• Journal of Powder Materials
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• v.14 no.2 s.61
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• pp.108-115
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• 2007

Cu-Ni-P alloy nano powders were fabricated by the electrical explosion of electroless Ni plated Cu wires. The effect of applied voltage on the explosion was examined by applying pulse voltage of 6 and 28 kV, The estimated overheating factor, K, were 1.3 for 6 kV and 2.2 for 28 kV. The powders produced with pulse voltage of 6 kV were composed of Cu-rich solid solution, Ni-rich solid solution, and $Ni_3P$ phase. While, those produced with 28 kV were complete Cu-Ni-P solid solution and small amount of $Ni_3P$ phase. The initial P content of 6.5 at.% was reduced to 2-3 at.% during explosion due to its high vapour pressure.

• Journal of Surface Science and Engineering
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• v.57 no.3
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• pp.192-200
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• 2024

Cu as a heat exchanger tube is an important component in thermal fluid transfer. However, Cu tubes are exposed to stress in certain environments, leading to stress corrosion cracking (SCC). In this study, the effect of Sn addition on microstructure and corrosion characteristics was examined. The microstructural examination revealed the presence of columnar crystal and a grain refinement due to the addition of Sn. Electrochemical measurements showed that the 5 wt.% NH₃ environment was the most vulnerable environment to Cu corrosion, and the corrosion current density increased as stress increased. The immersion test exhibited the formation of Cu2O and Cu(OH)₂ corrosion product in 3.5 wt.% NaCl and 5 wt.% NH₃ environments, respectively. Results indicated that Sn addition to Cu was an important factor in improving the mechanical strength.

• Journal of Power System Engineering
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• v.4 no.2
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• pp.31-39
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• 2000

Relationships between the plating condition and the plating rate of the deposition film for the electroless plating of Co-Cu-P alloy were discussed in this report. The result obtained from this experiment were summarized as follow ; The optimum bath composition was consisted of 0.8 ppm thiourea as a stabilizing agent. Composition of the deposit was found to be uniform after two hours of electroless plating. Plating rates of nickel-catalytic surface and zincate-catalytic surface were found to be very closely equal, but the plating time of nickel-catalytic surface took longer than that of the zincated-catalytic surface.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.661-663
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• 2003

In this paper, production of TFT-LCD adopting Cu electrode, in spite of low resistivity, which was not commercially applied to TFT LCD products because of processibility, reliability problems etc. was mentioned. Based on the test result of etch and strip process of Cu electrode, the TFT device using Cu material shows the same characteristics as the conventional TFT devices. We describe the realization of a 20.1" UXGA model which was firstly applied to Cu electrode.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1648-1650
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• 1996

In present paper, Cu films $4{\mu}m$, thick were fabricated by dual deposition methods using RF magnetron sputtering on Si wafer. The dependence of the electrical resistivity, adherence, and reflection in Cu films [$Cu_{4-x}$(low resistivity) / $Cu_x$(high adherence) / Si- wafer] on the x thickness have been investigated. Cu films of $4{\mu}m$ thickness formed with dual deposition methods had the low electrical resistivity of about $2.6{\mu}{\Omega}{\cdot}cm$ and high adherence of about 700g/cm. In conclusion, it is possible for these films to be used for micro-devices.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.329-329
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• 2011

We measured thin films thickness sputtered from Cu target in the magnetron sputter system. Thin films thickness is thin as integration power in target is large. Cu thin films thickness in 100 kWh integration watt was decreased by 20% when that of beginning was compared. But the shape of thin films thickness distribution was same. For the calculation of thin films thickness distribution in the 100 kWh, the angular distribution data sputtered of Cu particles is necessary when Ar ions enter to inclined erosion surface of Cu target. We used the relation results of sputter yield and main angular distribution of sputtering particles emitted from Cu target published by G. Betz.

• Environmental Sciences Bulletin of The Korean Environmental Sciences Society
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• v.10 no.S_3
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• pp.139-148
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• 2001

Heavy metals such as Cu, Ni, Cd, and Pb were chemically extract from the contaminated soils using the chelating agents, EDTA and DTPA. These chemical extraction have been focused on its applicability to a wide range of soils. Results of extractive efficiency for heavy metal follow the order : Cu-EDTA $\geq$ Ni-EDTA > Pb-EDTA > Cd-EDTA > Cu-DTPA> Pb-DTPA. This result is coincided with order of conditional formation constants(Kr) of metal-chelate agent. The second study involved the recovery of the metals and EDTA from complex solutions by an electromembrane process. The overall processes of regeneration, recovery, and reuse were evaluated. The electrochemical studies showed that copper could be chosen as an electrode to plate Cd, Cu, and Pb. At least 95% of 75 of EDTA and associated Cu or Pb could be recovered by the electromembrane process. Recovery of Cd by electodeposition was not possible with the copper electrode. The percent EDTA recovery is equal to the percentage of metal electroplated from the chelates.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1643-1645
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• 2000

The effects of pre-sintering and infiltration conditions on the electrical and physical properties of Cu-Cr contact material have been studied. Specimens were prepared by infiltration technique, aiming at the final composition of Cu50w%Cr, with varying pre-sintering and infiltration conditions. It showed that increased pre-sintering temperature had a little influence on the final microstructure of Cu-Cr contact material, but improved the surface morphology of Cr-skeleton resulting in better wettability in the followed infiltration process. It also showed that Cr grain growth and gram shape change became prominent with increasing infiltration temperature and time.

• Resources Recycling
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• v.5 no.3
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• pp.31-36
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• 1996

The metallic copper was recovered from sludge of the copper electro-plating plant by pyrometallurgical process. The reducing agent was Pyrolysized from waste tires and the flux was a mixture $Na_2CO_3$, $NaB_4O_7$, and glass. The green sludge contained 87.5% moisture and 12.5% solid with 56.5% Cu and 1.59% Fe. The sludge dried at $100^{\circ}C$ was analyized to be $Cu_4SO_4(OH)_6{\cdot}2H_2O$ and CuO by XRD analysis. The former was 84% and the latter 16%, However, the calcined sludge at $500^{\circ}C$ was 49% $Cu_2O(SO_4)$ and 51% CuO. The sludge could by smelted at $1100^{\circ}C$ for two hours with 6 to 8 moles carbon with respect to copper to produce metallic copper (>90%) with recovery of 9% above.

• Journal of Hydrogen and New Energy
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• v.30 no.2
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• pp.103-110
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• 2019

Cu-Zn-Al catalysts were prepared via co-precipitation method for low-temperature water-gas shift (LT-WGS) reaction under practical reaction condition. Aging time was systematically changed to find optimum point for LT-WGS under practical condition. The Cu-Zn-Al catalyst aged for 72 hours showed the highest CO conversion within low-temperature range as well as very stable catalytic activity for 200 hours despite the practical reaction condition.