• Title/Summary/Keyword: $CF_4$ plasma treatment

Search Result 39, Processing Time 0.022 seconds

Impedance spectroscopy analysis of organic light emitting diodes with the $CF_4$ anode plasma treatment ($CF_4$ 플라즈마 처리된 ITO박막을 이용한 유기 EL 소자의 성능향상에 관한 임피던스 분석)

  • Park, Hyung-June;Kim, Hyun-Min;Lee, Jun-Sin;Sohn, Sun-Young;Jung, Dong-Geun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2006.11a
    • /
    • pp.320-321
    • /
    • 2006
  • In this work, impedance Spectroscopic analysis was applied to study the effect of plasma treatment on the surface of indium-tin oxide (ITO) anodes using $CF_4g$ as and to model the equivalent circuit for organic light emitting diodes (OLEDs) with the $CF_4$ plasma treatment of ITO surface at the anodes. This device with ITO/TPD/$Alq_3$/LiF/Al structure can be modeled as a simple combination of a resistor and a capacitor. The $CF_4$ plasma treatment on the surface of ITO shifts the vacuum level of the ITO as a result of which the barrier height for hole injection at the ITO/organic interface is reduced. The Impedance spectroscopy measurement of the devices with the $CF_4$ plasma treatment on the surface of ITO anodes shows change of values in parallel resistance ($R_p$) and parallel capacitance ($C_p$).

  • PDF

Control of Contact Angle by Surface Treatment using Sanning Plasma Method (주사 플라즈마 법(SPM)을 이용한 소수성 표면처리)

  • Kim, Young-Gi;Choi, Byoung-Jung;Yang, Sung-Chae
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.23 no.1
    • /
    • pp.10-13
    • /
    • 2010
  • The plasma processing technologies of thin film deposition and surface treatment technique have been applied to many industrial fields. This study is purposed Large-area uniformity and surface treatment on the stainless substrate. We treat surface of stainless by $CF_4$ plasma. $CF_4$ plasma is generated by using SPM(Scanning plasma method)which is kind a of CVD. Generally, SPM has been used for uniform surface treatment using a crossed electromagnetic field. The optimum discharge condition has been studied for the gas pressure, the magnetic flux density and the distance between substrate and electrodes. In result, contact angle is increased by surface treatment using $CF_4$ Plasma. Therefore we expect that SPM to control contact angle is applied to many industries.

Effects of CF4 Plasma Treatment on Characteristics of Enhancement Mode AlGaN/GaN High Electron Mobility Transistors

  • Horng, Ray-Hua;Yeh, Chih-Tung
    • Proceedings of the Korean Vacuum Society Conference
    • /
    • 2015.08a
    • /
    • pp.62-62
    • /
    • 2015
  • In this study, we study the effects of CF4 plasma treatment on the characteristics of enhancement mode (E-mode) AlGaN/GaN high electron mobility transistors (HEMTs). The CF4 plasma is generated by inductively coupled plasma reactive ion etching (ICP-RIE) system. The CF4 gas is decomposed into fluorine ions by ICP-RIE and then fluorine ions will effect the AlGaN/GaN interface to inhibit the electron transport of two dimension electron gas (2DEG) and increase channel resistance. The CF4 plasma method neither like the recessed type which have to utilize Cl2/BCl3 to etch semiconductor layer nor ion implantation needed high power to implant ions into semiconductor. Both of techniques will cause semiconductor damage. In the experiment, the CF4 treatment time are 0, 50, 100, 150, 200 and 250 seconds. It was found that the devices treated 100 seconds showed best electric performance. In order to prove fluorine ions existing and CF4 plasma treatment not etch epitaxial layer, the secondary ion mass spectrometer confirmed fluorine ions truly existing in the sample which treatment time 100 seconds. Moreover, transmission electron microscopy showed that the sample treated time 100 seconds did not have etch phenomena. Atomic layer deposition is used to grow Al2O3 with thickness 10, 20, 30 and 40 nm. In electrical measurement, the device that deposited 20-nm-thickness Al2O3 showed excellent current ability, the forward saturation current of 210 mA/mm, transconductance (gm) of 44.1 mS/mm and threshold voltage of 2.28 V, ION/IOFF reach to 108. As IV concerning the breakdown voltage measurement, all kinds of samples can reach to 1450 V.

  • PDF

Surface Property of PET Fabric Treated with $CF_4$ Plasma and $C_2F_6$ Plasma (플루오르 화합물을 플라즈마 처리한 PET 직물의 표면특성)

  • 김태년;모상영
    • Textile Coloration and Finishing
    • /
    • v.11 no.1
    • /
    • pp.25-33
    • /
    • 1999
  • PET fabric was grafted with $CF_4$ or $C_2F_6$ plasmas generated by glow discharge. The water repellency of plasma-treated fabrics were evaluated with contact angle meter. The change in surface morphologies was observed by SEM, and the change of surface chemical characteristics were analyzed by FT-IR, ESCA and microchemical analysis technique. The results obtained are as follows : 1) The contact angle of plasma-treated fabric was over $150^\circ{C}$. 2) It was observed by SEM that the surface of treated substrate was over coated with thin film formed by the fluorocarbon plasma treatment. 3) According to ESCA analysis, there were prevailing -CHF-, $-CF_2$- and a little $-CF_3$ components on fluorocarbon plasma treated substrate. -CHF- and $-CF_2$- components were reduced by washing, and $-CF_2$- component was recovered by heat treatment. 4) In consideration of quantitative analysis of fluorine and F/C ratio by ESCA, we found that fluorination reached to the inner of substrate.

  • PDF

A Study on Improvement of Interfacial Adhesion Energy of Inkjet-printed Ag Thin film on Polyimide by CF4 Plasma Treatment (CF4플라즈마 처리에 의한 잉크젯 프린팅 Ag박막과 폴리이미드 사이의 계면파괴에너지 향상에 관한 연구)

  • Park, Sung-Cheol;Cho, Su-Hwan;Jung, Hyun-Cheol;Joung, Jae-Woo;Park, Young-Bae
    • Korean Journal of Materials Research
    • /
    • v.17 no.4
    • /
    • pp.215-221
    • /
    • 2007
  • The effect of $CF_4$ plasma treatment condition on the interfacial adhesion energy of inkjet printed Ag/polyimide system is evaluated from $180^{\circ}$ peel test by calculating the plastic deformation energy of peeled metal films. Interfacial fracture energy between Ag and as-received polyimide was 5.5 g/mm. $CF_4$ plasma treatment on the polyimide surface enhanced the interfacial fracture energy up to 17.6 g/mm. This is caused by the increase in the surface roughness as well as the change in functional group of the polyimide film due to $CF_4$ plasma treatment on the polyimide surface. Therefore, both the mechanical interlocking effect and the chemical bonding effect are responsible for interfacial adhesion improvement in ink jet printed Ag/polyimide systems.

Enhancement in the Amine Resistance of Membranes for Membrane Contactors by Plasma Treatment (플라즈마를 이용한 막접촉기용 막의 아민 용액에 대한 저항성 향상)

  • Choi, Seung-Hak;Oh, Sae-Joong;Cho, Nam-Joon;Koo, Ja-Kyung
    • Korean Chemical Engineering Research
    • /
    • v.40 no.6
    • /
    • pp.719-724
    • /
    • 2002
  • Celgard and Durapore membranes were plasma-treated to enhance the hydrophobicity and durability to amine solution. The plasma gases or vapors used were $CF_4$, Hexafluorobenzene(HFP), Pentafluoropyridine(PFP) and Hexamethyldisiloxane(HMDS). The surface structure of plasma treated membranes was analyzed by FT-IR spectra. The contact angles of plasma treated Celgard and Durapore were dependent of the plasma gases used. $CF_4$ and HMDS plasma increased the contact angles of Celgard and Durapore, while HFB and PFP plasma decreased the contact angles. Durability to monoethanolamine(MEA) solution was enhanced for $CF_4$ plasma-treated Durapore, while the durability was not good for plasma-treated Celgard.

The Effects of CF4 Partial Pressure on the Hydrophobic Thin Film Formation on Carbon Steel by Surface Treatment and Coating Method with Linear Microwave Ar/CH4/CF4 Plasma

  • Han, Moon-Ki;Cha, Ju-Hong;Lee, Ho-Jun;Chang, Cheol Jong;Jeon, Chang Yeop
    • Journal of Electrical Engineering and Technology
    • /
    • v.12 no.5
    • /
    • pp.2007-2013
    • /
    • 2017
  • In order to give hydrophobic surface properties on carbon steel, the fluorinated amorphous carbon films were prepared by using linear 2.45GHz microwave PECVD device. Two different process approaches have been tested. One is direct deposition of a-C:H:F films using admixture of $Ar/CH_4/CF_4$ working gases and the other is surface treatment using $CF_4$ plasma after deposition of a-C:H film with $Ar/CH_4$ binary gas system. $Ar/CF_4$ plasma treated surface with high $CF_4$ gas ratio shows best hydrophobicity and durability of hydrophobicity. Nanometer scale surface roughness seems one of the most important factors for hydrophobicity within our experimental conditions. The properties of a-C:H:F films and $CF_4$ plasma treated a-C:H films were investigated in terms of surface roughness, hardness, microstructure, chemical bonding, atomic bonding structure between carbon and fluorine, adhesion and water contact angle by using atomic force microscopy (AFM), nano-indentation, Raman analysis and X-ray photoelectron spectroscopy (XPS).

Effect of Low Temperature Plasma Pretreatment on the Color Depth of Wool Fabrics (양모직물의 염착농도에 미치는 저온플라즈마 처리의 영향)

  • 배소영;이문철
    • Textile Coloration and Finishing
    • /
    • v.4 no.2
    • /
    • pp.76-83
    • /
    • 1992
  • Wool tropical and nylon taffeta were treated with low temperature plasma of $O_2$, $N_2$, NH$_3$, CF$_4$ and CH$_4$ for the intervals of 10 to 300 sec, and then dyed with leveling and milling type acid dyes in presence or absence of buffer solution. From the color depth of dyed fabrics, effect of plasma gases, treated time, dyeing time and temperature on dyeing property was studied. The results of the experiment can be summarized as follows: 1) The plasma treatments except methane gas increased the color depth of dyed wool fabrics, but not that of dyed nylon fabrics regardless of the plasma gases used. 2) The color depth of wool fabrics dyed in the dye bath without buffer solution was increased by the low temperature plasma, especially increased much more by CF$_4$ plasma treatment. It is found that with the identification of F- ion in the residual dye bath the hydrogen fluoride gas was adsorbed on wool fabrics in the plasma treatment. 3) The color depth of wool fabrics was increased with the time of $O_2$ and CF$_4$ plasma treatments. 4) In both cases of the leveling and milling type acid dyes, the rate of dyeing was increased in the low temperature plasma treatments, and it is found that the leveling type acid dye increased the color depth at relatively low temperature below 4$0^{\circ}C$, compared with the milling type acid dye.

  • PDF

Properties of Spin-On-Glass Siloxane Thin Films Fluorine-doped by CF$_4$ Plasma (CF$_4$ 플라즈마 처리로 불소를 첨가한 실록산 Spin-On-Glass 박막의 특성)

  • 김현중;김기호
    • Journal of Surface Science and Engineering
    • /
    • v.34 no.3
    • /
    • pp.258-263
    • /
    • 2001
  • Siloxane thin films were fabricated on a silicon wafer by spin-coating using a siloxane solution made by the sol-gel process. Fluorine was doped using$ CF_4$ plasma treatment. The film was then annealed in-situ state in the nitrogen atmosphere. In order to examine the influence of annealing and fluorine doping on the siloxane thin film, thermogravimetric-differential thermal analysis (TG-DTA), Fourier transform-infrared spectroscopy (FT-IR) and X-ray photoelectron spectroscopy (XPS) were used and the dielectric constant was determined by the high-frequency capacitance-voltage method. Stable siloxane films could be obtained by in-situ annealing in a nitrogen atmosphere after $CF_4$ plasma treatment, and the dielectric value of the film was $\varepsilon$ 2.5.

  • PDF

Water Repellent Finish of Polyester Fabric Using Glow Discharge Treatment (글로우방전을 이용한 폴리에스테르 직물의 투습방수성 개질)

  • 김태년
    • Journal of the Korean Society of Clothing and Textiles
    • /
    • v.25 no.1
    • /
    • pp.154-161
    • /
    • 2001
  • We have treated polyester fabric with $CF_4,\;C_2F_6,\;SF_6\;and\;C_3F_6$ glow discharge plasmas to develop functional fabrics which preserve moisture transportation and water proofing nature. Modified properties were evaluated by water vapor permeation rate and breakthrough water pressure. The change of surface morphology was observed by SEM. Fiber interstice of the plasma treated fabric was calculated as $0.32{\mu}{\textrm}{m}$, and this value was sufficiently ideal as water repellent material. The moisture transportation of ${CF_4}-treated$ fabric was good as much as untreated fabric, and those of $C_2$F(sub)6-treated, SF(sub)6-treated fabrics were reduced by 1~3%, and that of ${C_3F_6}-treated$ fabric was reduced by 15%. The best treatment condition were 0.06 torr 120 seconds in $CF_4$, 0.05 torr 30 seconds in $SF_6$, 0.08~0.15 torr 90 seconds in $SF_6$ and 0.1 torr 45 seconds in $C_3F_6$ respectively. The grade of moisture transportation effect was $CF_4>C_2F_6>SF_6>>C_3F_6$, and water proofing effect was $C_2F_6{\approx}CF_4>C_3F_6>SF_6$. It was observed by SEM that the thin film was formed on the surface of the treated substrate by the fluorocarbon plasma treatment.

  • PDF