• Title/Summary/Keyword: $J_{IC}$

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Algorithm for Segmenting Resin Bleed and Melting on the Surface of QFN Packages (QFN 패키지의 Resin Bleed와 Melting 검출 알고리즘)

  • Wang, Ming-Jie;Park, Duck-Chun;Joo, Hyo-Nam;Kim, Joon-Seek
    • Journal of Institute of Control, Robotics and Systems
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    • v.15 no.9
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    • pp.899-905
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    • 2009
  • There are many different types of surface defects on semiconductor Integrated Chips (IC's) caused by various factors during manufacturing process, such as Scratch, Flash, Resin bleed, and Melting. These defects must be detected and classified by an inspection system for productivity improvement and effective process control. Among defects, in particular, Resin bleed and Melting are the most difficult ones to classify accurately. The brightness value and the shape of Resin bleed and Melting defects are so similar that normally it is difficult to classify the Resin bleed and Melting. In this paper, we propose a segmenting method and a set of features for detecting and classifying the Resin bleed and Melting defects.

Mosfet Models, Quantum Mechanical Effects and Modeling Approaches: A Review

  • Chaudhry, Amit;Roy, J.N.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.10 no.1
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    • pp.20-27
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    • 2010
  • Modeling is essential to simulate the operation of integrated circuit (IC) before its fabrication. Seeing a large number of Metal-Oxide-Silicon Field-Effect-Transistor (MOSFET) models available, it has become important to understand them and compare them for their pros and cons. The task becomes equally difficult when the complexity of these models becomes very high. The paper reviews the mainstream models with their physical relevance and their comparisons. Major short-channel and quantum effects in the models are outlined. Emphasis is set upon the latest compact models like BSIM, MOS Models 9/11, EKV, SP etc.

Synthesis of New Pyrimidinylaminobenzene Derivatives and Their Antiproliferative Activities against Melanoma Cell Line

  • Kim, Hee Jin;Oh, Chang-Hyun;Yoo, Kyung Ho
    • Bulletin of the Korean Chemical Society
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    • v.34 no.8
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    • pp.2311-2316
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    • 2013
  • A series of new diarylamide and diarylurea derivatives possessing pyrimidinylaminobenzene scaffold was synthesized. Their in vitro antiproliferative activities were tested against A375P human melanoma cell line. Among them, compounds 1a-c, k and 2b-d, f, g, j, l showed superior potencies against A375P human melanoma cell line to Sorafenib. In particular, compound 2f possessing 3-fluoro-5-trifluoromethyl moiety exhibited the highest potency with $IC_{50}$ value in nanomolar scale.

SOC Estimation Algorithm based on the Coulomb Counting Method and Extended Kalman Filter for a LiFePO4 Battery (확장 칼만 필터를 이용한 전류 적산법 기반의 리튬 폴리머 배터리 SOC 추정)

  • Chun, C.Y.;Cho, B.H.;Kim, J.H.
    • Proceedings of the KIPE Conference
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    • 2012.07a
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    • pp.271-272
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    • 2012
  • 전류 적산법(Coulomb counting, ampere counting)을 이용한 배터리 SOC(State-of-Charge) 추정 방법은 상용화된 IC를 사용할 수 있기에 구현이 간단하고 SOC 정의를 통해 배터리 사용 가능한 시간을 쉽게 예측할 수도 있다. 하지만 초기 SOC 오류와 누적되는 전류 정보의 오차로 인해 추정이 실패하는 단점이 존재하기 때문에 이를 해결해주는 알고리즘이 필요하다. 본 논문에서는 전류 적산법 기반의 배터리 SOC 추정 회로에 확장 칼만 필터(EKF, Extended Kalman Filter)를 접목하여 전류 적산법을 이용하였을 때 나타날 수 있는 오차 누적을 줄이는 알고리즘을 제안한다. 또한 실험을 통해 제안된 배터리 SOC 추정 회로의 성능을 확인해본다.

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DC Bias Circuit and CTR Design of Off-Line Current-Mode-Controlled Flyback Converters with Optocoupler Isolation (Optocoupler 절연을 적용한 오프라인 전류모드제어 플라이백 변환기의 직류 바이어스 회로 해석 및 CTR 설계)

  • Lee, Seungjun;Kim, Hansang;Choi, Byungcho
    • Proceedings of the KIPE Conference
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    • 2015.07a
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    • pp.227-228
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    • 2015
  • 본 논문에서는 Optocoupler 절연형 오프라인 플라이백 변환기 궤환 단의 직류 바이어스 해석 기법을 제안한다. 직류 바이어스 해석을 통해 목표한 Current Transfer Ratio(CTR)를 얻고 Junction Capacitance($C_j$)를 측정하여 제어기 설계에 적용시켜 안정도 및 성능을 측정하였다. NCP1230, PC817, TL431 IC를 이용하여 플라이백 변환기의 제어회로를 제작하였고, 시뮬레이션을 이용해 직류 바이어스 해석 기법의 타당성을 검증하였다.

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Implementation of interleaved Critical mode Flyback type DC-AC inverter using digital controller (디지털 제어를 이용한 Interleaving CRM 플라이백 타입 DC-AC 인버터의 구현)

  • Kim, J.T.;Lee, K.C.;Seo, G.S.;Hyeon, B.C.;Bae, H.S.;Cho, B.H.
    • Proceedings of the KIPE Conference
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    • 2010.11a
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    • pp.13-14
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    • 2010
  • 본 논문에서는 경계 모드(Critical Mode) 플라이백 타입의 DC-AC 인버터에 인터리빙을 적용한 디지털 제어를 제안한다. 연속모드(CCM)나 불연속모드(DCM)와 달리 경계 모드의 경우 주파수가 가변되기 때문에 인터리빙으로 구현하기는 상당히 까다로운 측면이 있다. 또한 아날로그 제어기로 구현에 한계를 지니기 때문에 보다 간편한 구현을 위해 디지털 제어IC을 이용하여 구현하는 방법에 대해 기술한다. 본문에서 200W급 플라이백 타입의 DC-AC 인버터에 경계모드 인터리빙을 방법을 적용한 후 실험으로 검증한다.

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Measures for the Failure Evaluation of SNF Cladding During the Transportation

  • Noh, J.S.;Kim, H.A.;Kim, T.W.
    • Proceedings of the Korean Radioactive Waste Society Conference
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    • 2018.11a
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    • pp.105-106
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    • 2018
  • It is important to set up a reasonable failure criterion for cladding, because being able to determine the cladding integrity during transportation is essential for the evaluation of SNF transportation system. There are a few of measures which can be used as a failure criterion for cladding subjected to its specific failure mode. Therefore, to select and to use appropriate failure criterion measures, i.e. strain(UE), $K_{IC}$, and CSED would be a key in evaluating the cladding integrity during transportation with every aspects. In order to justify and quantify that criterion properly, various experiments for the mechanical properties of the claddings with different conditions shall be implemented, which data will enable to justify the failure criteria proposed.

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The Use of Bull Round Spermatids for Producing Reconstructed Embryos

  • S.A. Ock;D.O. Kwack;Park, G.J.;S.Y. Choe
    • Proceedings of the Korean Society of Developmental Biology Conference
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    • 2003.10a
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    • pp.133-133
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    • 2003
  • Recently, sperm has been used as a vector to carry exogenous genes for the production of transgenic animals. However, the success in cattle is low, due to deficiencies in oocyte activation and sperm decondensation caused by high disulphide bond (S=S) content in mature sperm. This study was carried out to develop an effective method for producing transgenic animals with round spermatids (RS). Two methods of embryo production - electric fusion (EC) or intracyto-plasmic injection (IC) and three activation treatments were compared. RS were isolated from bull testes by Percoll density gradients (20, 35, 40, 45 and 90%). Fusion between ooplast and RS was performed with a single DC electric pulse (1.0 KV/cm, 45 sec) in 0.28 M mannitol solution supplemented with 100 M CaCl2 and 100 M MgCl$_2$. (중략)

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THE CLASSIFICATION AND PHYSICS OF SUPERNOVAE

  • Wheeler, J. Craig
    • Publications of The Korean Astronomical Society
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    • v.8 no.1
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    • pp.169-177
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    • 1993
  • Observed spectra of supernovae allow the empirical classification of supernovae into two basic categories, Type I with little or no evidence of hydrogen, and Type II with obvious evidence for hydrogen. The broad class of Type I can be subdivided depending on whether helium or silicon and other intermediate mass elements is observed. Understanding the physical processes that underlie these classifications---the progenitor evolution. the explosion mechanism, and end products---requires calculation of radiative transfer and model spectra. While most Type II occur in evolved massive stars that undergo core collapse. some may span the dividing line between degenerate and non-degenerate carbon burning and involve both core collapse and thermonuclear explosion. Type Ia are still most plausibly explained as thermonuclear explosions in carbon/oxygen white dwarfs in binary systems. Type Ib reveal helium atmospheres and are probably the result of core collapse in the helium core of a massive star that has lost its hydrogen envelope to a binary companion or to a wind. Type Ic supernovae are probably related to Type Ib but have also lost their helium envelope to reveal a mantle rich in oxygen.

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Development Trends in Advanced Packaging Technology of Global Foundry Big Three (글로벌 파운드리 Big3의 첨단 패키징 기술개발 동향)

  • H.S. Chun;S.S. Choi;D.H. Min
    • Electronics and Telecommunications Trends
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    • v.39 no.3
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    • pp.98-106
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    • 2024
  • Advanced packaging is emerging as a core technology owing to the increasing demand for multifunctional and highly integrated semiconductors to achieve low power and high performance following digital transformation. It may allow to overcome current limitations of semiconductor process miniaturization and enables single packaging of individual devices. The introduction of advanced packaging facilitates the integration of various chips into one device, and it is emerging as a competitive edge in the industry with high added value, possibly replacing traditional packaging that focuses on electrical connections and the protection of semiconductor devices.