• 대한전기학회논문지
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• 제43권2호
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• pp.296-302
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• 1994

Polycrystalline CuInSeS12T thin were prepared by depositing Cu/In layer, which was sequentially sputtered varying the Cu/(Cu+In) mole ratio, on glass substrate and selenizing with selenium metal vapor in a nitrogen atmosphere. Compositional and structural, characterization was carried out by X-ray diffraction (XRD), wavelength-dispersive spectroscopy(WDS), and scanning electron microscope(SEM). Electrical characterization was carried out by the measurements of Hall effect, electrical resistivity. Large indium loss occurs in early stage of the selenization process. The selenized films which had mole ratios larger than 0.28 have chalcopyrite CuInSeS12T phase and these that had less mole ratios have sphalerite phase. The selenized films containing CuS1xTSe phase have Cu-rich CuInSeS12T phase and these that did not contain CuS1xTSe have In-rich CuInSeS12T phase. By optimizing the sputtering conditions,it is possible to fabricate CuInSeS12T thin films which have little secondary phases and an appropriate hole concentration (10S015T ~ 10S016TcmS0-3T) for solar cells.

• 한국전기전자재료학회논문지
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• 제11권6호
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• pp.493-501
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• 1998

$YBa_2Cu_3O_X$ samples were fabricated by MPMG(Melt Powdered Melt Growth). Intitial composition of the mixed powders were prepared as follow ; $YBa_2Cu_3O_X$ : $Y_2BaCuO_5$ = 1:0, 1:0.2, 1:0.3, 1:0.4. After the first melt and cooling, 5wt% to 20wt% fo Ag power was added to the powder. Effects of the different initial $Y_2BaCuO_5$ and Ag addition amount on $J_c$ and magnetization of $YBa_2Cu_3O_X$ fabricated by MPMG method were investigated. The critical current density increased with the amount of $Y_2BaCuO_5$ and Ag. It was also observed that the difference between negative and positive magnetization in the magnetization hysteresis measurement at 77K was larger than the case where $Y_2BaCuO_5$and Ag were not added to the $YBa_2Cu_3O_X$ powders. It is concluded that $Y_2BaCuO_5$ sample with 40wt% amount of $Y_2BaCuO_5$ and 20wt% amount of Ag has not only the largest $J_c$ but also the improved pinning effect.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1995년도 추계학술대회 논문집
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• pp.109-112
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• 1995

CuInS$_2$thin film was prepared by heat treatment at vacuum 10$\^$-3/ Torr of S/In/Cu stacked layer which was deposited by sequential. And so, the polycrystalline CuInS$_2$with chalcopyrite structure was well made at heat treatment temperature of 250$^{\circ}C$ and heat treatment time of 60 min. Single phase of CuInS$_2$was formed from Cu/In composition ratio of 0.84 to 1.3. p conduction type of CuInS$_2$thin film was appeared from Cu/In competition ratio of 0.99. The highest resistivity of CuInS$_2$with p type was 1.608${\times}$10$^2$$\Omega$cm at Cu/In composition ratio of 0.99 and The lowest resistivity was 5.587${\times}$10$\^$-2/$\Omega$cm at Cu/In composition ratio of 1.3.

• Transactions on Electrical and Electronic Materials
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• 제10권5호
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• pp.165-168
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• 2009

Transparent and conducting ITO/Cu/ITO multilayered films were deposited by magnetron sputtering on unheated polycarbonate (PC) substrates. The thickness of the Cu intermediate film was varied from 5 to 20 nm. Changes in the microstructure and optoelectrical properties of ITO/Cu/ITO films were investigated with respect to the thickness of the Cu intermediated layer. The optoelectrical properties of the films were significantly influenced by the thickness of the Cu interlayer. The sandwich structure of ITO 50 nm/Cu 5 nm/ITO 45 nm films had a sheet resistance of $36{\Omega}$/Sq. and an optical transmittance of 67% (contain substrate) at a wavelength of 550 nm, while the ITO 50 nm/Cu 20 nm/ITO 30 nm films had a sheet resistance of $70{\Omega}$/Sq. and an optical transmittance of 36%. The electrical and optical properties of ITO/Cu/ITO films were determined mainly by the Cu film properties. From the figure of merit, it is concluded that the ITO/Cu/ITO films with a 5 nm Cu interlayer showed the better performance in transparent conducting electrode applications than the conventional ITO films.

• 한국재료학회지
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• 제24권4호
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• pp.186-193
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• 2014

A thin Cu seed layer for electroplating has been employed for decades in the miniaturization and integration of printed circuit board (PCB), however many problems are still caused by the thin Cu seed layer, e.g., open circuit faults in PCB, dimple defects, low conductivity, and etc. Here, we studied the effect of heat treatment of the thin Cu seed layer on the deposition rate of electroplated Cu. We investigated the heat-treatment effect on the crystallite size, morphology, electrical properties, and electrodeposition thickness by X-ray diffraction (XRD), atomic force microscope (AFM), four point probe (FPP), and scanning electron microscope (SEM) measurements, respectively. The results showed that post heat treatment of the thin Cu seed layer could improve surface roughness as well as electrical conductivity. Moreover, the deposition rate of electroplated Cu was improved about 148% by heat treatment of the Cu seed layer, indicating that the enhanced electrical conductivity and surface roughness accelerated the formation of Cu nuclei during electroplating. We also confirmed that the electrodeposition rate in the via filling process was also accelerated by heat-treating the Cu seed layer.

• 대한치과기공학회지
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• 제31권3호
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• pp.9-14
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• 2009

This study evaluated the mechanical properties of Ti-Cu alloys with the hope of developing an alloy for dental casting with better mechanical properties than unalloyed titanium. Ti-Cu alloys with four concentrations of Cu(2,5,10wt%) were made in an argon-arc melting furnace. The microstructure and micro-Vickers hardness were determined. X-ray diffraction pattern test was performed on the polished specimens. The microstructure of 2%Cu and 5%Cu alloys are shown acicular ${\alpha}Ti$ phase formed on the surfaces of previously formed $\beta$grains. The 10%Cu alloys has essentially a eutectoid structure; this structure includes lamella of ${\alpha}Ti$ and $Ti_2Cu$ phase that transformed from ${\alpha}Ti$ at the eutectoid temperature. The micro-Vickers hardness of CP Ti specimens was significantly(p<0.05) lower than that of any of the other alloys. Among the Ti-Cu alloys, the 10%Cu alloys exhibited a significantly(p<0.05) higher hardness value. but lower than that of Ti-6%Al-4%V alloy. From these results, it was concluded that new alloys for dental castings should be designed as Ti-Cu based alloys if other properties necessary for dental castings were obtained.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 기술심포지움 논문집
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• pp.110-113
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• 2003

여러가지 Sn-Ag-Cu 솔더조성과 솔더링 후의 냉각속도에 따라 솔더링 접합부에서의 계면 미세조직의 다양한 변화를 관찰해 보았다. 현재까지 Sn-Ag-Cu 3원계 공정점에 대한 정확한 연구가 미흡하고, 상용으로 제품화되고 있는 Sn-Ag-Cu 합금계는 3원계 공정조성에서 약간 벗어난 조성들을 선택하고 있다고 할 수 있다. 따라서, 본 연구에서 사용한 Sn-Ag-Cu 합금 조성은 Sn-3.5Ag, Sn-3Ag-0.7Cu, Sn-3Ag-1.5Cu, Sn-3.7Ag-0.9Cu, Sn-6Ag-0.5Cu로 선택하였으며, 각 조성에서 Lap Shear Joint를 제조하였다. 사용한 Solder pad는 Cu pad와 Cu pad 위에 Au/Ni를 plating한 것을 이용하였다. 리플로우 솔더링 조건은 $250^{\circ}C$ 이상의 온도에서 60초 실시하였으며, 리플로우 솔더링 후의 냉각속도를 달리하여 냉각시켰다. 솔더링 후의 냉각속도가 느려질수록 계면 금속간화합물(IMC)의 두께가 더욱 증가하며, 조대화되었다. 또한 솔더 조성의 영향에서 Cu와 Ag의 함량이 높을수록 계면 IMC의 두께가 증가되었으며, 이는 솔더내부에 형성된 IMC 입자들이 조대화되어 계면 IMC층에 결합되어 나타났기 때문이다.

• 마이크로전자및패키징학회지
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• 제21권3호
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• pp.1-6
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• 2014

차세대 전자소자는 입출력(I/O) 핀 수의 증가, 전력소모의 감소, 소형화 등으로 인해 fine-pitch 배선 시스템이 요구되고 있다. Fine-pitch 특히 10 um 이하의 fine-pitch에서는 기존의 무연솔더나 Cu pillar/solder cap 구조를 사용할 수 없기 때문에 Cu-to-Cu bumpless 배선 시스템은 2D/3D 소자 구조에서 매우 필요한 기술이라 하겠다. Bumpless 배선 기술로는 BBUL 기술, 접착제를 이용한 WOW의 본딩 기술, SAB 기술, SAM 기술, 그리고 Cu-to-Cu 열압착 본딩 기술 등이 연구되고 있다. Fine-pitch Cu-to-Cu interconnect 기술은 연결 방법에 상관없이 Cu 층의 불순물을 제거하는 표면 처리 공정, 표면 활성화, 표면 평탄도 및 거칠기가 매우 중요한 요소라 하겠다.

• 한국재료학회지
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• 제7권9호
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• pp.781-788
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• 1997

Cu/EMC 계면 접착력에 미치는 산화의 규명하기 위해 리드프레임의 저온 산화에 대하여 조사하였다. 이전의 보고와 달리, 저온에서도 Cu$_{2}$O위에 CuO산화물이 형성되어 Cu/Cu$_{2}$O(NiO)/Cu(NiO)/air의 산화층 구조를 나타내었다. Cu/EMC 계면 접착력은 산화가 진행됨에 따라 산화 초기에 급격히 증가하다 최대값에 이르고, 이후의 계속적인 산화로 감소하는 양상을 보였다. 접착력은 산화 온도나 리드프레임의 종류보다 산화막의 두께에 밀접한 상관 관계를 나타내었다. 최대 계면 접착력이 얻어지는 산화막의 두께는 리드프레임의 종류보다 산화막의 두께에 밀접한 상관 관계를 나타내었다. 최대 계면 접착력이 얻어지는 산화막의 두께는 리드프레임의 종류와 무관하게 대략 20nm 와 30nm 사이에 존재하였다. 산화 초기의 접착력 증가는 산화로 인한 EMC에 대한 젖음성의 증가와 기계적 고착 효과의 증가에 기인하였다. 리드프레임과 EMC의 파괴 표면에 대한 AES, XPS 분석으로 부터, 산화막의 두께가 얇을 때에는 Cu$_{2}$O//CuO의 계면 파괴 + EMC 자체 파괴가 복합적으로 발생함을 알 수 있었다. 반면에 과도한 산화로 낮을 접착력을 나타내는 시편은 Cu/Cu$_{2}$/O 계면의 파괴를 나타냈다.

• 한국전기전자재료학회논문지
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• 제14권5호
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• pp.423-429
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• 2001

PbS, CuS and (Pb,Cu)S thin films were chemically deposited on glass from alkaline baths containing lead acetate, copper chloride, thiourea and triethanolamine. The deposition, optical, resistivity and thermal electric properties of these films were studied. PbS thin films showed a hexagonal structure and CuS thin films showed amorphous. The crystalline of (Pb,Cu)S thin films was obtained by heat treatment at 200$\^{C}$ and the deposition ratio of Pb to Cu showed 7:3. The energy gap of PbS, CuS and (Pb,Cu)S thin films were 1.7, 2.1 and 2.4 eV, respectively. Sheet resistance of PbS thin films was less affected on thermal annealing, but hose of (Pb,Cu)S and CuS thin films were more reduced about 3 orders of magnitude. All of those thin films indicated p type semiconductor in temperature ranging 30$\^{C}$ to 150$\^{C}$.