• Title/Summary/Keyword: $Al_2O_3$ oxide film

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An Investigation on the Dielectric and Microwave Properties of Ag(Ta,Nb)O3 Thick Films on the Alumina Substrates (알루미나 기판에 스크린 프린팅된 Ag(Ta,Nb)O3 후막의 유전특성 및 초고주파 특성에 대한 연구)

  • Lee, Ku-Tak;Koh, Jung-Hyuk
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.11
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    • pp.925-928
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    • 2011
  • Perovskite niobates and tantalates have been placed on a short list of functional materials for future technologies. This article was investigated ferroelectric materials $Ag(Ta,Nb)O_3$ thick film. In this study, we have fabricated the $Ag(Ta,Nb)O_3$ thick film on the $Al_2O_3$ substrates by screen printing method. The $Ag(Ta,Nb)O_3$ thick film were fabricated by the mixed oxide method. The sintering temperature and time were 1,150$^{\circ}C$, 2 hr. The electrical properties of $Ag(Ta,Nb)O_3$ thick film were investigated at 30~100$^{\circ}C$.

Dielectric Characteristics of $Al_2O_3$ Thin Films Deposited by Reactive Sputtering

  • Park, Jae-Hoon;Park, Joo-Dong;Oh, Tae-Sung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2000.02a
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    • pp.100-100
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    • 2000
  • Aluminium oxide (Al2O3) films have been investigated for many applications such as insulating materials, hard coatings, and diffusion barriers due to their attractive electrical and mechanical properties. In recent years, application of Al2O3 films for dielectric materials in integrated circuits as gates and capacitors has attracted much attention. Various deposition techniques such as sol-gel, metalorganic decomposition (MOD), sputtering, evaporation, metalorganic chemical vapor deposition (MOCVD), and pulsed laser ablation have been used to fabricate Al2O3 thin films. Among these techniques, reactive sputtering has been widely used due to its high deposition rate and easy control of film composition. It has been also reported that the sputtered Al2O3 films exhibit superior chemical stability and mechanical strength compared to the films fabricated by other processes. In this study, Al2O3 thin films were deposited on Pt/Ti/SiO/Si2 and Si substrates by DC reactive sputtering at room temperature with variation of the Ar/O2 ratio in sputtering ambient. Crystalline phase of the reactively sputtered films was characterized using X-ray diffractometry and the surface morphology of the films was observed with Scanning election microscopy. Effects of Th Ar/O2 ratio characteristics of Al2O3 films were investigated with emphasis on the thickness dependence of the dielectric properties. Correlation between the dielectric properties and the microstructure was also studied

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Oxidation of CrAlMgSiN thin films between 600 and 900℃ in air (CrAlMgSiN 박막의 600-900℃에서의 대기중 산화)

  • Won, Seong-Bin;Xu, Chunyu;Hwang, Yeon-Sang;Lee, Dong-Bok
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2013.05a
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    • pp.112-113
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    • 2013
  • Thin CrAlMgSiN films, whose composition were 30.6Cr-11.1Al-7.3Mg-1.2Si-49.8N (at.%), were deposited on steel substrates in a cathodic arc plasma deposition system. They consisted of alternating crystalline Cr-N and AlMgSiN nanolayers. After oxidation at $800^{\circ}C$ for 200 h in air, a thin oxide layer formed by outward diffusion of Cr, Mg, Al, Fe, and N, and inward diffusion of O ions. Silicon ions were relatively immobile at $800^{\circ}C$. After oxidation at $900^{\circ}C$ for 10 h in air, a thin $Cr_2O_3$ layer containing dissolved ions of Al, Mg, Si, and Fe formed. Silicon ions became mobile at $900^{\circ}C$. After oxidation at $900^{\circ}C$ for 50 h in air, a thin $SiO_2-rich$ layer formed underneath the thin $Cr_2O_3$ layer. The film displayed good oxidation resistance. The main factor that decreased the oxidation resistance of the film was the outward diffusion and subsequent oxidation of Fe at the sample surface, particularly along the coated sample edge.

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Fabrication and Properties of Silicon Solar Cells using Al2O3/Si/Al2O3 Structures (Al2O3/Si/Al2O3구조를 이용한 실리콘태양전지 제작 및 특성)

  • Kim, Kwang-Ho
    • Journal of the Semiconductor & Display Technology
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    • v.14 no.4
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    • pp.45-49
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    • 2015
  • Using a combined CVD and ALD equipment system, multi-layer quantum well structures of $Al_2O_3/a-Si/Al_2O_3$ were fabricated on silicon Schottky junction devices and implemented to quantum well solar cells, in which the 1~1.5 nm thicknesses of the aluminum oxide films and the a-Si thin film layers were deposited at $300^{\circ}C$ and $450^{\circ}C$, respectively. Fabricated solar cell was operated by tunneling phenomena through the inserted quantum well structure being generated electrons on the silicon surface. Efficiency of the fabricated solar cell inserted with multi-quantum well of 41 layers has been increased by about 10 times that of the solar cell of pure Schottky junction solar cell.

The Effect of SiON Film on the Blistering Phenomenon of Al2O3 Rear Passivation Layer in PERC Solar Cell

  • Jo, Guk-Hyeon;Jang, Hyo-Sik
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.364.1-364.1
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    • 2014
  • 고효율 태양전지로 가기 위해서는 태양전지의 후면 패시베이션은 중요한 역할을 한다. 후면 패시베이션 막으로 사용되는 $Al_2O_3$ 막은 $Al_2O_3/Si$ 계면에서 높은 화학적 패시베이션과 Negative Fixed Charge를 가지고 있어 적합한 Barrier막으로 여겨진다. 하지만 이후에 전면 Metal paste의 소성 공정에 의해 $800^{\circ}C$이상 온도를 올려주게 됨에 따라 $Al_2O_3$ 막 내부에 결합되어 있던 수소들이 방출되어 blister가 생성되고 막 질은 떨어지게 된다. 우리는 blister가 생성되는 것을 방지하기 위한 방법으로 PECVD 장비로 SiNx를 증착하는 공정 중에 $N_2O$ 가스를 첨가하여 SiON 막을 증착하였다. SiON막은 $N_2O$가스량을 조절하여 막의 특성을 변화시키고 변화에 따라 소성시 막에 미치는 영향에 대하여 조사하였다. 공정을 위해 $156{\times}156mm2$, $200{\mu}m$, $0.5-3.0{\Omega}{\cdot}cm$ and p-type 단결정 실리콘 웨이퍼를 사용하였고, $Al_2O_3$ 막을 올리기 전에 RCA Cleaning 실행하였다. ALD 장비를 통해 $Al_2O_3$ 막을 10nm 증착하였고 RF-PECVD 장비로 SiNx막과 SiON막을 80nm 증착하였다. 소성로에서 $850^{\circ}C$ ($680^{\circ}C$) 5초동안 소성하고 QSSPC를 통해 유효 반송자 수명을 알아보았다.

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The Study on Characteristics of Green Organic Light Emitting Device with Transparency Conductive Oxide Electrodes (투명전도성 산화물 전극에 따른 Green OLED의 특성연구)

  • Ki, Hyun-Chul;Kim, Seon-Hoon;Kim, Hwe-Jong;Kim, Sang-Gi;Choi, Young-Sung;Hong, Kyung-Jin
    • The Transactions of the Korean Institute of Electrical Engineers P
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    • v.58 no.4
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    • pp.615-618
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    • 2009
  • In order to apply for transparent conductive oxide(TCO), we deposited ZnO thin film on the glass at room temperature by RF magnetron sputtering method. Deposition conditions for low resistivity were optimized in our previous studies. Under the deposition condition with the RF power of 800 [W]. Sheet resistance and surface roughness of ITO and ZnO thin film were measured by Hall-effect measurement system and AFM, respectively. The sheet resistance of ITO and ZnO thin film were 7.290 [$\Omega$] and 4.882 [$\Omega$], respectively. and surface roughness were 3.634 [nm] and 0.491 [nm], respectively. Green OLED was fabricated with the structure of TPD(400 [$\AA$])/Alq3(600 [$\AA$])/LiF(5 [$\AA$])/Al(1200 [$\AA$]). Turn-on voltage of green OLED applied ITO was 7 [V] and luminance was 7,371 [$cd/m^2$]. And, Turn-on voltage of green OLED applied ZnO was 14 [V] and luminance was 6,332 [$cd/m^2$].

Effect of Gate Dielectrics on Electrical Characteristics of a-ITGZO Thin-Film Transistors (게이트 절연막 조성에 따른 a-ITGZO 박막트랜지스터의 전기적 특성 연구)

  • Kong, Heesung;Cho, Kyoungah;Kim, Sangsig
    • Journal of IKEEE
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    • v.25 no.3
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    • pp.501-505
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    • 2021
  • In this study, we fabricated amorphous indium-tin-gallium-zinc-oxide thin-film transistors (a-ITGZO TFTs) with gate dielectrics of HfO2 and the mixed layers of HfO2 and Al2O3, and investigated the effect of gate dielectric on electrical characteristics of a-ITGZO TFTs. When only HfO2 was used as the gate dielectric, the mobility and subthreshold swing (SS) were 32.3 cm2/Vs and 206 mV/dec. For the a-ITGZO TFTs with gate dielectric made of HfO2 and Al2O (2:1, 1:1), the mobilities and SS were 26.4 cm2/Vs (2:1), 16.8 cm2/Vs(1:1), 160 mV/dec (2:1) and 173 mV/dec (1:1). On the other hand, the hysteresis window shown in transfer curves of the a-ITGZO TFTs was lessened from 0.60 to 0.09 V by the increase of Al2O3 ratio in gate dielectric, indicating that the interface trap density between the gate dielectric and channel layer decreases due to Al2O3.

EPD Thick Film Formation of Ceramic Powder Materials (세라믹 분말재료의 EPD 후막형성 기술)

  • Soh, Dea-Wha;Jeon, Yong-Woo
    • Journal of the Speleological Society of Korea
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    • no.75
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    • pp.49-54
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    • 2006
  • Electrophoretic Deposition (EPD) is the most convenient technology to deposit natural or oxide powders of nonconductive materials in alcoholic suspension solution with adding electrolyte of iodine to form ceramic thick film on metal substrate under applied electric field with double electric layer between electrode and metal substrate. In this research work, the important parameters and technical ways were studied to form EPD thick films of typical oxide ceramics of Al2O3, YBCO and tourmaline powders.

A Study on the Optical and Electrical Properties of Ga-doped ZnO Films for Opto-electronic Devices (광전소자 응용을 위한 Ga가 첨가된 ZnO 박막의 광학적 및 전기적 특성 연구)

  • Gil, Byung-Woo;Lee, Seong-Eui;Lee, Hee-Chul
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.4
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    • pp.303-308
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    • 2011
  • The Gallium-doped ZnO(GZO) film deposited at a temperature of $200^{\circ}C$ and a pressure of 10 mtorr has an optical transmittance of 89.0% and a resistivity of $2.0\;m{\Omega}{\cdot}cm$ because of its high crystallinity. Effect of $Al_2O_3$ oxide buffer layers on the optical and electrical properties of sputtered ZnO films were intensively investigated for developing the electrodes of opto-electronic devices which demanded high optical transmittance and low resistivity. The use of $Al_2O_3$ buffer layer could increase optical transmittance of GZO film to 90.7% at a wavelength of 550 nm by controlling optical spectrum. Resistivity of deposited GZO films were much dependent on the deposition condition of $O_2/(Ar+O_2)$ flow rate ratio during the buffer layer deposition. It is considered that the $Al_2O_3$ buffer layer could increase the carrier concentration of the GZO films by doping effect of diffused Al atoms through the rough interface.

Passivation Quality of ALD $Al_2O_3$ Thin Film via Silicon Oxide Interfacial Layer for Crystalline Silicon Solar Cells (실리콘 산화막의 두께에 따른 ALD $Al_2O_3$ 박막의 passivation 효과)

  • Kim, Young-Do;Park, Sung-Eun;Tark, Sung-Ju;Kang, Min-Gu;Kwon, Soon-Woo;Yoon, Se-Wang;Kim, Dong-Hwan
    • 한국신재생에너지학회:학술대회논문집
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    • 2009.06a
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    • pp.93-93
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    • 2009
  • 실리콘 태양전지의 효율 향상을 위한 노력의 일환으로 결정질 실리콘 웨이퍼 표면passivation 물질 중 Atomic Layer Deposition (ALD)을 이용하여 증착한 $Al_2O_3$ 박막에 대한 관심이 증가하고 있다. 본 연구에서는 $Al_2O_3$ 박막의 증착 전 실리콘 웨이퍼의 산화막 두께에 따른 passivation 효과에 대해서 연구하였다. 실리콘 산화막은 $HNO_3$ 용액을 사용하여 화학적으로 생성시켰으며 $HNO_3$ 용액과의 반응 시간을 조절하여 실리콘 산화막의 두께를 조절하였다. 실리콘 산화막 생성 후 ALD로 $Al_2O_3$ 박막을 증착하였으며 증착 후 $N_2$ 분위기에서 annealing 하였다. Annealing 후 passivation 효과는 Quasi-Steady-State Photo Conductance를 사용하여 minority carrier의 lifetime을 측정하였다. Capacitance-Voltage measurement, Transmission Electron Microscopy, Ellipsometry를 사용하여 실리콘 산화막의 두께에 따른 $Al_2O_3$ 박막의 passivation 효과를 분석하였다.

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