• 한국표면공학회지
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• 제28권4호
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• pp.243-254
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• 1995

The fabrication process of Cu-base anode for replacing Ni-base anode of molten carbonate fuel cell was investigated. Electrochemical performance and thermal stability of Cu-base anode were also investigated. Green sheet was prepared by mixing Cu and Ni powder with 1.5wt% methylcellulose and 100wt% water. The pore-size distribution of the Cu-base anode sintered at $800^{\circ}C$ for 30min showed almost uniform pore-size ranging from 4 to 20$\mu\textrm{m}$ and it was considered suitable for MCFC anode. Cu-Ni anode containing between 35 to 50wt% Ni exhibited current density of 111mA/$\textrm{cm}^2$ at 100mV overpotential and it was almost the some value for pure Ni anode. The sintering resistance of Cu-Ni increased with an increase of Ni addition. It was considered that the increase of sintering resistance was due to the decrease of diffusion rate of Cu and Ni with increasing the addition of Ni in Cu-Ni alloy.

• 한국진공학회지
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• 제3권3호
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• pp.346-354
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• 1994

삼원화합물 반도체 CuAlSe2 및 CuGaSe2 단결정의 solid solution 인 CuAl1-xGaxSe2 및 cobalt를 2.0 mol% 첨가한 CuAl1-xGaxSe2 : Co2+ 단결정을 iodine을 수송물질로 사용한 화학수송법으로 성장시켰 다. source material로는 CuAl1-xGaxSe2 의 화학조성비에서 Se를 3.0mol% 과잉으로 첨가하여 합성한 ingot를 사용하였으며 불순물이 첨가된 CuAl1-xGaxSe2:Co2+ 단결정성장시에는 source ma-terial 에 cobalt 분말을 2.0mol% 첨가하였다. X-선 회절무늬로부터 성장된 단결정들이 chalcopyrite 결정구조를 하고 있음을 확인하였으며 격자상수를 구하였다. 광흡수 spectra 측정으로부터 성장된 단결정에서 나타 는 cobalt 불순물에 의한 광흡수 peak가 Td 대칭점에위치한 Co2+ 이온의 에너지 준위들간 전자전이에 의해 나타남을 규명하였다.

• 한국재료학회지
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• 제6권12호
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• pp.1192-1198
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• 1996

배선 재료나 salicide 트랜지스터에 적용될 것으로 기대되는 Cu 배선과 Co 단일층 및 Co/Ti 이중층을 사용하여 형성된 코발트 실리사이드간의 열적 안정성에 대하여 조사하였다. 40$0^{\circ}C$열처리후 Cu3Si 막이 CoSi2층과 Si 기판 사이에 형성되었는데, 이것은 Cu 원자의 확산에 기인한 것이다. $600^{\circ}C$에서의 열처리 후에 형성된 최종막의 구조는 각각 Cu/CoSi2/Cu3Si/Si과 TiO2/Co-Ti-Si 합금/CoSi2/Cu3Si/Si였으며, 상부에 형성된 TiO2층은 산소 오염에 의한 것으로 밝혀졌다.

• 한국세라믹학회지
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• 제32권9호
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• pp.1040-1046
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• 1995

The formation free energy of Y2Cu2O5 was measured by the partial ion exchanged (Cu2+, Na+)-$\beta$/$\beta$"-Al2O3 as solid state electrolyte. The formation cell was built as follows: Pt(O2)/Y2Cu2O5＋Y2O3//(Cu2+, Na+)-$\beta$/$\beta$"-Al2O3//CuO/(O2)Pt The virtual formation formation formula, and the calculated formation free energy of Y2Cu2O5 as a function of temperature are as follows: 2CuO＋Y2O3=Y2Cu2O5 ΔfG0/kJ.mol-1=13.19-16.25*10-3T/K.5*10-3T/K.

• 한국자기학회지
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• 제3권4호
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• pp.310-313
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• 1993

Cu-Ni를 기저층으로 한 (100) Cu/Co 인공초격자에서 기저층에 첨가된 니켈의 함량이 자기저항에 미치는 영향을 조사하였다. 니켈의 함량이 증가하면서 인공초격자의 우선 방위가 fcc(100)에서 fcc(111)으로 변화하였는데 이는 기저층의 우선 방위가 바뀌었기 때문인 것으로 밝혀졌다. 니켈의 함량이 6%일때 [Cu(19 .angs. )/Co(30 .angs. )]/sub 20/ | Cu-6%Ni(200 .angs. )/Si 시편의 경우에 177 Oe에서 26.7%의 큰 자기저 항을 얻을 수 있었다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2013년도 춘계학술대회 논문집
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• pp.183-183
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• 2013

본 연구는 전착법으로 형성된 $Cu_2O$ 박막의 광특성 변화를 고찰한 것이다. 0.3M $CuSO_4$과 4M Lactic acid에 4M NaOH로 전해액의 pH를 조절하여 $Cu_2O$ 박막의 결정성 및 극성을 조절하였다. $Cu_2O$ 박막의 결정성 및 극성에 따른 광특성을 고찰한 결과, 극성인 (111)면에서 광특성이 우수함을 확인하였다. 하지만, 측정시간의 증가에 따라 표면에 Cu 금속이 형성되어 광전류가 감소함을 확인 할 수 있었다. rGO는 페르미전위가 $Cu_2O$ 환원 전위보다 위쪽에 위치한다. 따라서 $Cu_2O$ 박막위에 rGO를 형성시켜 Cu 발생반응을 제한하고 광전류를 증가시키고자한다.

• 한국분말재료학회지
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• 제13권1호
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• pp.33-38
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• 2006

The effect of Cu content on microstructure and mechanical properties of nano-sized Cu dispersed $Al_2O_3(Al_2O_3/Cu)$ nanocomposites was investigated. The nanocomposites with Cu content of 2.5 to 10 vol% were prepared by reduction and hot-pressing of $Al_2O_3/CuO$ powder mixtures. The nanocomposites with Cu content of 2.5 and 5vol% exhibited the maximum fracture strength of 820MPa and enhanced toughness compared with monolithic $Al_2O_3$. The strengthening was mainly attributed to the refinement of $Al_2O_3$ matrix grains. The toughening mechanism was discussed by the observed microstructural feature based on crack bridging.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.55-58
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• 2002

The possibility of SnCuX Solder as alternative for Pb-free Solder have been investigated in this study. SnCuX Solder balls(500${\mu}{\textrm}{m}$) were placed on Si-wafer which is Al/Ni/Cu(500nm/$4{\mu}{\textrm}{m}$/$4{\mu}{\textrm}{m}$)UBM layer. After reflow soldering at $250^{\circ}C$, shear strength and microstructure were analyzed. The results showed that the shear strength(500gf) of SnCuX was higher than that of SnCuX at $230^{\circ}C$ and $Cu_6Sn_5$ intermetallic compounds were formed between Cu and SnCuX Solder layers

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 추계학술대회 논문집
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• pp.13-16
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• 2000

(PbS)$_{1-x}$ -(CuS)$_{x}$ thin films(x=0, 0.5, 1) were grown on glass substrates by using a chemical bath deposition method. The molecular ratio of Pb to Cu for the PbS-CuS thin films(x=0.5) was measured about 7:3 by using EDX and XRF. The resistivity of non-annealed (PbS)$_{1-x}$ -(CuS)$_{x}$ thin films was about 10 $\Omega$ . cm. However, after annealing, the resistivity of PbS showed a little change, while PbS-CuS and CuS significantly decreased in the range of 0.002 to 0.005$\Omega$.cm. PbS was p-type and CuS was n-type.-type.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.366-367
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• 2006

Carbon nanotubes (CNTs) have attracted remarkable attention as reinforcement for composites owing to their outstanding mechanical properties. The CNT/Cu nanocomposite is fabricated by a novel fabrication process named molecular level process. The novel process for fabricating CNT/Cu composite powders involves suspending CNTs in a solvent by surface functionalization, mixing Cu ions with CNT suspension, drying, calcination and reduction. The molecular level process produces CNT/Cu composite powders whereby the CNTs are homogeneously implanted within Cu powders. The mechanical properties of CNT/Cu nanocomposite, consolidated by spark plasma sintering of CNT/Cu composite powders, shows about 3 times higher strength and 2 times higher Young's modulus than those of Cu matrix.