• Journal of the Korean Electrochemical Society
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• v.20 no.1
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• pp.1-6
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• 2017

This study investigated the effect of surface pretreatment, which removes native Cu oxides on Cu seed layer, on subsequent Cu electro-/electroless deposition in Cu interconnection. The native Cu oxides were removed by using citric acid-based solution frequently used in Cu chemical mechanical polishing process and the selective Cu oxide removal was successfully achieved by controlling the solution composition. The characterization of electro-/electrolessly deposited Cu films after the oxide removal was then performed in terms of film resistivity, surface roughness, etc. It was observed that the lowest film resistivity and surface roughness were obtained from the substrate whose native Cu oxides were selectively removed.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.97-97
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• 2017

This study investigated the corrosion protection by electrodeposited copper layer on AZ31 Mg alloy with and without additional silver layer by immersion test, salt spray test, OCP transient and potentiodynamic polarization experiment. The single electrodeposited Cu layer on AZ31 Mg alloy showed a nodular structure with many imperfections of crevices between the nodules, which resulted in the fast initiation of pitting corrosion within first few hours of immersion. Double-layer coating of Cu and outer Ag layer slightly increased the initiation time for pitting corrosion. Triple-layer coatings of Cu/Ag/Cu exhibited the most efficient corrosion protection of AZ31 Mg alloy, compared to the single- and double-layer coatings. Surface morphology of the outer Cu layer in the triple-layer was changed from the nodular structure to fine particle structure with no crevices due to the presence of an additional Ag layer. Thus, the improved corrosion resistance of AZ31 Mg alloy by electrodeposited Cu/Ag or Cu/Ag/Cu layers is readily ascribed to the decreased number of imperfections in the electrodeposited layers due to the additional silver layer. It is concluded that the additional silver layer provides many nucleation sites for the second Cu plating, resulting in the formation of finer and denser structure than the first Cu electrodeposit.

• Journal of Powder Materials
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• v.19 no.4
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• pp.317-321
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• 2012

In this study, Cu-5Ni-10Sn(wt%) spinodal alloy was manufactured by gas atomization spray forming, and the microstructural features and mechanical properties of Cu-5Ni-10Sn alloy have been investigated during homogenization, cold working and age-hardening. The spray formed Cu-5Ni-10Sn alloy consisted of an equiaxed microstructure with a mixture of solid solution ${\alpha}$-(CuNiSn) grains and lamellar-structure grains. Homogenization at $800^{\circ}C$ and subsequent rapid quenching formed a uniform solid solution ${\alpha}$-(CuNiSn) phase. Direct aging at $350^{\circ}C$ from the homogenized Cu-5Ni-10Sn alloy promoted the precipitation of finely distributed ${\gamma}$' or ${\gamma}-(Cu,Ni)_3Sn$ phase throughout the matrix, resulting in a significant increase in microhardness and tensile strength. Cold working prior to aging was effective in strengthening Cu-5Ni-10Sn alloy, which gave rise to a maximum tensile strength of 1165 MPa. Subsequent aging treatment slightly reduced the tensile strength to 1000-1100 MPa due to annealing effects.

• Transactions on Electrical and Electronic Materials
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• v.12 no.1
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• pp.20-23
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• 2011

Amorphous Ti-(50-x)Ni-xCu (at%) (x = 20, 25, 27, 30) alloy ribbons were prepared by melt spinning. Subsequently, the crystallization behavior of the alloy ribbons was investigated by X-ray diffraction and differential scanning calorimetry. ${\Delta}T$ (the temperature gap between $T_g$ and $T_x$) increased from 33 K to 47 K and the wavenumber ($Q_p$) decreased from 29.44 $nm^{-1}$ to 29.29 $nm^{-1}$ with increasing Cu content from 20 at% to 30 at%. The activation energy for crystallization decreased from 188.5 kJ/mol to 170.6 kJ/mol with increasing Cu content from 20 at% to 25 at%; afterwards, the activation energy remained near constant. Crystallization occurred in two-stage: amorphous-B2-$TiCu_2$ in Ti-Ni-Cu alloys with Cu content less than 25 at%, while it occurred in three-stage; amorphous-B2-TiCu-$TiCu_2$ in Ti-Ni-Cu alloys with Cu content more than 27 at%.

• Journal of Korea Foundry Society
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• v.17 no.5
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• pp.480-487
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• 1997

Particle reinforced metal matrix composites(MMCs) via a centrifugal spray-cast deposition(CSD) process were fabricated by injecting second phase particles($Al_2O_3$<40${\mu}m$, W<17.3${\mu}m$) into copper melt on the atomizing disc. Compositing modes were investigated by combining microstructures and mathematical modeling between Cu droplets and the reinforced particles injected. The $Cu/W_P$ powders were shown that the W particles penetrate and get embedded in the Cu droplets. It is considered that the W particles composite preferentially in Cu melt on the atomizing disc. On the other hand, the $Al_2O_3$, particles did not penetrate into the Cu droplets on the atomizing disc but get attached in surface of Cu droplets during the flight. It is considered that the compositing may be attained in the flight distance which the relative velocity between Cu droplet and $Al_2O_3$, particle is maximum. The microstructure of the $Cu/W_P$ and the $Cu/(Al_2O_3)_p$ composite preform was strongly influenced by compositing modes of droplets, and after subsequent deposition it was comprised as it is called the dispersed type and the cell type of microstructure, respectively.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.505-506
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• 2007

Organic photovoltaic effects were studied in a device structure of ITO/CuPc/Al and ITO/CuPc/$C_{60}$/BCP/Al. A thickness of CuPc layer was varied from 10 nm to 50 nm, we have obtained that the optimum CuPc layer thickness is around 40 nm from the analysis of the current density-voltage characteristics in CuPc single layer photovoltaic cell. From the thickness-dependent photovoltaic effects in CuPc/$C_{60}$ heterojunction devices, higher power conversion efficiency was obtained in ITO/20nm CuPc/40nm $C_{60}$/Al, which has a thickness ratio (CuPc/$C_{60}$) of 1:2 rather than 1:1 or 1:3. Light intensity on the device was measured by calibrated Si-photodiode and radiometer/photometer of International Light Inc(IL 14004).

• Asian-Australasian Journal of Animal Sciences
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• v.14 no.12
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• pp.1734-1740
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• 2001

Feeding trials using weanling pigs and broiler chicks were conducted to evaluate the efficacy of different metal-amino acid chelates and complexes at various levels of copper and zinc on the performance and fecal excretions. A total of 200 weanling pigs (Large White ${\times}$ Yorkshire ${\times}$ Duroc, $11.20{\pm}0.81kg$) were randomly assigned to 5 dietary treatments following a randomized complete block design. Each treatment was replicated 4 times with 10 pigs per pen. The dietary treatments were designated as : A-diet containing 170 ppm Cu from $CuSO_4$ and 120 ppm Zn from $ZnSO_4$, B-diet containing 85 ppm Cu from Cu-amino acid chelate (CAC) and 60 ppm Zn from Zn-amino acid chelate (ZAC), C-diet containing 170 ppm Cu from CAC and 120 ppm Zn from ZAC, D-diet containing 85 ppm Cu from Cu-lysine complex (CL) and 60 ppm Zn from Zn-methionine complex (ZM), and E-diet containing 170 ppm Cu from CL and 120 ppm Zn from ZM. On the other trial, 144 of one day old broiler chicks were randomly distributed to 6 dietary treatments following a completely randomized design. Each treatment was replicated 3 times with 8 chicks per replicate. The dietary treatments were as follows: 1-diet with 60 ppm Cu from $CuSO_4$ and 40 ppm Zn from $ZnSO_4$, 2-diet with 120 ppm Cu from $CuSO_4$ and 80 ppm Zn from $ZnSO_4$, 3-diet with 60 ppm Cu from CAC and 40 ppm Zn from ZAC, 4-diet with 120 ppm Cu from CAC and 80 ppm Zn from ZAC, 5-diet with 60 ppm Cu from CL and 40 ppm Zn from ZM, and 6-diet with 120 ppm Cu from CL and 80 ppm Zn from ZM. In Exp. 1 with pigs, there was no difference on average daily gain and average daily feed intake observed among treatments. There was improvement (p<0.05) on the overall feed conversion ratio (FCR) of pigs fed diet containing 120 ppm Zn and 170 ppm Cu from metal-amino acid chelates relative to those fed diet containing inorganic sources of Cu and Zn but equally efficient as those fed diet containing metal-amino acid complexes. Pigs fed diet containing either metal-amino acid chelates or complexes as sources of Cu and Zn had higher (p<0.05) Cu and Zn concentration in serum and lower (p<0.05) in feces than those receiving diet with inorganic sources. In Exp. 2 with broiler chicks, the overall FCR was not different among treatments. Higher (p<0.05) Cu and Zn concentration in serum was obtained from birds fed diet with 60 ppm Cu and 40 ppm Zn from metal-amino acid chelates compared to those fed diet with inorganic sources of Cu and Zn. Also, the feces collected from birds fed diet with either metal-amino acid chelates or complexes contained generally lower Cu and Zn than those birds fed diet with inorganic sources. The higher the dietary level of Cu and Zn the higher the Cu and Zn concentration in the feces. Based on the results, both metal-amino acid chelates and complexes of Cu and Zn at low levels (Zn 60 ppm, Cu 85 ppm for weanling pigs and Zn 40 ppm, Cu 60 ppm for broiler chicks) are not different from that of high levels of inorganic sources in maintaining growth performance and serum concentration. The fecal excretions for Cu and Zn were greatly reduced when organic sources were used.

• Journal of Animal Science and Technology
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• v.50 no.3
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• pp.355-362
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• 2008

This study was carried out to evaluate effects of either organic or inorganic sources of both chromium and copper on growth performances, nutrients digestibility and fecal Cr, Cu, and Zn excretion in growing pigs. A total of 36 growing pigs((Landrace×Yorkshire)×Duroc, weighing 61.2kg in average) were allotted to 4 treatments with 3 replicates and 3 pigs per replicate. Four treatments were designated by supplemental sources of both chromium and copper as follows: ①200ppb Cr as Cr-methionine chelate(CrMet) and 200ppm Cuas copper methionine chelate(CuMet), ②200ppb Cr as CrMet and 200ppm Cu as copper sulfate(CuSO4), ③200ppb Cr as chromium chloride(CrCl3) and 200ppm Cu as CuMet, ④200ppb Cr as CrCl3 and 200ppm Cu as CuSO4. Growth performance was highest(p<0.05) in CrMet and CuMet supplemented diet treatment. Nutrients digestibility of diets was lowest(p<0.05) in CrMet and CuSO4 supplemented diet treatment, and highest(p<0.05) in CrMet and CuMet supplemented diet treatment. Fecal copper, zinc and chromium excretion was highest(p<0.05) in CrCl3 and CuSO4 supplementation treatment and lowest(p<0.05) in CrMet and CuMet supplementation treatment. This study showed a relatively high degree of utilization of Cr and Cu as well as Zn by supplementation of CrMet and CuMet compared with those of the inorganic sources.

• Korean Journal of Materials Research
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• v.6 no.2
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• pp.158-165
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• 1996

열증착기(thermal evaporator)로 증착시킨 Cu를 상온에서 3.5M CuCl2+0.5M HCI+0.5MKCI 용액을 사용하여 습식각하고 2일간 대기중 노출시킨 후 X-선 광전자 분광기를 이용하여 표면의 결합상태를 관찰하였다. 그 결과 습식식각된 Cu 표면에서는 C, O, Ci 및 Cu가 존재함을 알 수 있었다. 표면원소에 대한 오제이 전자 스펙트라(Auger electron spectra)와 광전자 스펙트라(photoelectron spectra)의 정량적인 비교를 통하여 표면의 모든 결합상태를 확인할 수 있었고 그 상대적인 양까지도 얻어낼 수 있었다. 식각된 Cu의 표면에는 Cu-Cu, 2Cu-O, Cu-Ci, Cu-2(OH), 및 Cu-2Cl의 결합상태가 존재함을 알 수 있었고, CuLMMAuger line spectrum의 관찰을 통하여 계산된 각 결합의 정량적인 비교를 검증할 수 있었다. 따라서 chemical shift가 거의 관찰되지 않아 결합상태 분리가 불가능한 식각된 구리표면의 정량적 결합상태는 각 결합상태의 상대적 비교를 통하여 얻어질 수 있음을 알 수 있었다.

• Korean Journal of Materials Research
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• v.16 no.10
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• pp.614-618
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• 2006

The thermal stability of Cu/Ti(or Ta)/NiSi contacts was investigated. Ti(Ta)-capping layers deposited to form NiSi was utilized as the Cu diffusion barrier. Ti(Ta)/NiSi contacts was thermally stable upto $600^{\circ}C$. However when Cu/Ti(Ta)/NiSi contacts were furnace-annealed at $300{\sim}400^{\circ}C$ for 40 min., the Cu diffusion was found to be effectively suppressed, but NiSi was dissociated and then Ni diffused into the Cu layer to form Cu-Ni solutions. On the other hand, the Ni diffusion did not occur for the Al/Ti/NiSi system. The thermal instability of Cu/Ti(Ta)/NiSi contacts was attributed to the high heat of solution of Ni in Cu.