencies during sintering. It is concluded that the essence of the abnormal grain growth is not the generation of abnormally large grains, but the abnormal stabilization and the local activation of the grain boundaries.

  • PDF

ESTIMATIONS OF HEAT CAPACITIES FOR ACTINIDE DIOXIDE: UO2, NpO2, ThO2, AND PuO2

  • Eser, E.;Koc, H.;Gokbulut, M.;Gursoy, G.
    • Nuclear Engineering and Technology
    • /
    • v.46 no.6
    • /
    • pp.863-868
    • /
    • 2014
  • The evaluation of thermal properties of actinide oxide fuels is a problem of high importance for the development of new generation reactors. In the present study, an expression obtained for n-dimensional Debye functions is used to derive a simple analytical expression for the specific heat capacity of nuclear fuels. To test the validity and reliability of this expression, the analytical expression is applied to $UO_2$, $NpO_2$, $ThO_2$, and $PuO_2$. It is seen that the formula was in agreement with the experimental and theoretical results reported in the literature.

A Study for a Capacitated Facility Location Problem on a Tree Structured Network (나무구조를 갖는 네트워크상에서의 제한용량이 있는 입지설정문제에 관한 연구)

  • Cho, Geon
    • Journal of Korean Institute of Industrial Engineers
    • /
    • v.27 no.3
    • /
    • pp.250-259
    • /
    • 2001
  • Given a tree structured network in which each node has its own demand and also stands for a candidate location of a potential facility, such as plant or warehouse, a capacitated facility location problem on the network (CFLPOT) is to decide capacitated facility locations so that the total demand occurred on the network can be satisfied from those facilities with the minimum cost. In this paper, we first introduce a mixed integer programming formulation for CFLPOT with two additional assumptions, the indivisible demand assumption and the contiguity assumption and then show that it can be reformulated as a tree partitioning problem with an exponential number of variables. We then show that it can be solved in O($n^2b$) time by utilizing the limited column generation method developed by Shaw (1993), where n is the total number of nodes in the network and b is the maximum facility capacity. We also develop a depth-first dynamic programming algorithm with a running time of O(nb) for finding the locally maximal reduced cost which plays an important role in the limited column generation method. Finally, we implement our algorithms on a set of randomly generated problems and report the computational results.

  • PDF

Etching Property of the TaN Thin Film using an Inductively Coupled Plasma (유도결합플라즈마를 이용한 TaN 박막의 식각 특성)

  • Um, Doo-Seung;Woo, Jong-Chang;Kim, Dong-Pyo;Kim, Chang-Il
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2009.06a
    • /
    • pp.104-104
    • /
    • 2009
  • Critical dimensions has rapidly shrunk to increase the degree of integration and to reduce the power consumption. However, it is accompanied with several problems like direct tunneling through the gate insulator layer and the low conductivity characteristic of poly-silicon. To cover these faults, the study of new materials is urgently needed. Recently, high dielectric materials like $Al_2O_3$, $ZrO_2$ and $HfO_2$ are being studied for equivalent oxide thickness (EOT). However, poly-silicon gate is not compatible with high-k materials for gate-insulator. To integrate high-k gate dielectric materials in nano-scale devices, metal gate electrodes are expected to be used in the future. Currently, metal gate electrode materials like TiN, TaN, and WN are being widely studied for next-generation nano-scale devices. The TaN gate electrode for metal/high-k gate stack is compatible with high-k materials. According to this trend, the study about dry etching technology of the TaN film is needed. In this study, we investigated the etch mechanism of the TaN thin film in an inductively coupled plasma (ICP) system with $O_2/BCl_3/Ar$ gas chemistry. The etch rates and selectivities of TaN thin films were investigated in terms of the gas mixing ratio, the RF power, the DC-bias voltage, and the process pressure. The characteristics of the plasma were estimated using optical emission spectroscopy (OES). The surface reactions after etching were investigated using X-ray photoelectron spectroscopy (XPS) and auger electron spectroscopy (AES).

  • PDF

Effect of Intermittent Plasma Discharge on the Hydrocarbon Selective Catalytic Reduction of Nitrogen Oxides (간헐적 플라즈마 방전이 질소산화물의 탄화수소 선택적 촉매환원에 미치는 영향)

  • Kyeong-Hwan Yoon;Y. S. Mok
    • Applied Chemistry for Engineering
    • /
    • v.34 no.5
    • /
    • pp.507-514
    • /
    • 2023
  • The selective catalytic reduction (SCR) of nitrogen oxides (NOx) was investigated in a catalyst (Ag/γ-Al2O3) packed dielectric barrier discharge plasma reactor. The intermittent generation of plasma in the catalyst bed partially oxidized the hydrocarbon reductant for NOx removal to several aldehydes. Compared to using the catalyst alone, higher NOx conversion was observed with the intermittent generation of plasma due to the formation of highly reductive aldehydes. Under the same operating conditions (temperature: 250 ℃; C/N: 8), the NOx reduction efficiencies were 47.5%, 92%, and 96% for n-heptane, propionaldehyde, and butyraldehyde, respectively, demonstrating the high NOx reduction capability of aldehydes. To determine the optimal condition for intermittent plasma generation, the high voltage on/off cycle was adjusted from 0.5 to 3 min. The NOx reduction performance was compared between continuous and intermittent plasma generation on the same energy density basis. The highest NOx reduction efficiency was achieved at 2-min high voltage on/off intervals. The reason that the intermittent plasma discharge exhibited higher NOx reduction efficiency even at the same energy density, compared to the continuous plasma generation case, is that the intermediate products, such as aldehydes generated from hydrocarbon, were more efficiently utilized for the reduction of nitrogen oxides.

Memory Effect of $In_2O_3$ Quantum Dots and Graphene in $SiO_2$ thin Film

  • Lee, Dong Uk;Sim, Seong Min;So, Joon Sub;Kim, Eun Kyu
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2013.08a
    • /
    • pp.240.2-240.2
    • /
    • 2013
  • The device scale of flash memory was confronted with quantum mechanical limitation. The next generation memory device will be required a break-through for the device scaling problem. Especially, graphene is one of important materials to overcome scaling and operation problem for the memory device, because ofthe high carrier mobility, the mechanicalflexibility, the one atomic layer thick and versatile chemistry. We demonstrate the hybrid memory consisted with the metal-oxide quantum dots and the mono-layered graphene which was transferred to $SiO_2$ (5 nm)/Si substrate. The 5-nm thick secondary $SiO_2$ layer was deposited on the mono-layered graphene by using ultra-high vacuum sputtering system which base pressure is about $1{\times}10^{-10}$ Torr. The $In_2O_3$ quantum dots were distributed on the secondary $SiO_2$2 layer after chemical reaction between deposited In layer and polyamic acid layer through soft baking at $125^{\circ}C$ for 30 min and curing process at $400^{\circ}C$ for 1 hr by using the furnace in $N_2$ ambient. The memory devices with the $In_2O_3$ quantum dots on graphene monolayer between $SiO_2$ thin films have demonstrated and evaluated for the application of next generation nonvolatile memory device. We will discuss the electrical properties to understating memory effect related with quantum mechanical transport between the $In_2O_3$ quantum dots and the Fermi level of graphene layer.

  • PDF