• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.41-47
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• 2020

The effect of Co interlayer on the interfacial reliability of SiN_x/Co/Cu thin film structure for advanced Cu interconnects was systematically evaluated by using a double cantilever beam test. The interfacial adhesion energy of the SiN_x/Cu thin film structure was 0.90 J/㎡. This value of the SiN_x/Co/Cu thin film structure increased to 9.59 J/㎡.Measured interfacial adhesion energy of SiN_x/Co/Cu structure was around 10 times higher than SiN_x/Cu structure due to CoSi₂ reaction layer formation at SiN_x/Co interface, which was confirmed by X-ray photoelectron spectroscopy analysis. The interfacial adhesion energy of SiN_x/Co/Cu structure decreased sharply after post-annealing at 200℃ for 24 h due to Co oxidation at SiN_x/Co interface. Therefore, it is required to control the CoO and Co₃O₄ formation during the environmental storage of the SiN_x/Co/Cu thin film to achieve interfacial reliability for advanced Cu interconnections.

• Applied Chemistry for Engineering
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• v.18 no.6
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• pp.618-624
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• 2007

thermochemical methane reforming consisting of two steps on Cu/Fe/Zr mixed oxide media was carried out using a fixed bed infrared reactor. In the first step, the metal oxide was reduced with methane to produce CO, $H_2$ and the reduced metal oxide in the temperature of 1173 K. In the second step, the reduced metal oxide was re-oxidized with steam to produce $H_2$ and the metal oxide in the temperature of 973 K. The reaction characteristics on the added amounts of Cu in Cu/Fe/Zr mixed oxide media and the cyclic tests were evaluated. With the increase of the added amount of Cu in Cu/Fe/Zr mixed oxide media, the conversion of $CH_4$, the selectivity of $CO_2$ and the $H_2/CO$ molar ratio were increased, while the selectivity of CO was decreased in the first step. On the other hand, the evolved amount of $H_2$ was decreased with increasing the added amount of Cu in the second step. The $Cu_xFe_{3-x}O_4/ZrO_2$ medium added with Cu of x = 0.7 showed good regeneration properties in the 10th cyclic tests indicating that the medium had high durability. In addition, the gasification of the deposited carbon in the water splitting step was promoted with the addition of Cu in the media.

• Applied Chemistry for Engineering
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• v.9 no.5
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• pp.719-725
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• 1998

Tridentate Schiff base ligands were prepared by the reactions of salicylaldehyde and 2-hydroxy-1-naphthaldehyde with 2-aminophenol and 2-amino-p-cresol. And then Cu(II) complexes of those ligands were synthesized. The structures and properties of ligands and their complexes were studied by elemental analysis, $^1H$-NMR, IR, UV-visible spectra, and thermogravimetric analysis. The mole ratio of Schiff base to the metal of complexes was found to be 1:1. Cu(II) complexes were contemplated to be four-coordinated square planar configuration containing one water molecule. The redox process of ligands and complexes in DMSO solution containing 0.1 M TBAP as a supporting electrolyte was investigated by cyclic voltammetry and differential pulse voltammetry with glassy carbon electrode. The redox process of the tridentate Schiff base ligands was totally irreversible. The redox process of Cu(II) complexes was quasi-reversible and diffusion-controlled as one electron by one step process Cu(II)/Cu(I). The reduction potentials of the Cu(II) complexes shifted in the positive direction in the order of [Cu(II)(HNIPC)($H_2O$)]>[Cu(II)(HNIP)($H_2O$)]>[Cu(II)(SIP)($H_2O$)]>[Cu(II)(SIPC)($H_2O$)].

• Journal of Korea Foundry Society
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• v.41 no.5
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• pp.419-433
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• 2021

Al-Si-Cu alloys benefit from the addition of copper for better hardness and strength through precipitation hardening, which results in remarkably strong alloys. However, the addition of copper expands the solidification range of Al-Si-Cu alloys, and due to this, these alloys become more prone to hot tearing, which is one of the most common and serious fracture phenomena encountered during solidification. The conventional evaluation method of the hot tearing properties of an alloy is a relative and qualitative analysis approach that does not provide quantitative data about this phenomenon. In the present study, the mold itself part of a device developed in Instone et al. was partially modified to obtain more reliable quantitative data pertaining to the hot tearing properties of an Al-Si-Cu casting alloy. To assess the influence of Cu element, four levels of Cu contents were tested (0.5, 1.0, 3.0, and 5.0 wt.%) in the Al-Si-Cu system alloy and the hot tearing properties were evaluated in each case. As the Cu content was increased, the hot tearing strength decreased to 2.26, 1.53, 1.18, and 1.04 MPa, respectively. At the moment hot tearing occurred, the corresponding solid fraction and solidification rate decreased at the same temperature due to the increase in the solid-liquid coexistence range as the Cu content increased. The morphology of the fracture surfaces was changed from dendrites to dendrites covered with residual liquid, and CuAl₂ phases were observed in the vicinity of hot tearing.

• Korean Journal of Metals and Materials
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• v.49 no.2
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• pp.180-186
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• 2011

Isothermal annealing and electromigration tests were performed at $125^{\circ}C$ and $125^{\circ}C$, $3.6{\times}10_4A/cm^2$ conditions, respectively, in order to compare the growth kinetics of the intermetallic compound (IMC) in the Cu/thin Sn/Cu bump. $Cu_6Sn_5$ and $Cu_3Sn$ formed at the Cu/thin Sn/Cu interfaces where most of the Sn phase transformed into the $Cu_6Sn_5$ phase. Only a few regions of Sn were not consumed and trapped between the transformed regions. The limited supply of Sn atoms and the continued proliferation of Cu atoms enhanced the formation of the $Cu_3Sn$ phase at the Cu pillar/$Cu_6Sn_5$ interface. The IMC thickness increased linearly with the square root of annealing time, and increased linearly with the current stressing time, which means that the current stressing accelerated the interfacial reaction. Abrupt changes in the IMC growth velocities at a specific testing time were closely related to the phase transition from $Cu_6Sn_5$ to $Cu_3Sn$ phases after complete consumption of the remaining Sn phase due to the limited amount of the Sn phase in the Cu/thin Sn/Cu bump, which implies that the relative thickness ratios of Cu and Sn significantly affect Cu-Sn IMC growth kinetics.

• Proceedings of the IEEK Conference
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• 2002.07a
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• pp.58-61
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• 2002

In this paper, we present a new generalized k-Tree-based (CU/PE) allocation model to perform dynamic resource (CU/PE) allocation/deallocation decision for the reconfigurable MSIMD/MIMD multi-dimensional (k-D) mesh-connected architectures. Those reconfigurable multi-SIMD/MIMD systems allow dynamic modes of executing tasks, which are SIMD and MIMD. The MIMD task requires only the free sub-system; however the SIMD task needs not only the free sub-system but also the corresponding free CU. In our new k-Tree-based (CU/PE) allocation model, we introduce two best-fit heuristics for the CU allocation decision: 1) the CU depth first search (CU-DFS) in O(kN$_{f}$ ) time and 2) the CU adjacent search (CU-AS) in O(k2$^{k}$ ) time. By the simulation study, the system performance of these two CU allocation strategies was also investigated. Our simulation results showed that the CU-AS and CU-DFS strategies performed the same system performance when applied for the reconfigurable MSIMD/MIMD 2-D and 3-D mesh-connected architectures.

• Journal of the Korean Chemical Society
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• v.24 no.6
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• pp.421-425
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• 1980

The EPR absorption of furan compounds adsorbed on CuY zeolite was studied. With the adsorption of furan on CuY a new high field having a width of 8 gauss and g-factor of 2.002 appeared in EPR spectrum, while the original signal of Cu(Ⅱ) decreased. When 2-methylfuran was adsorbed on Cu(15)Y a new absorption band with a hyperfine structure appeared. With the increase of the degree of Cu(Ⅱ) ion exchange the resolution of the hyperfine structure became poor. The appearance of the new band was interpreted in terms of the formation of a charge transfer complex between Cu(Ⅱ) ion and the furan ring.

• Journal of Nutrition and Health
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• v.29 no.1
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• pp.70-76
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• 1996

This study was undertaken to investigate the effect on the Cd accumulation in long-term Cd poisoned rats. 40 male weaning Sprague Dawley rats weighting 80-90g were divided into 4 groups (LCuLFeCd : low Cu, Fe and Cd group, ACuLFeCd : adequate Cu, low Fe and Cd group, ACuAFeCd : adequate Cu, adequate Fe and Cd group) according to Cu and Fe levels (Cu 0.5ppm, 8.5ppm : Fe 6ppm, 40ppm) for 12 weeks. There were no significant difference in water intake, feed intake, and body weight gain according to dietary Cu and Fe consumption. But the mean food intake and body weight gain of adequate Fe groups(LCuAFeCd, ACuAFeCd) were higher than those of deficient Fe groups (ACuLFeCd, LCuFeCd)in long-term Cd poisoned rats. The mean Cd levels of serum, liver, kidney, and urine in ACuAFeCd group were lower than those of Cu and /or Fe deficient groups. But the mean fecal Cd excretion of ACuAFeCd group was higher than that of Cu and/or Fe deficient groups. And the mean Cd retention amount of ACuAFeCd group was lower than those of Cu and/or Fe deficinet groups. In conclusion, these results provide an evidence that adequate Cu and Fe intakes can decrease Cd accumulation in rats. Therefore, in the point of increasing environmental Cd contamination, adequate Cu and Fe intakes must be suggested to prevent Cd accumulations.

• Journal of Environmental Science International
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• v.11 no.1
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• pp.85-91
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• 2002

The effects of initial concentration of dissolved oxygen content, Cu(II) and EDTA in an aqueous Cu(II)-EDTA solution on $TiO_2$ photo-oxidation of EDTA were investigated using $TiO_2$ (Degussa P-25) and UV irradiation at $20{\circ}C$. In the presence of dissolved oxygen and/or Cu(II) the photo-oxidation rates of EDTA were enhanced. The rates linearly increased in the range of initial Cu(II) concentration below 1.79 mM, while abode this concentration those were kept constant. The trend or the EDTA photo-oxidation rates appeared to be akin to the Langmuir-Hinshelwood equation farm and the k values calculated were 0.05 mM/min for the free-EDTA system, and 0.17 mM/min far the Cu(II)-EDTA system. These meant the aqueous EDTA decomposition was enhanced due to weakening of the intra-molecular bond strength of EDTA by complexation with Cu(II) added. It was concluded the decomposition of aqueous EDTA by $TiO_2$ photo-oxidation was maximum in the presence of dissolved oxygen supplied by air purging and of Cu(II) with its concentration for 1:1 Cu(II)-EDTA complexation ratio.

• Journal of Powder Materials
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• v.4 no.4
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• pp.283-290
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• 1997

$Ti_5Si_3$ intermetallics containing 0-6 wt% of Cu were made by reactive sintering (RS) under vacuum using elemental powder mixtures (Process 1), electro-pressure sintering (EPS) using RS'ed materials (Process2), and EPS using elemental powder mixtures (Process 3). Relatively low dense titanium silicides were gained by process 1, in which porosity decreased with increasing Cu content. For example, porosity changed from 42 to 19.4% with the increase in Cu content from 0 to 6 wt%, indicating that Cu is a useful sintering aid. The titanium silicides fabricated by Process 2 had a higher density than those by Process 1 at given composition, and porosity decreased with increasing Cu content. For example, porosity decreased from 38 to 6.8% with the change in Cu content from 0 to 6 wt%. A high dense titanium silicides were obtained by Process 3. In this Process, porosity decreased a little by Cu addition, and was almost insensitive to Cu content. Namely, about 9 or 7% of porosity was shown in 0 or 1-6 wt% Cu containing silicides, respectively. The hardeness increased by Cu addition, and was not changed markedly with Cu content for the silicides fabricated by Process 3. This tendency was considered to be resulted from porosity, hardening of grain interior by Cu addition, and softening of grain boundary by Cu-base segregates. All these results suggested that EPS using elemental powder mixtures (Process 3) is an effective processing method to achieve satisfactorily dense titanium silicides.