• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1878-1880
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• 2005

In this research, We investigated the effect of $O_2/O_3$ Plasma treatment of indium-tin oxide (ITO) surface on the performance of organic light emitting devices (OLEDs). The OLED had a structure of ITO/N,N'-diphenyl-N,N' -(3-methylphenyl)-1, 1'-biphenyl-4-4'-diamine (TPD)/Tris (8-hydroxyquinolinato) Aluminum $(Alq_3)/Al$. The ITO surface was treated by $O_2/O_3$ plasma with different RF power chamber pressure and exposure time. As a result, the emission efficiency of the OLEDs could be improved obviously.

• Journal of Korean Society for Atmospheric Environment
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• v.16 no.3
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• pp.247-256
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• 2000

Basic characteristics of non-thermal plasma process to remove C2H4 and NO have been experimentally investigated with a packed-bed type reactor and an ac power supply. The performance of the non-thermal plasma generated by ac power supply was compared with that of a wire-plate type reactor equipped with a pulsed power supply. The result shows that the non-thermal plasma can be effectively generated with an AC power supply that can be easily fabricated with conventional techniques. In order to understand the basic reaction mechanisms of the non-thermal plasma process, parametric tests for different carrier gases(air and nitrogen) and for different reaction pathways have been performed. The test results show that O3 generated by non-thermal plasma plays an dominant role to oxidize C2H4 and NO over N and O radicals when these pollutant gases are carried by dry air under room temperature condition. Experimental observations, however, indicate that N and O radicals can significantly affect on the removal process of the pollutant gases under certain conditions.

• Journal of the Korean Vacuum Society
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• v.17 no.3
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• pp.199-203
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• 2008

The effects of surface treatment by $O_2$ plasma on the Bio-FETs were investigated by using the pseudo-MOSFETs on the SOI substrates. After a surface treatment by $O_2$ plasma with different RF powers, the current-voltage and field effect mobility of pseudo-MOSFETs were measured by applying back gate bias. The subthreshold characteristics of pseudo-MOSFETs were significantly degraded with increase of RF power. Additionally, a forming gas anneal process in 2 % diluted $H_2/N_2$ ambient was developed to recover the plasma process induced surface damages. A considerable improvement of the subthreshold characteristics was achieved by the forming gas anneal. Therefore, it is concluded that the pseudo-MOSFETs are a powerful tool for monitoring the surface treatment of Bio-FETs and the forming gas anneal process is effective for improving the electrical characteristics of Bio-FETs.

• Journal of Magnetics
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• v.5 no.3
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• pp.99-101
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• 2000

Oxygen-plasma effects of single crystal and thin film samples of $La_{0.7}Ca_{0.3}MnO_{3-\delta}$ have been studied. Our resistivity measurements indicate that oxygen plasma treatment gives rise to oxygen diffusion into bulk regions, which results in a decrease of $Mn^{3+}$ concentration in oxygen nonstoichiometric $La_{0.7}Ca_{0.3}MnO_{3-\delta}$ and in the activation energies of Holstein's small polarons in the paramagnetic region.

• Proceedings of the Korean Magnestics Society Conference
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• 2000.09a
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• pp.268-272
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• 2000

Oxygen-plasma effects of single crystal and thin film samples of L $a_{0.7}$C $a_{0.3}$Mn $O_{3-}$$\delta$/ have been studied. Our resistivity measurements indicate that oxygen plasma treatment gives rise to oxygen diffusion into bulk regions, which results in a decrease of M $n^{3+}$ concentration in oxygen nonstoichiometric L $a_{0.7}$C $a_{0.3}$Mn $O_{3-}$$\delta$/ and in the activation energies of Holstein's small polarons in the paramagnetic region.n.egion.n.n.

• Journal of the Korean Vacuum Society
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• v.4 no.S1
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• pp.1-6
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• 1995

Polycrystalline Si films have been used in many applications such as thin film transistors(TFT), image sensors and LSI applications. In this research deposition of Si films at low temperatures with remote plasma enhanced CVD from Si2H6-SiF4-H2 on SiO2 was studied and their crystallinity was investigated. It was condluded that growth of crystalline Si films was favorable with (1) low Si2H6 flow rates, (2) moderate plasma power, (3) moderate SiF4 flow rates, (4) moderate substrate temperature, and (5) suitable method of surface cleaning.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.147-148
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• 2007

The compound, Ti3(Al,Si)C2, was synthesized by hot pressing a powder mixture of TiCX, Al and Si. Its oxidation at 900 and 1000 oC in air for up to 50 h resulted in the formation of rutile-TiO2, -Al2O3 and amorphous SiO2. During oxidation, Ti diffused outwards to form the outer TiO2 layer, and oxygen was transported inwards to form the inner mixed layer.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.22 no.8
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• pp.75-81
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• 2008

Water treatment study employing plasma is thoroughly examined in the following paper. The research using water plasma torch showed superior results in terms of economical and energy efficiency due to the substantial reduction of electric power. A comparison of streamer and arc discharge phenomena taken place in water was put under close scrutiny. Dyeing wastewater exposed to the plasma treatment was sampled and analyzed for relative dissolved ozone concentration, hydrogen peroxide, as well as the color removal efficiency. It was found that streamer discharges is more effective than arc discharge in growth of $H_2O_2$ and $O_3$ by plasma chemical constituents, though plasma torch had small oxidation reagents selectivity. Thus, streamer discharges, due to the efficient plasma-chemical reactions environment, proved to be more efficient compare to the thermal arc plasma loading.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.04a
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• pp.71-72
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• 2007

In this study, we investigated the fabrication of MLR (multi-layer resist) with a very thin diamond-like carbon (DLC) layer. ArF PR/$SiO_2$/DLC MLR structure was investigated and etching characteristics of the DLC layer was patterned using $SiO_2$ hard-mask by varying the process parameters such as different high-frequency/low-frequency combination ($f_{LF}/f_{HF}$), HF/LF power ratio ($P_{HF}/P_{LF}$), $O_2$ flow and $N_2$ flow rate in $O_2/N_2$/Ar plasmas. The results indicated an increased etch rate of DLC for the higher $f_{LF}/f_{HF}$ combination and for the increased low-frequency power ($P_{LF}$). And the etch rate of DLC was decreased with increasing the $N_2$ flow rate in $O_2/N_2$/Ar plasmas. In order to confirm the application of DLC MLR for the etching process of silicon oxide, the stack of ArF PR/BARC/$SiO_2$/DLC/TEOS/Si was investigated.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07b
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• pp.917-921
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• 2002

In this paper, we made different types of non-thermal plasma reactors such as Metal-particle reactor with $Al_2O_3$ to measure NOx removal characteristic and the dielectric effect for NOx removal. NOx removal rate is not so good when we use just dielectric of $Al_2O_3$ at the Metal-particle reactor, also we just put sludge pellets(100%) without Metal-particle reactor with $Al_2O_3$ and dielectric such as $TiO_2$, $BaTiO_3$ to measure the effect of sludge for NOx removal so that NOx removal rate is almost the same. However NOx removal rate is more than 90% in case of the reactor of composition shape used both dielectric of $Al_2O_3$ and sludge pellets at the same time. In case of the shape of plasma reactor with dielectric, the Metal-particle reactor with $Al_2O_3$, and the metal-particle reactor with both $Al_2O_3$ and dielectric such as $TiO_2$, $BaTiO_3$ at the same time, they are almost the same effect for NOx removal, so we made MNPR(Metal-particle Non-thermal Plasma Reactor with $Al_2O_3$) to reduce these kinds of demerits. Finally, we think MNPR should be much better than other reactors for NOx removal.