• Journal of the Korean Chemical Society
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• v.30 no.6
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• pp.526-531
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• 1986

The stability constants of 1,15-diaza-3,4:12,13-dibenzo-5,8,11-trioxacycloheptadecane (NenOdien H$_4$, L) with transition metal ions such as $Co^{2+},\;Ni^{2+},\;Cu^{2+},\;and\;Zn^{2+}$ have been determined by potentiometry in 95% methanol solution at 25$^{\circ}$C. The complex formation of the NenOdien $_4$ with the transition metal ions depends on the basicity of the donor atoms. The order of complex stability was Co(II) < Ni(II) < Cu(II) > Zn(II). The geometries of the complexes in solid state were discussed by visible-near infrared and infrared spectrophotometry, elemental analysis and electro-conductivity. The results suggest that the geometries of the solid complexes are octahedral for $[CoL_2(OH_2)Cl]Cl{\cdot}2H_2O$, $[NiL_2(OH_2)Cl]Cl{\cdot}2H_2O$, and $[ZnLCl_2]{\cdot}\frac{1}{2}H_2O$ and square pyramidal for [CuLCl]Cl, respectively.

• Journal of Korean Society on Water Environment
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• v.38 no.2
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• pp.82-94
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• 2022

In this study, chemically modified biochar (NSBP500, KSBP500, OSBP500) derived from starfish was utilized to improve the adsorption ability of the SBP500 (Starfish Biochar Pyrolyzed at 500℃) in a solution contaminated with heavy metals. According to the biochar modification performance evaluation batch tests, the removal rate and adsorption amount of NSBP500 increased 1.4 times for Cu, 1.5 times for Cd, and 1.2 times for Zn as compared to the control sample SBP500. In addition, the removal rate and adsorption amount of KSBP500 increased 2 times for Cu, 1.8 times for Cd, and 1.2 times for Zn. The removal rate and adsorption amount of OSBP500 increased 5.8 times for Cu. The FT-IR analysis confirmed the changes in the generation and movement of new functional groups after adsorption. SEM analysis confirmed Cu in KSBP500 was in the form of Cu(OH)₂ and resembled the structure of nanowires. The Cd in KSBP500 was densely covered in cubic form of Cd(OH)₂. Lead(Pb) was in the form of Pb₃(OH)₂(CO₃)₂ in a hexagonal atomic layer structure in NSBP500. In addition, it was observed that Zn was randomly covered with Zn₅(CO₃)₂(OH)₆ pieces which resembled plates in KSBP500. Therefore, this study confirmed that biochar removal efficiency was improved through a chemical modification treatment. Accordingly, adsorption and precipitation were found to be the complex mechanisms behind the improved removal efficiency in the biochar. This was accomplished by electrostatic interactions between the biochar and heavy metals and ion exchange with Ca²⁺.

• Journal of Electrochemical Science and Technology
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• v.9 no.4
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• pp.276-281
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• 2018

High concentration of copper in mezcal, a representative Mexican spirituous alcoholic beverage, is a serious problem due to the damage that it may cause to human health. A cyclic voltammetry and square wave anodic stripping voltammetry study of copper (II) in three commercial mezcal samples based on glassy carbon electrode response was undertaken. The analysis was developed using a simulated matrix solution ($EtOH/H_2O$ (1:1), 0.1 M $LiClO_4$ and AcOH/AcONa 0.05 M/0.008 M), with Cu (II) concentrations in the range 0 - 1 ppm. Direct electrochemical analysis of mezcal samples was complicated by the presence of different organic compounds in the matrix. The analytical signal of Cu (II) in the spirituous was notably improved and the interferences caused by organic compounds were minimized, by diluting the mezcal samples 10% with $EtOH/H_2O$ (1:1) solution. An efficient quantification of Cu (II) was obtained from the calibration curve by the SWASV and using the internal standard method (Cd (II)) in commercial samples (1.2-6.7 ppm); the results were correlated satisfactorily with the values obtained by AAS.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.667-668
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• 2007

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.326-326
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• 2011

반도체 소자의 집적화/소형화에 따라, 낮은 비저항을 가진 구리(Cu)를 이용한 배선공정에 관한 연구가 활발하게 진행되고 있다. 구리배선 공정에 있어 전기 도금법이 다양하게 적용됨에 따라, 구리도금 박막 형성을 위해 사용되는 Cu seed 층의 상태는 배선으로 형성된 Cu박막 특성에 크게 영향을 미친다 [1-3]. 본 연구에서는 sputter 방식으로 증착된 Cu seed 층(Cu seed / Ti / Si) 위에 형성된 자연산화막을 제거하기 위하여 다양한 세정방법을 도입하여 비교 분석하였다. 계면활성제인 TS-40A를 비롯한 NH4OH 용액과 H2SO4 용액을 사용하여 Cu seed 층 위에 형성된 구리산화막을 제거함으로서 형성된 표면형상 및 표면상태를 조사분석 하였다. FE-SEM (Field Emission Scanning Electron Microscope)을 이용하여 표면 처리된 Cu seed층 표면의 형상 및 roughness 등을 측정하였고, XPS (X-ray Photoelectron Spectroscopy)를 이용하여 표면 처리된 Cu seed 표면의 화학구조 및 불순물 상태를 조사하였다.

• Bulletin of the Korean Chemical Society
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• v.23 no.8
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• pp.1135-1138
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• 2002

CuO/ZnO, CuO/SiO,sub>2, and CuO/ZrO2 catalysts were prepared for investigating the support effects on methanol dehydrogenation. It was found that the conversion of methanol was proportional to the copper surface area on Cu/ZnO cat alysts and was independent on that on Cu/ZrO2 and Cu/SiO2. The highest copper surface area was obtained with the Cu/ZrO2 (9/1). The unusual deactivation of the Cu/ZnO, which showed the highest selectivity among the catalysts tested, was observed. Pulse reaction with methanol indicated that the lattice oxygen in ZnO could be removed by forming CO2 in the catalytic reaction, supporting that the ZnO reduction was responsible for the severe deactivation of the Cu/ZnO.

• Korean Journal of Plant Resources
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• v.32 no.6
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• pp.677-682
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• 2019

Hand leaf thinning for improvement of fruit coloration and quality is one of the most labor-consuming works in Korean apple cultivation. The study was aimed at investigating whether foliar application of two chelate compounds (Cu-EDTA, Fe-EDTA) could defoliate effectively 'Hongro'/M.9 apple leaves and enhance fruit coloration and quality. At 30 days before harvest, foliar spray with two chelate compounds defoliated significantly the apple leaves. Chelate treatments did not affect the leaf chlorophyll content. High concentration of chelates decreased drastically photosynthetic rate of true leaves, and then it stayed in low levels, whereas low levels of chelates reduced sharply the photosynthetic rate but it was gradually restored over time. Cu-EDTA regardless of its concentration triggered higher defoliation compared to Fe-EDTA. Consequently, higher defoliation improved light interception of fruits and accumulated more anthocyanin. Particularly, Cu-EDTA could target mainly fruit cluster leaves which affect directly light interception of the fruits, i.e. more selective defoliants compared to Fe-EDTA. However, 3% Cu-EDTA rather defoliated excessively, accompanying with reduction of fruit weight and soluble solids. Therefore, our results suggest that 1% Cu-EDTA which defoliates properly the fruit cluster leaves could improve coloration and quality of 'Hongro'/M.9 apple fruits.

• Korean Journal of Agricultural Science
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• v.9 no.2
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• pp.584-590
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• 1982

Copolymerization of the 4-vinylpyridine with vinylacetate and divinylbenzene initiated by azobis-isobutyronitrile was carried out in DMF in presence $BaCl_2$ at $98^{\circ}C$. Ion exchange res in, poly 4-vinylpyridine-vinylsulfonic acid-divinylbenzene was prepared by sulfonation of 4-vinylpyridine-vinylacetatp-divinylbenzene with concentrated sulfuric acid. The compositions of each synthetic resin were identified by means of ir adsorption spectroscopy. Anion and cation capacities of 4-vinylpyridine-vinylsulfonic acid-divinylbenzene ion exchanger were 2.5meq/g and 4.8meq/g, respectively. Adsorption of Cd(II) and Cu(II) ions have showed larger quantity in alkalie media. A study also was made of the influence of alcohol on the distribution coefficient of Cd(II) and Cu(II) ions between the synthetic ion exchanger, and solution containing hydrochloric acid, various alcohols and water. The distribution coefficients of metal ions decrease generally as the number of branches of carbon in the molecule of butyl alcohol increase. (t-BuOH

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.111-119
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• 2005

Stack specimen with three dimensional interconnection structure through Cu via of $75{\mu}m$ diameter, $90{\mu}m$ height and $150{\mu}m$ pitch was successfully fabricated using subsequent processes of via hole formation with Deep RIE (reactive ion etching), Cu via filling with pulse-reverse electroplating, Si thinning with CMP, photolithography, metal film sputtering, Cu/Sn bump formation, and flip chip bonding. Contact resistance of Cu/Sn bump and Cu via resistance could be determined ken the slope of the daisy chain resistance vs the number of bump joints of the flip chip specimen containing Cu via. When flip- chip bonded at $270^{\circ}C$ for 2 minutes, the contact resistance of the Cu/Sn bump joints of $100{\times}100{\mu}m$ size was 6.7m$\Omega$ and the Cu via resistance of $75{\mu}m$ diameter, $90{\mu}m$ height was 2.3m$\Omega$.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.178.2-178.2
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• 2015

In and Ga doped ZnO (IGZO) films were deposited on 5 nm thick Cu film buffered Polycarbonate (PC) substrates with RF magnetron sputtering and then the effect of Cu buffer layer on the optical and electrical properties of the films was investigated. While IGZO single layer films show the electrical resistivity of $1.2{\times}10-1{\Omega}cm$, IGZO/Cu bi-layered films show a lower resistivity of $1.6{\times}10-3{\Omega}cm$. Although the optical transmittance of the films in a visible wave length range is deteriorated by Cu buffer layer, IGZO films with 5 nm thick Cu buffer layer show the higher figure of merit of $2.6{\times}10-4{\Omega}-1$ than that of the IGZO single layer films due to the enhanced opto-electrical performance of the IGZO/Cu bi-layered films.