• Title/Summary/Keyword: $Ar/N_2$ plasma

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A study on the TiN coating applied to a rolling wire probe

  • Song, Young-Sik;S. K. Yang;Kim, J.
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2003.10a
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    • pp.118-118
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    • 2003
  • In a rolling wire probe, a key component of an inspection apparatus for PDP electrode patterns, the electric performance of it is known to be strongly dependent on the surface condition of a collet pin, a needle pin, and a wire. However, the collet and needle pins rotate very rapidly in contact with each other, which results in the degradation of the surface by the heat and friction and finally the formation of black wear marks on the surface after a several hundred hours test. Once the black wear marks appear on the surface, the electric resistance of the probe increases sharply and so the integrity of the probe is severely damaged. In this experiment, TiN coating, which has excellent electric conductances and good wear-resistance, has been applied on the surface of collect and needle pins for preventing the surface damages. In order to achieve the homogeneous coating with a good adhesion property, special coating substrate stages and jigs were designed and applied during coating. TiN has been deposited using 99.999% Titanium target by a DC reactive sputtering method. According to the components and jigs, processing parameters, such as DC power, RF bias and the flow rate ratio of Ar and N$_2$ used as reactive gases, has been controlled to obtain good TiN films. Detailed problems and solutions for applying the new substrate stages and jigs will be discussed.

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Characteristic of Nitrogen doped Diamond-Like Carbon film on the Silicon substrates (실리콘 기판에 증착된 질소도핑 DLC 박막의 특성)

  • Nguyen, Van Cao;Kim, Tae Hyeon;Kim, Hye Sung;Shin, Dong Chul;Kim, Tae Gyu
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.12 no.2
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    • pp.34-40
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    • 2013
  • Various depositional conditions, such as substrate, pressure, deposition time, temperature of substrate, power and gas composition, have mainly been studied to attain DLC films using RF sputtering system up to the current. In this study, the $N_2/Ar/CH_4$ gas mixture factored on characteristics of DLC deposited film such as structure, hardness, electrical property were investigated. The concentration of the $N_2$ gas in the sputtering gas may be a significant effect on the growth rate of the doped films, because nitrogen ions react not only with the carbon atoms on the target but also with $C_xH_y$ ions in the plasma on the substrate surface. It was seen from this experimental that the resistance of deposited film is decreased, and the relative intensity ratio of D to G peak is increased as nitrogen content of film deposition is increased.

Properties of Phosphorus Doped ${\mu}c$-Si:H Thin Films Prepared by PECVD (PECVD에 의하여 제조된 Phosphorus-Doped ${\mu}c$-Si:H 박막의 특성)

  • Lee, J.N.;Moon, D.G.;Ahn, B.T.;Im, H.B.
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1992.11a
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    • pp.22-27
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    • 1992
  • Phosphorus doped hydrogenated microcrystalline silicon (${\mu}c$-Si:H) thin films were deposited by PECVD (Plasma Enhanced Chemical Vapour Deposition) method using 10.2% $SiH_4$ gas (diluted in Ar) and 308ppm $PH_3$ gas (diluted in Ar). The structural, optical and electrical properties of the films were investigated as a function of substrate temperature(15 to $400^{\circ}C$) and RF power(10 to 120W). The thin film deposited by varing substrate temperature had columnar structure and microcrystalline phase. The volume fraction of microcrystalline phase in the films deposited at RF power of 80W, increased with increasing substrate temperature up to $200^{\circ}C$, and then decreased with further increasing substrate temperature. Volume fraction of microcrystalline phase increased monotonously with increasing RF power at substrate temperature of $250^{\circ}C$. With increasing volume fraction of microcrystalline, electrical resistivity of films decreased to 0.274 ${\Omega}cm$.

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Composition, Structure and Resistivity of TiN Thin, Films Deposited by RF PECVD (RF PECVD법에 의해 증착된 TiN 박막의 조성, 구조 및 전기적 특성)

  • Jeon, Byeong-Hyeok;Kim, Jong-Seok;Lee, Won-Jong
    • Korean Journal of Materials Research
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    • v.5 no.5
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    • pp.552-559
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    • 1995
  • Titanium nitride films were deposited on the (100) oriented-p-type silicon substrates of RF plasma enhanced chemical vapor depositiom\n using a gaseous mixutre of TiCl$_{4}$, N$_{2}$, H$_{2}$ and Ar. The chemincal composition, structure and the rsistivituy of the films were investigated with the deposition variables such as the flow rate ratio of N$_{2}$/TiCl$_{4}$, the deposition temperature and the RF power. The deposition rate increases with increasing the flow rate ratio of N$_{2}$TiCl$_{4}$ and RF power, while the rate decreases with increasing the deposition temperature. As the flow rate ratio of N$_{2}$/TiCl$_{4}$ and depostion temperature increases within proper RF pwoer, the Cl concentartion in the films decreases and the stoichiometry and crystallingiy are improved, so decreases the resistivity of the films. The films depostied under the condition of the N$_{2}$/TiCl$_{4}$ ratio of 30, the RF power of 50W and the depostion temperature of 62$0^{\circ}C$ had the Cl content of 1.5at% and the resistivity of 56㏁cm. Also, the bottom coverage of the films was above 60% on the step with the width and depth of 0.6${\mu}{\textrm}{m}$$\times$0.6${\mu}{\textrm}{m}$.

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Hydrogen Effect on Deposition Rate of Aluminum Thin Films from Chemical Vapor Deposition Using Dimethylethylamine Alane (DMEAA를 사용해 CVD법으로 증착한 알루미늄 박막의 증착속도에 관한 수소 효과)

  • Jang, Tae-Ung;Lee, Hwa-Seong;Baek, Jong-Tae;An, Byeong-Tae
    • Korean Journal of Materials Research
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    • v.8 no.2
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    • pp.131-134
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    • 1998
  • The deposition rate and surface morphology of Al films deposited by MOCVD have been studied on the $SiO_{2}$ and TiN(60nm/Si) substrates. A1 films were deposited with the pyrolysis of dimethylethylamine alane(DMEAA). When A1 was deposited on Ti& substrate without carrier gas, Al deposition rate increased with H\ulcorner pre- treatment. The $H_2$ gas enhances the CVD reaction at the substrate surface. When Al was deposited on $SiO_{2}$ substrate, $H_2$ plasma pretreatment reduced Al incubation time and made a dense Al film compared with Ar plasma pre- treatment or no pretreatment.

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POLYMER SURFACE MODIFICATION WITH PLASMA SOURCE ION IMPLANTATION TECHNIQUE

  • Han, Seung-Hee;Lee, Yeon-Hee;Lee, Jung-Hye;Yoon, Jung-Hyeon;Kim, Hai-Dong;Kim, Gon-ho;Kim, GunWoo
    • Journal of the Korean institute of surface engineering
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    • v.29 no.5
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    • pp.345-349
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    • 1996
  • The wetting property of polymer surfaces is very important for practical applications. Plasma source ion implantation technique was used to improve the wetting properties of polymer surfaces. Poly(ethylene terephtalate) and other polymer sheets were mounted on the target stage and an RF plasma was generated by means of an antenna located inside the vacuum chamber. High voltage pulses of up to -10kV, 10 $\mu$sec, and up to 1 kHz were applied to the stage. The samples were implanted for 5 minutes with using Ar, $N_2,O_2,CH_4,CF_4$ and their mixture as source gases. A contact angle meter was used to measure the water contact angles of the implanted samples and of the samples stored in ambient conditions after implantation. The modified surfaces were analysed with Time-Of-Flight Mass Spectrometer (TOF-SIMS) and Auger Electron Spectroscopy (AES). The oxygen-implanted samples showed extremely low water contact angles of $3^{\circ}C$ compared to $79^{\circ}C$ of unimplanted ones. Furthermore, the modified surfaces were relatively stable with respect to aging in ambient conditions, which is one of the major concerns of the other surface treatment techniques. From TOF-SIMS analysis it was found that oxygen-containing functional groups had been formed on the implanted surfaces. On the other hand, the $CF_4$-implanted samples turned out to be more hydro-phobic than unimplanted ones, giving water contact angles exceeding $100^{\circ}C$ . The experiment showed that plasma source ion implantation is a very promising technique for polymer surface modification especially for large area treatment.

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Investigation of acoustic monitoring on laser shock cleaning process (레이저 충격파 클리닝 공정에서 음향 모니터링에 관한 연구)

  • 김태훈;이종명;조성호;김도훈
    • Laser Solutions
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    • v.6 no.2
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    • pp.27-33
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    • 2003
  • A laser shock cleaning technology is a new dry cleaning methodology for the effective removal of small particles from the surface. This technique uses a plasma shock wave produced by a breakdown of air due to an intense laser pulse. In order to optimize the laser shock cleaning process, it needs to evaluate the cleaning performance quantitatively by using a monitoring technique. In this paper, an acoustic monitoring technique was attempted to investigate the laser shock cleaning process with an aim to optimize the cleaning process. A wide-band microphone with high sensitivity was utilized to detect acoustic signals during the cleaning process. It was found that the intensity of the shock wave was strongly dependent on the power density of laser beam and the gas species at the laser beam focus. As a power density was larger, the shock wave became stronger. It was also seen that the shock wave became stronger in the case of Ar gas compared with air and N$_2$ gas.

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저온 대기압 아크젯의 플라즈마 발생부 물질에 따른 플라즈마 온도 변화 연구

  • Jeong, Hui-Su;Choe, Won-Ho
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.08a
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    • pp.339-339
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    • 2011
  • 진공 플라즈마와 달리 개방된 공간에서 방전되는 대기압 플라즈마는 진공상태에서 수행되는 에칭, 증착 등의 복잡한 플라즈마 공정을 경제적이고 신속하게 수행할 수 있어, 최근 들어 연구가 활발히 진행 중이다. 이와 관련하여 He, Ar, $N_2$, $O_2$, Air 등의 여러 종류의 기체를 50 kHz 고전압에서 방전하여 대기 중에서 저온 플라즈마 공정이 가능한 아크젯 타입의 플라즈마 소스를 개발하였다. 개발된 플라즈마 소스에서는 입력전압, 기체유량, 노즐의 구조와 크기 등의 여러 운전변수에 따라 플라즈마의 방전특성이 변화되었다. 특히 본 연구에서는 아크젯의 플라즈마 발생부의 물질성분(SUS, Aluminum, Cupper)에 따른 플라즈마의 기체온도 및 전자여기 온도의 변화를 광방출분광법(OES)를 이용한 Synthetic spectrum method와 Boltzmann plot method을 통해 살펴보았다. 전압-전류 특성곡선, 시간분해 이미지 촬영법, 기체온도 측정법 등을 이용하여 발생된 플라즈마의 물리적인 특성을 분석하였다. 특히 물질의 성분에 따라 발생되는 플라즈마의 기체 및 전자여기 온도가 이차 전자 방출계수 및 물질의 전도도와의 상관관계가 있는지 연구가 진행 중이다.

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Hard TiN Coating by Magnetron-ICP P $I^3$D

  • Nikiforov, S.A.;Kim, G.H.;Rim, G.H.;Urm, K.W.;Lee, S.H.
    • Journal of the Korean institute of surface engineering
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    • v.34 no.5
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    • pp.414-420
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    • 2001
  • A 30-kV plasma immersion ion implantation setup (P $I^3$) has been equipped with a self-developed 6'-magnetron to perform hard coatings with enhanced adhesion by P $I^3$D(P $I^3$ assisted deposition) process. Using ICP source with immersed Ti antenna and reactive magnetron sputtering of Ti target in $N_2$/Ar ambient gas mixture, the TiN films were prepared on Si substrates at different pulse bias and ion-to-atom arrival ratio ( $J_{i}$ $J_{Me}$ ). Prior to TiN film formation the nitrogen implantation was performed followed by deposition of Ti buffer layer under A $r^{+}$ irradiation. Films grown at $J_{i}$ $J_{Me}$ =0.003 and $V_{pulse}$=-20kV showed columnar grain morphology and (200) preferred orientation while those prepared at $J_{i}$ $J_{Me}$ =0.08 and $V_{pulse}$=-5 kV had dense and eqiaxed structure with (111) and (220) main peaks. X-ray diffraction patterns revealed some amount of $Ti_{x}$ $N_{y}$ in the films. The maximum microhardness of $H_{v}$ =35 GN/ $M^2$ was at the pulse bias of -5 kV. The P $I^3$D technique was applied to enhance wear properties of commercial tools of HSS (SKH51) and WC-Co alloy (P30). The specimens were 25-kV PII nitrogen implanted to the dose 4.10$^{17}$ c $m^{-2}$ and then coated with 4-$\mu\textrm{m}$ TiN film on $Ti_{x}$ $N_{y}$ buffer layer. Wear resistance was compared by measuring weight loss under sliding test (6-mm $Al_2$ $O_3$ counter ball, 500-gf applied load). After 30000 cycles at 500 rpm the untreated P30 specimen lost 3.10$^{-4}$ g, and HSS specimens lost 9.10$^{-4}$ g after 40000 cycles while quite zero losses were demonstrated by TiN coated specimens.s.

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Development and spectroscopic characteristics of the high-power wave guide He Plasma (도파관식 고출력 헬륨 플라즈마의 개발과 분광학적 특성 연구)

  • Lee, Jong-Man;Cho, Sung-Il;Woo, Jin-Chun;Pak, Yong-Nam
    • Analytical Science and Technology
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    • v.25 no.5
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    • pp.265-272
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    • 2012
  • Okamoto cavity was modified to generate high power (2.45 GHz, 2 kW) He, N2 and Ar plasmas with WR-340 waveguide. Many factors which influence to the plasma generation were optimized and investigated for the spectroscopic properties of the He plasma generated. Some of the important factors are the diameter of the inner conductor, the distance between the inner and outer conductors and the distance between the tip of the inner conductor and the torch. After optimization for the He, two torches (a commercial mini torch for ICP and a tangential flow torch made locally) were compared and showed similar results for the helium plasma gas flow of 25 L/min~30 L/min. A tall torch (extended) was used to block the air in-flow and reduced the background intensity at 340 nm region (NH band). Emission intensity was measured for determination of halogen element in the aqueous solution with power and carrier gas flow rate. Electron number density and the excitation temperature were on the order of $3.67{\times}10^{11}/cm^3$ and 4,350 K, respectively. These values are similar or a bit smaller than other microwave plasmas. It has been possible to analyze aqueous samples. The detection limit for Cl (479.45 nm) was obtained to be 116 mg/L and needs analytical optimization for the better performance.