• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.363-366
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• 2000

In this study, SrBi$_2$Ta$_2$$O_{9}$ (SBT) thin films were etched at different Cl$_2$gas mixing ratio in Cl$_2$/Ar. The maximum etch rate of SBT was 883 $\AA$/min in Cl$_2$(20%)/Ar(80%). The result indicates that physical sputtering of charged particles is dominant to chemical reaction in etching SBT thin films. To evaluate the changes of morphology and crystallinity on the near surface of etched SBT, atomic force microscopy (AFM) and x-ray diffraction (XRD) were used. The rms values of etched samples in Ar only or Cl$_2$ only plasma were higher than that of as-deposited, Cl$_2$/Ar Plasma. The SBT (105) crystalinity of the etched samples decreased in Af only or Cla only plasma, but maintain constant in ClyAr plasma. This can be illustrated by a decrease of Bi content or nonvolatile etching products (Sr-Cl and Ta-Cl), resulting in the changes of stoichiometry on the etched surface of the SBT thin films. The decrease of Bi content and nonvolatile etch products were revealed by x-ray photoelectron spectroscopy (XPS) and secondary ion mass spectrometry (SIMS).).

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.26 no.4
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• pp.145-149
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• 2016

The effect of process parameters such as plasma composition, ICP (Inductively Coupled Plasma) source power and rf chuck power on the etch characteristics of GaN epitaxy layer was studied. $Cl_2/Ar$ ICP discharges showed higher etch rates than $SF_6/Ar$ discharges because of the higher volatility of $GaCl_x$ etch products than $GaF_x$ compounds. As the Ar ratio increases in the $Cl_2/Ar$ ICP discharges, the etch anisotropy was enhanced due to the improved physical component of the etching. For both plasma chemistries, the GaN etch rate increased continuously as both the ICP source power and rf chuck power increased, and a maximum etch rate of 251.9 nm/min was obtained at $13Cl_2/2Ar$, 750W ICP power, 400W rf chuck power and 10 mTorr condition.

• Proceedings of the KIEE Conference
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• 2005.11a
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• pp.41-43
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• 2005

$Cl_2$ 플라즈마에 있어서 Ar 가스의 첨가에 의한 효과를 보기 위해 Ar 첨가 비율 rf 전력, 반응로 압력을 변화시켜가며 그 에너지와 질량을 분석하였다. Ar 첨가 비율에 따른 각 입자들의 질량 분석을 통해서, Ar의 비율이 80% 일 때 물리적, 화학적 반응이 최대가 되는 것을 확인하였다. 또한 Ar 첨가 비율에 따른 각 이온들의 에너지 분석을 통해, Ar 가스의 첨가에 의해 $Cl^+$ 나 $Cl_2^+$ 이온들의 이온 선속은 증가하나 그 에너지가 감소하는 것을 확인하였다. 반응로 압력과 rf 전력의 제어를 통해 이온 전류밀도, 이온 에너지와 전자온도를 제어 할 수 있음을 확인하였고, Ar 첨가 비율을 변화시키면서 전자 밀도 분포 함수의 변화를 관찰하여 이를 통해 Ar 비율에 따른 이온화 비율과 전자 온도, 밀도 등의 관계를 확인하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.9
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• pp.714-719
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• 2001

SrBi$_2$Ta$_2$$O_{9}$ thn films were etched in inductively coupled Cl$_2$/CF$_4$/Ar plasma. THe maximum etch rate was 1060 $\AA$/min at a Cl$_2$/(Cl$_2$+CF$_4$+Ar)=0.2. The 20% additive Cl$_2$ into CF$_4$/Ar plasma decreased carbon and fluorine radicals, but increased Cl radicals. Sr was effectively removed by reacting with Cl radical because the boiling point of SrCl$_2$(125$0^{\circ}C$) is lower than that of SrF$_2$(246$0^{\circ}C$). The chemical reactions on the etched surface were studied with x-ray photoelectron spectroscopy and secondary ion mass spectrometry. The etching profile was evaluated by using scanning electron microscopy.y.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.26-29
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• 2001

SrBi$_2$Ta$_2$$O_{9}$ thin films were etched at high-density C1$_2$/CF$_{4}$/Ar in inductively coupled plasma system. The etching of SBT thin films in C1$_2$/CF$_{4}$/Ar were chemically assisted reactive ion etching. The maximum etch rate was 1300 $\AA$/min at 900W in Cl$_2$(20)/CF$_4$(20)/Ar(80). As f power increase, radicals (F, Cl) and ion(Ar) increase. The influence of plasma induced damage during etching process was investigated in terms of the surface morphology and th phase of X-ray diffraction. The chemical residue was investigated with secondary ion mass spectrometry.y.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.7
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• pp.570-575
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• 2002

$SrBi_2Ta_2O_9$ thin films were etched in $Cl_2/CF_4/Ar$ inductively coupled plasma (ICP). The maximum etch rate was 1300 ${\AA}/min$ at 900 W ICP power in Cl$_2$(20%)/$CF_4$(20%)/Ar(60%). As RF source power increased, radicals (F, Cl) and ion ($Ar^+$) increased. The influence of plasma induced damage during etching process was investigated in terms of P-E hysteresis loops, chemical states on the surface, surface morphology and phase of X-ray diffraction. The chemical states on the etched surface were investigated with X-ray spectroscopy and secondary ion mass spectrometry. After annealing $700^{\circ}C$ for 1 h in $O_2$ atmosphere, the decreased P-E hysteresises of the etched SBT thin films in Ar and $Cl_2/CF_4/Ar$ plasma were recovered.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.110-113
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• 2001

ECR(electron cyclotron resonance) 플라즈마 식각 장비를 이용하여 SF$_{6}$/Ar과 Cl$_2$/Ar 플라즈마 가스에 대한 Platinum (이하 Pt) 박막의 식각 특성을 연구하였다. Pt 박막의 경우 Cl$_2$ 가스 혼합물에 대한 식각 특성은 많이 보고가 되어 왔으나 상대적으로 Fluorine 계열의 가스 혼합물에 의한 시각 연구는 미비하였다. 본 연구에서는 SF$_{6}$/Ar과 Cl$_2$/Ar 플라즈마 가스를 이용한 Pt 박막의 식각 특성을 비교 분석하고 각각의 가스와 Pt 박막과의 반응을 분석, 식각 특성을 개선하고자 하였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2000.11a
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• pp.45-48
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• 2000

High dielectric (Ba,Sr)TiO$_3$ thin films were etched in an inductively coupled plasma (ICP) as a function of C1$_2$/Ar gas mixing ratio. Under Cl$_2$(20)/Ar(80), the maximum etch rate of the BST films was 400$\AA$/min and selectivities of BST to Pt and PR were obtained 0.4 and 0.2, respectively. We investigated the etched surface of BST by x-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM) and x-ray diffraction (XRD). From the result of XPS analysis, we found that residues of Ba-Cl and Ti-Cl bonds remained on the surface of the etched BST for high boiling point. The surface roughness decreased as Cl$_2$ increases in Cl$_2$/Ar plasma because of non-volatile etching products. This changed the nature of the crystallinity of BST. From the result of XRD analysis, the crystalliility of etched BST film maintained as similar to as-deposited BST under Ar only and Cl$_2$(20)/Ar(80). However, (100) orientation intensity of etched BST film abruptly decreased at Cl$_2$ only plasma. It was caused that Cl compounds were redeposited on the etched BST surface and damaged to crystallinity of BST film during the etch process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.04b
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• pp.65-65
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• 2009

본 연구에서는 ICP 식각장치 및 $Cl_2$/Ar 플라즈마에 의한 $Ba_2Ti_9O_{20}$(BTO) 박막의 식각 특성을 고찰하였다. XPS 분석 장치를 이용하여 식각 표면 반응을 조사하였으며, 공정 변수 ($Cl_2$/Ar 가스 혼합비, 소스파워, 챔버 압력, 바이어스 파워)에 따라 플라즈마 특성 변화를 Langmuir probe measuring system을 이용하여 추출하였다. $Cl_2$/Ar 가스에서 Ar 가스의 혼합비가 증가함에 따라 BTO 박막의 식각 속도는 감소하였으며, $Cl_2$ 가스만을 사용하는 경우, 31.7 nm/min 으로 가장 높은 식각 속도를 보였다. Ar 가스의 혼합비에 따른 BTO박막의 식각속도 변화는 Langmuir probe 특성과 XPS 분석결과로부터 플라즈마 내에 형성되는 Cl radical density와 밀접한 관련이 있는 것으로 판단할 수 있다.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.3
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• pp.63-67
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• 2001

Up to now, most studies about Pt-etching have been focused on physical sputtering mechanism with Cl-based plasma, while only a limited results are available for etching characteristics with fluorine-based plasma. In this study, etch characteristics of Pt thin film with $Cl_2$/Ar and $SF_{6}$/Ar Ar gas chemistries have been studied with ECR plasma etching system. It is confirmed that $SF_{6}$/Ar Ar plasma chemistry could make volatile etch-products through the reaction with Pt thin film. Also the improvement in etch rate, etch profile and surface roughness is obtained due to the formation of volatile platinum fluoride compounds.