Effects of Intermetallic Compounds Formed during Flip Chip Process on the Interfacial Reactions and Bonding Characteristics (플립칩 공정시 반응생성물이 계면반응 및 접합특성에 미치는 영향)
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- Journal of the Microelectronics and Packaging Society
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- v.19 no.2
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- pp.35-39
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- 2012