• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.16-16
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• 2009

ZnO($Zn_{1+x}O$)는 n-type 반도성 세라믹스로 우수한 전기적, 광학적, 화학적 특성을 갖고 있어 바리스터, 투명 전도막, 화학 및 바이오 센서, UV light emitter 등 다양한 용도로 사용되고 있다. 또한 ZnO에 각종 천이 금속 산화물을 일정량 첨가함에 따라 발생하는 결함준위와 입계 특성의 변화에 대한 연구가 활발히 진행되고 있다. 다양한 천이 금속 산화물의 첨가에 따른 전기적 광학적 특성의 변화에 대한 결과들이 많이 보고되고 있지만 서로 상충되거나 해석상 다소 어려운 것으로 알려져 있다. 따라서 본 연구에서는 ZnO에 $Cr_2O_3$를 2.0 at% 첨가하여 Cr 첨가에 따른 ZnO의 결함준위와 입계 특성 변화에 대하여 각종 유전함수($Z^*$, $Y^*$, $M^*$, $\varepsilon^*$, and $tan{\delta}$)를 이용하여 고찰하였다 ZnO에 Cr을 첨가할 경우 결함 중 장범위 쿨롱 인력에 의한 결함(0.13~0.18 eV)이 ~100K 영역에서 나타났으며, ZnO 내 결함 중 대표적인 $Zn_j$와 $V_o$는 서로 겹쳐서 나타났다. 이들 중첩된 결함에 대하여 각종 유전함수를 이용할 경우 서로 분리해 낼 수 있는 강점이 있음을 논하였다. 또한 각 결함준위가 강는 정전용랑(C)과 저항(R)을 impedance-modulus spectroscopy를 이용하여 구한 결과, 소결온도가 높아질수록 정전용량은 증가하였으며, 측정온도가 놓아질수록 높아지는 경향을 나타내었다. 입계의 정전용량은 소결온도가 높아질수록 높아 지지만 측정온도가 높아질수록 낮아지는 경향을 나타내었다. 각 저항값은 소결온도 및 측정온도가 높아질수록 지수적으로 감소하였다. 또한 분포함수를 이용하여 입계 안정성에 대하여 고찰하였다.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.80-80
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• 2010

전자제품의 소형화, 경량화, 고집적화가 심화됨에 따라 전자제품을 구성하는 회로의 미세화 또한 요구되고 있다. 이러한 요구는 경성회로기판 (rigid printed circuit board, RPCB) 뿐만 아니라 연성회로기판 (flexible printed circuit board, FPCB) 에도 적용되고 있으며 이에 대한 많은 연구 또한 이루어지고 있다. 연성회로기판은 일반적으로 절연층을 이루는 폴리이미드 (polyimide, PI)와 전도층을 이루는 구리로 이루어져 있다. 폴리이미드는 뛰어난 열적 화학적 안정성, 우수한 기계적 특성, 연속공정이 가능한 장점을 가지고 있으나, 고온다습한 환경하에서 높은 흡습성으로 인해 전도층을 이루는 구리와의 접합특성이 저하되는 단점 또한 가지고 있다. 또한 전도층을 이루는 구리는 고온다습한 환경하에서 산화 발생이 용이하기 때문에 접합특성의 감소를 야기할 수 있다. 따라서 본 연구에서는 고온다습한 조건하에서 sputtering and plating 공정을 통해 순수 Cr seed layer를 가지는 연성회로기판의 seed layer의 두께와 시효시간의 변화로 인해 발생하는 접합특성의 변화를 관찰하고 분석하였다. 본 연구에서는 두께 $25{\mu}m$의 일본 Kadena사(社)에서 제작된 폴리이미드 상에 sputtering 공정을 통해 순수 Cr으로 이루어진 각각 두께 100, 200, $300{\AA}$의 seed layer를 형성한 후 전해도금법을 이용, 두께 $8{\mu}m$의 구리 전도층을 형성한 시료를 사용하였다. 제작된 시료는 고온다습한 환경하에서의 접합 특성의 변화를 관찰하기 위하여 $85^{\circ}C$/85%RH 항온항습 조건하에서 각각 24, 72, 120, 168시간 동안 시효처리 한 후, Interconnections Packaging Circuitry (IPC) 규격에 의거하여 접합강도를 측정하였다. 시료의 전도층은 폭 3.2mm 길이 230mm의 패턴을 가지도록, 절연층은 폭 10mm, 길이 230mm으로 구성되었으며 이를 50.8mm/min의 박리 속도로 각 시편당 8회의 $90^{\circ}$ peel test를 실시하였다. 파면의 형상과 화학적 조성을 분석하기 위해 SEM (Scanning electron microscope)과 EDS (Energy-dispersive X-ray spectroscopy)를 사용하였으며, 파면의 조도 측정을 위해 AFM (Atomic force microscope)을 사용하였다. 또한 계면의 화학적 결합상태를 분석하기 위해 XPS (X-ray photoelectron spectroscopy)를 통해 파면을 관찰 분석하였다.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.75-75
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• 2009

연성회로기판은 일반적으로 절연체를 이루는 폴리이미드와 전도체를 이루는 구리로 구성되어 있다. 폴리이미드는 뛰어난 열적 화학적 안정성, 기계적 특성, 공정성 등의 장점으로 인해 연성회로기판의 절연체로서 제안되었지만 전도체를 이루는 구리와의 접합 특성이 우수하지 않기 때문에 많은 연구가 현재까지 진행되고 있고, 그 결과 연성회로기판의 접합 특성에 많은 개선이 이루어짐과 동시에 다양한 공정 방법이 제안되고 있다. 하지만 고온다습한 환경에서 사용될 경우 폴리이미드의 높은 흡습성과, 구리와 seed layer의 산화 문제로 인해 접합 특성이 저하된다는 단점 또한 가지고 있다. 따라서 본 연구를 통해 고온다습한 조건하에서 seed layer가 80Ni/20Cr 합금으로 구성된 연성회로기판의 seed layer의 두께와 시효시간으로 인해 발생하는 접합 신뢰성의 차이를 관찰하였다. 본 연구에서는 두께 $25{\mu}m$의 폴리이미드 위에 각각 100, 200, $300{\AA}$ 두께의 80Ni/20Cr의 합금 조성을 가지는 seed layer를 스퍼터링 공정을 통해 형성한 후 전해도금법을 이용하여 $8{\mu}m$ 두께의 구리 전도층을 형성하였다. 접합 특성 평가를 위해 ICP 규격에 따라 전도층 패턴을 폭 3.2mm, 길이 230mm로 시편을 제작하여 50.8mm/min의 이송 속도로 각 시편당 8회의 $90^{\circ}$ peel test를 실시하였다. 또한 $85^{\circ}C$/85% 항온항습 조건하에서 각각 24, 72, 120, 168시간 동안 시효 처리 후 같은 방법으로 연성회로기판의 접합 특성을 평가하였다. 파면의 형상과 조성을 분석하기 위해 SEM (Scanning electron microscope)과 EDS (Energy-dispersive X-ray spectroscopy)를 사용하였으며, 파면의 조도 측정을 위해 AFM (Atomic force microscope)을 사용하였다. 또한 파면의 잔여물 분석을 위해 EPMA (Energy probe microanalysis)를 사용하였고 계면의 화학적 결합상태를 분석하기 위해 XPS (X-ray photoelectron spectroscopy)를 통해 파면을 분석하였다.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2004.08a
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• pp.285-293
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• 2004

Oxidation behavior of 304 and 430 stainless steel were studied using thin film X-ray analysis and glow discharge spectrum analysis (here-after GDS). The oxidation layer of 304 stainless steel was composed of $Cr_2O_3\;and\;FeCrO_4$ and its thickness was about $1.5{\mu}m$ after $1\~5$ minutes of annealing at $1120^{\circ}C$ open air. However, the oxidation layer of 430 stainless steels was mainly composed of $Cr_2O_3$ and its typical thickness was 0.5um after $1\~5$ minutes of annealing at $1000^{\circ}C$ open air. Electro-chemical analysis revealed that the descaling of oxidation layer could be activated by Fe, Cr dissolution from the matrix behind the oxidation layer at the current density of $5\~10ASD$ and by Fe, Cr-oxide dissolution from the oxidation layer at the current density over than 10ASD. Electrolytic stripping of 430 and 304 revealed the intial incubation period of descaling by oxygen evolving at low current density range such as $5\~10ASD$. However the dissolution of oxide layer was occurred when applying the anodic current of $10\~20ASD$ on 430 and 304 stainless steels. It was suggested that the electrolytic pickling of high Cr bearing stainless steel such as 430 and 304 seemed to be the more effective in the high current density range such as $10\~20ASD$ than the low current density range such as $5\~10ASD$.

• Journal of the Korean Vacuum Society
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• v.7 no.s1
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• pp.160-166
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• 1998

The field emission characteristics of defective diamond films grown by microwave plasma enhanced chemical vapor deposition (MPECVD) have been studied. X-ray diffraction, the poor crystal quality and/or small grain sizes of the diamond phase and the inclusion of the non-diamond carbon phases in these films have been condirmed by raman spectroscopy, scanning electron microscopy, atomic force microscopy, and the reflectance measurements. The degrees of the film defectiveness and the emission characteristics were dependent on the methane concentration. Current-versus-voltage measurements have demonstrated that the defective diamond films have good electron emission characteristics. characteristics strongly suggests the defect-related electron-emission mechanism. The defective diamond films deposited on Si substrates show the field emission current density of 1$\mu\textrm{A}/\textrm{cm}^2$ and 1mA/$\textrm{cm}^2$ have been measured at electric fields as low as 4.5V/$\mu\textrm{m}$ and 7.6V/$\mu\textrm{m}$, respectively. We also observed the similar emission characteristics from the defective diamond film deposited on Cr/Si substrate and could decrease the deposition temperature to $600^{\circ}C$.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.14 no.1
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• pp.56-63
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• 2004

Exact solutions are presented for the free vibration and buckling of rectangular plates haying two opposite edges ( x=0 and a) simply supported and the other two ( y=0 and b) clamped, with the simply supported edges subjected to a linearly varying normal stress $\sigma$$_{x}$=- $N_{0}$[1-a(y/b)]/h, where h is the plate thickness. By assuming the transverse displacement ( w) to vary as sin(m$\pi$x/a), the governing partial differential equation of motion is reduced to an ordinary differential equation in y with variable coefficients. for which an exact solution is obtained as a power series (the method of Frobenius). Applying the clamped boundary conditions at y=0 and byields the frequency determinant. Buckling loads arise as the frequencies approach zero. A careful study of the convergence of the power series is made. Buckling loads are determined for loading parameters a= 0, 0.5, 1, 1.5. 2, for which a=2 is a pure in-plane bending moment. Comparisons are made with published buckling loads for a= 0, 1, 2 obtained by the method of integration of the differential equation (a=0) or the method of energy (a=1, 2). Novel results are presented for the free vibration frequencies of rectangular plates with aspect ratios a/b =0.5, 1, 2 when a=2, with load intensities $N_{0}$ / $N_{cr}$ =0, 0.5, 0.8, 0.95, 1. where $N_{cr}$ is the critical buckling load of the plate. Contour plots of buckling and free vibration mode shapes ate also shown.shown.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2002.02a
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• pp.339-339
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• 2002

In the RABiTS approach to coated conductor development, successful (both economic and technological) depends on the refinement and optimization of each of three important components: the metal tape substrate, the buffer layer(s), and the HTS layer. Here we will report on the ORNL approach and progress in each of these areas. - Most applications will require metal tapes with low magnetic hysteresis, mechanical strength, and excellent crystalline texture. Some of these requirements are competing. We report on progress in obtaining a good combination of these characteristics on metal alloys of Ni-Cr and Ni-W. - The deposition of appropriate buffer layers is a crucial step. Recently, base research has shown that the presence of a stable sulfur superstructure present on the metal surface is needed for the nucleation and epitaxial growth of vapor-deposited seed buffer layers such as YSZ, CeO$_2$ and SrTiO$_3$. We report on the details and control of this superstructure for nickel tapes, as well as recent results for Cu and Ni-13%Cr. - Processes for deposition of the HTS coating must economically provide large values of the figure-of-merit for conductors, current x length. At ORNL, we have devoted efforts to a precursor/post-annealing approach to YBCO coatings, for which the deposition and reaction steps are separate. We describe motivation for and progress toward developing this approach. - Finally, we address some issues for the implementation of coated conductors in real applications, including the need for texture control and electrical stabilization of the HTS coating.

• Journal of the Korean Vacuum Society
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• v.16 no.2
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• pp.79-90
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• 2007

Prototype of $800{\ell}$ vacuum web coater (Vic Mama) consisting of ion source with low energy less than 250 eV for high speed surface modification and 4 magnetron sputter cathodes was designed and constructed. Its performance was evaluated through fabricating the adhesiveless flexible copper clad laminate (FCCL). Pumping speed was monitored in both upper noncoating zone pumped down by 2 turbo pumps with 2000 l/sec pumping speed and lower surface modification and sputter zone vacuumed by turbo pumps with 450 1/sec and 1300 1/sec pumping speed respectively. Ion current density, plasma density, and uniformity of ion beam current were measured using Faraday cup and the distribution of magnetic field and erosion efficiency of sputter target were also investigated. With the irradiation of ion beams on polyimide (Kapton-E, $38{\mu}m$) at different fluences, the change of wetting angle of the deionized water to polyimide surface and those of surface chemical bonding were analyzed by wetting anglometer and x-ray photoelectron spectroscopy. After investigating the deposition rate of Ni-Cr tie layer and Cu layer was investigated with the variations of roll speed and input power to sputter cathode. FCCL fabricated by sputter and electrodeposition method and characterized in terms of the peel strength, thermal and chemical stability.

• Journal of Electrochemical Science and Technology
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• v.6 no.2
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• pp.65-74
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• 2015

This work examines the characterization and corrosion behaviour of laser alloyed UNSG10150 steel with three different premixed composition Zn-Sn binary powders using a 4.4 kW continuous wave (CW) Rofin Sinar Nd:YAG laser processing system. The steel alloyed samples were cut to corrosion coupons, immersed in sulphuric acid (0.5 M H₂SO₄) solution at 30℃ using electrochemical technique and investigated for its corrosion behaviour. The morphologies and microstructures of the developed coated and uncoated samples were characterized by Optic Nikon Optical microscope (OPM) and scanning electron microscope (SEM/EDS). Moreover, X-ray diffractometer (XRD) was used to identify the phases present. An enhancement of 2.7-times the hardness of the steel substrate was achieved in sample A₁ which may be attributed to the fine microstructure, dislocations and the high degree of saturation of solid solution brought by the high scanning speed. At scanning speed of 0.8 m/min, sample A₁ exhibited the highest polarization resistance R_p (1081678 Ωcm² ), lowest corrosion current density i_corr (4.81×10⁻⁸A/cm² ), and lowest corrosion rate Cr (0.0005 mm/year) in 0.5 M H₂SO₄. The polarization resistance R_p (1081678 Ωcm² ) is 67,813-times the polarization of the UNSG10150 substrate and 99.9972% reduction in the corrosion rate.

• Proceedings of the KSME Conference
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• 2001.11a
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• pp.180-185
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• 2001

In the life assessment for plant structural component, the research on deterioration of toughness and material properties occurred in weldments has been considered as very important problems. In general, the microstructures composed in weldments are hugely classified with weld metal(W.M), fusion line(F.L), heat affected zone(HAZ), and base metal(B.M). It has been reported that the creep characteristics on weldments having variable microstructures could be unpredictably changed. Furthermore, it is also known that HAZ adjacent to F.L exhibits the decreased creep strength compared to those in base or weld metals, and promotes the occurrence of Type III and Type IV cracking due to the growth of grains and the coarsening carbides precipitated in ferritic matrix by welding and PWHT processes. However, the lots of works reported up to date on creep damage in power plant components have been mostly conducted on B.M and the creep properties on a localized microstructures in weldments have not as yet been throughly investigated. In this paper, for various microstructures such as coarse grain HAZ(CGHAZ), W.M and B.M in X20CrMoV121 steel weldment, the small punch-creep(SP-Creep) test using miniaturized specimen(t=0.5mm, 0.25mm) is performed to investigate a possibility for creep characteristics evaluation.