• 제목/요약/키워드: $Ga_{2}O_{3}$

검색결과 933건 처리시간 0.031초

공핍 모드 InGaZnO 박막 트랜지스터를 이용한 저소비전력 스캔 구동 회로 (Low Power Consumption Scan Driver Using Depletion-Mode InGaZnO Thin-Film Transistors)

  • 이진우;권오경
    • 대한전자공학회논문지SD
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    • 제49권2호
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    • pp.15-22
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    • 2012
  • 본 논문에서 공핍 모드 n-채널 InGaZnO 박막트랜지스터를 이용하여 소비전력이 낮은 스캔 구동 회로를 제안한다. 제안된 스캔 구동 회로는 단 2개의 클록 신호만을 사용하고 추가적인 마스킹 신호나 회로가 필요 없이 이웃하는 스캔 출력 간에 겹쳐짐이 없는 스캔 출력 신호를 만들어 낸다. 클록 신호를 줄임과 동시에 단락 전류를 줄임으로써 소비전력을 줄일 수 있었다. 모의 실험 결과 트랜지스터 문턱전압의 편차 범위가 -3.0 ~ 1.0V일 때에도 스캔 출력 신호가 정상적으로 출력됨을 확인하였다. XGA의 해상도를 갖는 디스플레이를 대상으로 양과 음의 전원 전압이 각각 15V, -5V이고 동작 주파수가 46KHz일 때, 스캔구동 회로의 소비전력이 4.89mW이다.

고온 수증기 전해용 $La_{x}Sr_{1-x}GaO_{3}$ 전극 재료의 합성 연구 (A Study on Synthesis of $La_{x}Sr_{1-x}GaO_{3}$ Electrode Material for High Temperature Steam Electrolysis)

  • 박미선;류시옥;우상국;박영태;최호상
    • 한국수소및신에너지학회논문집
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    • 제20권5호
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    • pp.432-438
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    • 2009
  • In this paper, we synthesized LSG powder by Modified-GNP method. Lanthanum, strontium and gallium (LSG) were selected in the preparation of an oxygen-electrode (anode) for High Temperature Steam Electrolysis system (HTSE). The used amount and concentration of nitric acid were varied to find out an appropriate composition for oxygen-electrode (anode). In order to optimize the molar ratio of La and Sr, ratio of La to Sr was varied that 2:8, 5:5 and 8:2. The combined LSGs were calcined for 2 hours at $700^{\circ}C$ and were sintered in a furnace for 4 hours at $1200^{\circ}C$. The phase and crystallinity of LSG powder were determined by XRD. The surface morphology was observed through SEM photograph, and the specific surface area was investigated with BET. The thermochemical property was determined by TG/DTA. The synthesized preparation was obtained of $La_{0.8}Sr_{0.2}GaO_{3}$ formula for 3M nitric acid, which was the best perovskite phase.

저온 공정 온도에서 $Al_2O_3$ 게이트 절연물질을 사용한 InGaZnO thin film transistors

  • 우창호;안철현;김영이;조형균
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2010년도 하계학술대회 논문집
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    • pp.11-11
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    • 2010
  • Thin-film-transistors (TFTs) that can be deposited at low temperature have recently attracted lots of applications such as sensors, solar cell and displays, because of the great flexible electronics and transparent. Transparent and flexible transistors are being required that high mobility and large-area uniformity at low temperature [1]. But, unfortunately most of TFT structures are used to be $SiO_2$ as gate dielectric layer. The $SiO_2$ has disadvantaged that it is required to high driving voltage to achieve the same operating efficiency compared with other high-k materials and its thickness is thicker than high-k materials [2]. To solve this problem, we find lots of high-k materials as $HfO_2$, $ZrO_2$, $SiN_x$, $TiO_2$, $Al_2O_3$. Among the High-k materials, $Al_2O_3$ is one of the outstanding materials due to its properties are high dielectric constant ( ~9 ), relatively low leakage current, wide bandgap ( 8.7 eV ) and good device stability. For the realization of flexible displays, all processes should be performed at very low temperatures, but low temperature $Al_2O_3$ grown by sputtering showed deteriorated electrical performance. Further decrease in growth temperature induces a high density of charge traps in the gate oxide/channel. This study investigated the effect of growth temperatures of ALD grown $Al_2O_3$ layers on the TFT device performance. The ALD deposition showed high conformal and defect-free dielectric layers at low temperature compared with other deposition equipments [2]. After ITO was wet-chemically etched with HCl : $HNO_3$ = 3:1, $Al_2O_3$ layer was deposited by ALD at various growth temperatures or lift-off process. Amorphous InGaZnO channel layers were deposited by rf magnetron sputtering at a working pressure of 3 mTorr and $O_2$/Ar (1/29 sccm). The electrodes were formed with electron-beam evaporated Ti (30 nm) and Au (70 nm) bilayer. The TFT devices were heat-treated in a furnace at $300^{\circ}C$ and nitrogen atmosphere for 1 hour by rapid thermal treatment. The electrical properties of the oxide TFTs were measured using semiconductor parameter analyzer (4145B), and LCR meter.

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Field emission lamp for LCD backlight based on RGB phosphors and vertically-aligned CNTs

  • Park, Boo-Won;Choi, Nam-Sik;Kim, Sung-Hoon;Jeong, Yun-Tae;Kim, Jong-Su
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2007년도 7th International Meeting on Information Display 제7권2호
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    • pp.1545-1546
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    • 2007
  • Zinc gallate-based RGB phosphors and vertically aligned carbon nanotube emitters are prepared for flat field-emission lamp. The blend phosphors of blue $ZnGa_2O_4$, green $ZnGa_2O_4:Mn^{2+}$ and red $ZnGa_2O_4:Cr^{3+}$ are coated on the front glass, and the carbon nanotubes are chemically bonded on the rear ITO glass as a cathode.

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GaOOH 선구체의 스핀코팅에 의한 GaN 박막의 성장 (Growth of GaN Thin-Film from Spin Coated GaOOH Precursor)

  • 이재범;김선태
    • 한국재료학회지
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    • 제17권1호
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    • pp.1-5
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    • 2007
  • GaN thin fan were grown by spin coated colloidal GaOOH precursor. Polycrystalline GaNs with crystalline size of $10{\sim}100nm$ were grown on $SiO_2$ substrate. The shape of crystallite above $900^{\circ}C$ had the hexagonal plate and column type. X-ray diffraction patterns for them correspond to those of the hexagonal wurtzite GaN. With increasing droplets. i.e, thickness of deposited layers, XRD intensity increased. PL (photoluminescence) spectrum consisted with an weak near band-edge emission at 3.45 eV and a broad donor-acceptor emission band at 3.32 eV. From the low temperature PL measurement on GaN grown at $800^{\circ}C$ that the shallow donor-acceptor recombination induced emission was more intense than the near band-edge excitonic emission.

GaN stripe 꼭지점 위의 GaN 나노로드의 선택적 성장 (Selective growth of GaN nanorods on the top of GaN stripes)

  • 유연수;이준형;안형수;신기삼;;양민
    • 한국결정성장학회지
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    • 제24권4호
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    • pp.145-150
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    • 2014
  • 3차원적 선택적 결정 성장 방법에 의해 GaN stripe 구조의 꼭지점 부분에만 GaN 나노로드를 성장하였다. GaN stripe의 꼭지점 부분의 $SiO_2$ 만을 최적화된 포토리소그라피 공정을 이용하여 제거하고 이를 선택적 결정 성장을 위한 마스크로 사용하였다. $SiO_2$가 제거된 꼭지점 부근에만 Au 금속을 증착하고, metal organic vapor phase epitaxy(MOVPE) 방법에 의해 GaN stripe의 꼭지점 부분에만 GaN 나노로드의 선택적 성장을 실시하였다. GaN 나노로드의 형상과 크기는 결정 성장 온도와 III족 원료의 공급량에 의해 변화가 있음을 확인하였다. Stripe 꼭지점에 성장된 GaN 나노로드는 단면이 삼각형형태를 가지고 있으며 끝으로 갈수록 점점 폭이 좁아지는 테이퍼 형상을 가지며 성장되었다. TEM 관측 결과, 매우 좁은 영역에서만 선택적 결정 성장이 이루어졌기 때문에 GaN 나노로드에서 관통전위(threading dislocations)는 거의 관찰되지 않음을 확인하였다. 선택성장이 시작되는 부분의 결정면과 GaN 나노로드의 성장방향의 결정면 방향의 차이에 기인하는 적층결함(stacking faults)들이 GaN 나노로드의 중심영역에서 생성되는 것을 관찰할 수 있었다.

Vapor Transport Epitaxy에 의한 GaN의 성장과 특성 (Growth and Properties of GaN by Vapor Transport Epitaxy)

  • 이재범;김선태
    • 한국재료학회지
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    • 제16권8호
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    • pp.479-484
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    • 2006
  • Highly c-axis oriented poly-crystalline GaN with a dimension of $1{\sim}3\;{\mu}m$ was deposited on $c-Al_2O_3$ substrate by vapor transport epitaxy (VTE) method at the temperature range of $900{\sim}1150^{\circ}C$. XRD intensities from (00'2) plane of grown GaNs were increased with reaction conditions which indicate the improvement of the crystal quality. In the PL spectra measured at 10 K, the spectrum composed with the neutral-donor bound exciton-related emission at 3.47 eV, crystal defect-related emission band at 3.42 eV and with its phonon replicas. The fact that intensity of $I_2$ were increased and FWHM were decreased with growth conditions means that the quality of GaN crystals were improved. With this simple VTE technology, we confirm that the GaNs were simply deposited on sapphire substrate and crystal quality related to optical properties of GaN grown by VTE were relatively good. PL emission without deep level emission in spite of polycrystalline structure can be applicable to the fabrication of large area and low cost optical devices using poly-GaN grown by VTE.

$SF_6$ 플라즈마 방전을 이용한 G3AS-MIS 커패시터의 제작 밑 특성 (Fabrication and Properties of GaAs-MIS Capacitor using $SF_6$ Plasma Discharge)

  • 이남열;정순원;김광호;유병곤;이원재;유인규;양일석
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1999년도 추계학술대회 논문집
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    • pp.29-32
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    • 1999
  • $GaF_3$ films were directly grown on p' and p-type GaAs(100) substrates using a $SF_6$ plasma discharge system. GaAs MIS(Meta1-Insulator-Semiconductor) capacitor was successfully fabricated for about 1 hour at temperature $290^{\circ}C$ using the as-grown $GaF_3$ films. The as-grown films on p'-GaAs exhibited a current density of less than 6.68 $\times$ $1O^{-9}$ A/$cm^2$ at a breakdown field of 500kV/cm and a refractive index of 2.0 ~ 2.3 at a wavelength of 632.8 nm. The dielectric constant was about 5 derived from 1 MHz capacitance-voltage (C-V) measurements. Dielectric dispersion of the fluoridated films on p'-GaAs measured ranged from 100 Hz to 10 MHz was not observed.

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