• Title/Summary/Keyword: $CuOH^+$

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Synthesis of Cu2O Particles Using the Hydrothermal Method (수열합성법을 이용한 Cu2O 입자의 합성)

  • Seongmin Shin;Kyunghwan Kim;Jeongsoo Hong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.37 no.1
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    • pp.63-67
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    • 2024
  • In this study, we successfully synthesized copper oxide (Cu2O) particles through a hydrothermal method at a relatively low temperature (150℃). The synthesis involved the precise control of molar concentrations of NaOH. Notably, Cu2O particles were effectively synthesized when NaOH concentrations of 0.15 M and 0.20 M were utilized. While attempts were made at different molar concentrations, the synthesis of pure Cu2O particles was only achieved at concentrations of 0.15 M and 0.20 M. In this experimental investigation, Cu2O synthesized under these specific conditions exhibited absorption characteristics within the wavelength range of 640 to 570 nm, consistently exhibiting a band gap energy of 1.9 eV. These Cu2O particles, characterized by their small band gap energy and straightforward synthetic method, hold significant promise for various applications including semiconductors and solar cells.

CuO Nanograss as a Substrate for Surface Enhanced Raman Spectroscopy

  • Lee, Jun-Young;Park, Jiyun;Kim, Jeong-Hyun;Yeo, Jong-Souk
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.249-249
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    • 2013
  • Surface-enhanced Raman spectroscopy (SERS) is a sensitive approach to detect and to identify a variety of molecules. To enhance the Raman signal, optimization of the gap between nanostructures is quite important. One-dimensional materials such as nanowires, nanotubes, and nanograsses have great potential to be used in SERS due to their unique sizes and shape dependent characteristics. In this study we investigate a simple way to fabricate SERS substrates based on randomly grown copper oxide (CuO) nanowires. CuO nanograss is fabricated on pre-cleaned Cu foils. Cu oxidized in an ammonium ambient solution of 2.5 M NaOH and 0.1 M $(NH_4)_2S_2O_8$ at $4^{\circ}C$ for 10, 30, and 60 minutes. Then, Cu(OH)2 nanostructures are formed and dried at $180^{\circ}C$ for 2 h. With the drying process, the Cu(OH)2 nanostructure is transformed to CuO nanograss by dehydration reaction. CuO nanograss are grown randomly on Cu foil with the average length of 10 ${\mu}m$ and the average diameter of a 100 nm. CuO nanograsses are covered by Ag with various thicknesses from 10 to 30 nm using a thermal evaporator. Then, we immerse uncoated and Ag coated CuO nanowire samples of various oxidation times in a 0.001M methanol-based 4-mercaptopyridine (4-Mpy) in order to evaluate SERS enhancement. Raman shift and SERS enhancement are measured using a Raman spectrometer (Horiba, LabRAM ARAMIS Spectrometer) with the laser wavelength of 532 nm. Raman scattering is believed to be enhanced by the interaction between CuO nanograss and Ag island film. The gaps between Ag covered CuO nanograsses are diverse from <10 nm at the bottom to ~200 nm at the top of nanograsses. SERS signal are improved where the gaps are minimized to near 10s of nanometers. There are many spots that provide sufficiently narrow gap between the structures on randomly grown CuO nanograss surface. Then we may find optimal enhancement of Raman signal using the mapping data of average results. Fabrication of CuO nanograss based on a solution method is relatively simple and fast so this result can potentially provide a path toward cost effective fabrication of SERS substrate for sensing applications.

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Effect of Cu During Non-isothermal Hydrogen Reduction of $MoO_3$

  • Kim, Gil-Su;Kim, Dae-Gun;Oh, Sung-Tag;Suk, Myung-Jin;Kim, Young-Do
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 2006.09b
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    • pp.1329-1330
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    • 2006
  • The effect of Cu on the hydrogen reduction of $MoO_3$ powders was investigated by measuring the humidity change during a non-isothermal process of hydrogen reduction. The presence of Cu induced a shift in the reduction temperature and strongly affected the reduction processes of $MoO_3\rightarrowMo_4O_{11}\rightarrowMoO_2$, which comprised the contained chemical vapor transport of $MoO_x(OH)_2$. This study suggests that the surface of the Cu grains acts as a nucleation site for the reduction of $MoO_x(OH)_2$ to $MoO_2$ particles from $MoO_3$ or $Mo_4O_{11}$. Such an activated reduction process results in the deposition of Mo and $MoO_2$ particles on the surface of the Cu.

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Donor Number of Mixed MeOH Solvents Using a Solvatochromic Cu(Ⅱ)-Complex (분광용매화 구리(II) 착물에 의한 메탄올 이성분 혼합용매들의 Donor Number)

  • Seoung-Kyo Yoo;Jin Sung Kim;Yeol Sakong
    • Journal of the Korean Chemical Society
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    • v.36 no.6
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    • pp.796-801
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    • 1992
  • An empirical Lewis basicity, DN, for eight mixed methanol solvents has been measured by the solvatochromic behavior of the [Cu(tmen)(acac)]$CIO_4$. The change of DN in mixed methanol solvents is not correlated with composition of the mixtures and divided into three groups: (1) dipolar aprotic solvents contribute mainly to the solvation of solute (MeOH-DMSO, MeOH-PY, MeOH-DMF), (2) two components of mixture contribute equally to the solvation of solute (MeOH-MeCN, MeOH-dioxane, MeOH-AC) and (3) methanol contributes entirely to the solvation of solute (MeOH-DCE, MeOH-TCE). The relationship between DN and Kamlet-Taft's $B_{KT}$ for mixed methanol solvents was found to agree well. These DN values also were a useful factor to analysis of reactivity for mixed methanol solvents.

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The effect of pH adjustor on the Cu CMP (Chemical Mechanical Planarization) (Slurry에 첨가되는 pH 적정제가 Cu CMP에 미치는 영향 분석)

  • Kang, Young-Jae;Eom, Dae-Hong;Song, Jae-Hoon;Park, Jin-Goo
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2004.11a
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    • pp.132-135
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    • 2004
  • 현재 사용 되고 있는 Cu CMP slurry에서 pH 적정제의 역할은 slurry의 연마 거동을 결정 하는 중요한 요소이다. 일반적으로 사용 되고 있는 적정제로는 $NH_4OH$, KOH가 있다. 구리 CMP용 슬러리내에서 CMP 공정 중에 과산화수소 $(H_2O_2)$의 영향에 관한 연구는 있으나, 과산화수소의 농도 (vol %) 변화에 따라서 pH적정제가 하는 역할과 반응이 CMP 공정중에 미치는 영향에 관해서 연구된 바 없다. 이 논문에서는 pH 적정제가 과산화수소의 농도에 따라서 산성, 중성, 염기성에서 어떠한 변화를 일으키는지에 관해서 dynamic etch rate과 removal rate을 비교 하였고, static etch rate을 이용하여 Cu 표면이 etching 되는 속도를 비교 하였다. 그 결과, 산성과 중성에서는 $NH_4OH$와 KOH의 경향성은 비슷하였으나, 염기성에서는 KOH를 첨가한 경우 변화가 나타나지 않았다. 따라서, pH가 염기성으로 갈수록 과산화수소의 저 농도에서 $NH_4OH$의 영향이 더 커짐을 알 수 있었다.

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Catalytic Combustion of Benzene over CuO-CeO2 Mixed Oxides Prepared by Co-precipitation Method (침전법으로 제조된 CuO-CeO2 혼합산화물에서 벤젠의 촉매연소반응)

  • Hong, Seong Soo
    • Applied Chemistry for Engineering
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    • v.25 no.3
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    • pp.312-317
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    • 2014
  • Catalytic combustion of benzene over CuO-$CeO_2$ mixed oxides prepared by co-precipitation method were investigated. The CuO-$CeO_2$ mixed oxides were also prepared using different precipitant and CuO precursor. They were characterized by XRD, BET, XPS and $H_2-TPR$. In the CuO-$CeO_2$ catalysts, characteristic copper oxide peaks were shown at $2{\Theta}=35.5^{\circ}$ and $38.5^{\circ}$ regardless of the precipitant. The Cu0.35 catalyst prepared using $NH_4OH$ as a precipitant revealed the highest activity on the combustion of benzene. In addition, the pretreatment with hydrogen enhanced the catalytic activity and the catalyst reduced at $400^{\circ}C$ showed the highest activity on the combustion of benzene.

Selective Chemical Dealloying for Fabrication of Surface Porous Al88Cu6Si6 Eutectic Alloy (화학적 침출법을 통한 표면 다공성 Al-Cu-Si 공정 합금 제조)

  • Lee, Joonhak;Kim, Jungtae;Im, Soohyun;Park, Hyejin;Shin, Hojung;Park, Kyuhyun;Qian, M.;Kim, Kibeum
    • Korean Journal of Materials Research
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    • v.23 no.4
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    • pp.227-232
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    • 2013
  • Al-based alloys have recently attracted considerable interest as structural materials and light weight materials due to their excellent physical and mechanical properties. For the investigation of the potential of Al-based alloys, a surface porous $Al_{88}Cu_6Si_6$ eutectic alloy has been fabricated through a chemical leaching process. The formation and microstructure of the surface porous $Al_{88}Cu_6Si_6$ eutectic alloy have been investigated using X-ray diffraction and scanning electron microscopy. The $Al_{88}Cu_6Si_6$ eutectic alloy is composed of an ${\alpha}$-Al dendrite phase and a single eutectic phase of $Al_2Cu$ and ${\alpha}$-Al. We intended to remove only the ${\alpha}$-Al phase and then the $Al_2Cu$ phase would form a porous structure on the surface with open pores. Both acidic and alkaline aqueous chemical solutions were used with various concentrations to modify the influence on the microstructure and the overall chemical reaction was carried out for 24 hr. A homogeneous open porous structure on the surface was revealed via selective chemical leaching with a $H_2SO_4$ solution. Only the ${\alpha}$-Al phase was successfully leached while the morphology of the $Al_2Cu$ phase was maintained. The pore size was in a range of $1{\sim}5{\mu}m$ and the dealloying depth was nearly $3{\mu}m$. However, under an alkaline NaOH, aqueous solution, an inhomogeneous porous structure on the surface was formed with a 5 wt% NaOH solution and the morphology of the $Al_2Cu$ phase was not preserved. In addition, the sample that was leached by using a 7 wt% NaOH solution crumbled. Al extracted from the Al2Cu phase as ${\alpha}$-Al phase was dealloyed, and increasing concentration of NaOH strongly influenced the morphology of the $Al_2Cu$ phase and sample statement.

전처리 조건에 따른 구리박막 표면에서의 특성변화

  • No, Sang-Su;Choe, Eun-Hye;Samuel, T.K.;Yun, Jae-Sik;Jo, Yang-Rae;Na, Sa-Gyun;Lee, Yeon-Seung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.260-260
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    • 2012
  • 최근 IT산업의 급속한 발달로 모바일 제품과 반도체 및 IC 패키지 등의 전자제품의 소형화, 경량화 및 고성능화되어 가고 있다. 따라서 반도체 공정에서 단위소자의 고속화를 구현하기 위한 금속배선공정에 사용되는 금속재료가 최근에 최소 선폭을 갖는 디바이스에서는 구리를 배선 재료로 전환하고, 향후에는 모든 디바이스가 구리를 주요 배선재료로 사용할 것으로 예측되고 있다. 반도체 소자 공정 중 시료 표면 위에 형성되는 오염물은 파티클, 유기오염물, 금속 불순물 그리고 자연 산화막으로 나눌 수 있다. 구리 표면에 생성되는 부식생성물의 종류에는 CuO, $Cu_2O$, $Cu(OH)_2$, $CuCO_3{\cdot}Cu(OH)_2$와 같은 생성물들이 있다. 이러한 부식생성물이 구리박막 표면에 형성이 되면 성장된 구리박막의 특성을 저하시키게 된다. 이러한 다양한 오염물들을 제거하기 위해서 여러 가지 전처리 공정에 대한 연구가 보고되고 있다. 본 연구에서, 스퍼터 방식으로 구리를 증착한 웨이퍼 (Cu/Ti/Si) 를 대기 중에 노출시켜 자연 산화막을 성장시키고, 이 산화막과 대기로부터 흡착된 불순물을 제거하기 위해 계면 활성제인 TS-40A와 $NH_4OH$ 수용액을 사용하여 이들 수용액이 구리 표면층에 미치는 영향에 대해 조사 분석하였다. 사용된 TS-40A는 알칼리 탈지제로서 웨이퍼 표면의 유기물을 제거하는 역할을 하며, $NH_4OH$는 구리를 제거하는 부식액으로 산업현장에서 널리 사용되고 있다. 다양한 표면 전처리 조건에 따른 구리박막 표면의 형상 및 미시적 특성변화를 SEM과 AFM을 이용하여 관찰하였고, 표면의 화학구조 및 성분 변화를 관찰하기 위해 XPS를 측정하였으며, 전기적 특성변화를 관찰하기 위해 4-point prove를 사용하여 박막의 면저항을 측정하였다.

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