• Corrosion Science and Technology
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• 제11권1호
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• pp.9-14
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• 2012

The formation of the Fe-Al inhibition layer in hot-dip galvanizing is a confusing issue for a long time. This study presents a characterization result on the inhibition layer formed on C-Mn-Cr and C-Mn-Si dual-phase steels after a short time galvanizing. The samples were annealed at $800^{\circ}C$ for 60 s in $N_{2}$-10% $H_{2}$ atmosphere with a dew point of $-30^{\circ}C$, and were then galvanized in a bath containing 0.2 %Al. X-ray photoelectron spectroscopy (XPS) and transmission electron microscopy (TEM) was employed for characterization. The TEM electron diffraction shows that only $Fe_{2}Al_{5}$ intermetallic phase was formed. No orientation relationship between the $Fe_{2}Al_{5}$ phase and the steel substrate could be identified. Two peaks of Al 2p photoelectrons, one from metallic aluminum and the other from $Al^{3+}$ ions, were detected in the inhibition layer, indicating that the layer is in fact a mixture of $Fe_{2}Al_{5}$ and $Al_{2}O_{3}$. TEM/EDS analysis verifies the existence of $Al_{2}O_{3}$ in the boundaries of $Fe_{2}Al_{5}$ grains. The nucleation of $Fe_{2}Al_{5}$ and the reduction of the surface oxide probably proceeded concurrently on galvanizing, and the residual oxides prohibited the heteroepitaxial growth of $Fe_{2}Al_{5}$.

• 한국전기전자재료학회논문지
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• 제31권5호
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• pp.324-329
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• 2018

Red phosphor in glasses (PiGs) for automotive light-emitting diode (LED) applications were fabricated with 620-nm $CaAlSiN_3:Eu^{2+}$ phosphor and Pb-free silicate glass. PiGs were synthesized and mounted on high-power blue LED to make a monochromatic red LED. PiGs were simple mixtures of red phosphor and transparent glass powder. After being fabricated with uniaxial press and CIP at 300 MPa for 20 min, the green bodies were thermally treated at $550^{\circ}C$ for 30 min to produce high dense PiGs. As the phosphor content increased, the density of the sintered body decreased and PiGs containing 30% phosphor had a full sintered density. Changes in photoluminescence spectra and color coordination were studied by varying the thickness of plates that were mounted after optical polishing. As a result of the optical spectrum and color coordinates, PiG plate with $210{\mu}m$ thickness showed a color purity of 99.7%. In order to evaluate the thermal stability, the thermal quenching characteristics were measured at temperatures of $30{\sim}150^{\circ}C$. The results showed that the red PIG plates were 30% more thermally stable compared to the AlGaInP red chip.

• 한국결정학회지
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• 제1권1호
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• pp.49-56
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• 1990

Albite-anorthite 계의 조성을 갖는 유리를 결정화 시키면 사장석의 공융상 외에도 육방정과 사방정의 두불안정상이 정출되며 이들의 결정화도를 X-선 회절에 의하여 측정하였다. 사방정의 불안 정상은 albite 70∼80%를 갖는 조성에서 가장 많이 결정화가 일어나며 육방정은 anorthite가 주로된 조성영역에서 결정화가 많이 일어났다. 불안정상 중에서 사방정의 걱정구조를 정산하기 위하여 Nao7 Cao.3 Al13 Si27 O7의 조성을 갖는 단결정편을 분리하여 X-선 회절강도를 측정하였다. 이 결정의 격자상수는 a=8.237(1)A. b=8.644(1)A c=4.818(1)A이며 공간군은 P22,2,이다. 최종정산한 구조의 R값은 0.040이었고 Rw는 0.028이었다. 한위치를 7 3의 비율로 통계적으로 차지하고 있는 Na와 Ca의 위치는 충진율 0.5를 가지며 두 위치로 분열되어 있다. Si가 A1원자는 육환구조내에서는 통계적으로 분포되어 있고 육환층과 층사이에서는 규칙적인 배열을 보이고 있다.

• 자원환경지질
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• 제41권2호
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• pp.165-172
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• 2008

비정질 $SiO_2$와 $Al(OH)_3$를 출발물질로 이용하여 250$^{\circ}C$, $30kg/cm^2$의 조건에서 pH를 2${\sim}$9까지 변화시키면서 캐올리나이트를 수열합성하였다. 합성 캐올리나이트는 XRD, FT-IR, TG, DTA, 및 FE-SEM을 사용하여 광물학적 특성 분석을 실시하였으며, 이로부터 캐올리나이트 합성시 pH의 변화에 따른 영향력을 관찰하였다. 실험결과, 산성조건에서 중-저 결함도와 높은 열적 안정성을 갖는 양호한 캐올리나이트가 합성되었으며, 알카리성 조건에서는 결함이 많은 캐올리나이트가 합성되었다. 이러한 현상은 합성 캐올리나이트의 표면특성이 pH에 의존하기 때문인 것으로 보인다. FT-IR 분석결과, 반응용액의 알칼리도가 증가함에 따라 합성 캐올리나이트의 피크 강도와 분해도가 감소되었으며, TG-DTA 분석결과, 60-70$^{\circ}C$의 저온영역에서의 탈수현상에 의한 피크 강도 증가가 관찰되었다. 이러한 결과는 pH의 증가에 따라 반응에 참여하지 못한 비정질 물질의 양이 증가하기 때문이며 FE-SEM 분석에 의해 확인되었다.

• 한국주조공학회지
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• 제13권3호
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• pp.238-247
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• 1993

Microstructure, hardness and wear characteristics of $SiC_p/Al-6.5wt%Si-1.7wt%Mg$ alloy composites fabricated by the method of rheo-compocasting and hot pressing are investigated in this study. The dispersion of SiC particles in the composites is homogeneous and the hardness improves as additional amount increases. The wear amount of the matrix metal increases highly as wear rates increase, for the wear mechanism changes from adhesive wear to melt wear, and the matrix metal was coated on the surface of revolving disc and its weight increases. In the 5vol% composites, Fe is adhered on the surface of specimen by the projection of the dispersed hard SiC particles which have net-work structure and the coating layer is about $300{\mu}m$. But in the composite more than 20vol%, the wear amount of composite decreases because the SiC particles which have superior hardness, wear resistance and heat resistance properties resist wear, the abrasive wear turn out predominant wear mechanism and so the wear amount of revolving disc increases.

• 한국광학회지
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• 제16권3호
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• pp.275-286
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• 2005

InGaN LED에서 칩 구조 및 칩마운트 구조에 따른 광추출효율의 변화를 Monte Calo 기법을 이용하여 해석하였다. Simulation을 통해 얻은 중요한 결론의 하나는, InGaAlP 또는 InGaN/SiC LED의 경우에서는 달리, InGaN/sapphire LED의 경우 칩의 측 벽면 기울임 기법의 광추출효율 개선효과가 상대적으로 미미하다는 점이다. InGaN/SiC LED의 경우와는 달리, 기판으로 사용되는 sapphire의 굴절률이 상대적으로 작아서 생성된 광자들이 기판으로 넘어가는데 전반사장벽을 만나게 되어, 많은 광자들이 기판으로 넘어가지 못하고 두께가 매우 얇은 반도체 결정층에 갇히는 현상 때문이다. 동일한 현상은 epi-down 구조의 칩 마운트에서 광추출효율이 크게 개선되지 못하는 원인으로도 작용하게 된다. 광추출효율 관점에서의 epi-down 구조의 InGaN/sapphire LED가 갖고 있는 잠재력을 살리기 위한 방법의 하나는 기판-에피택시 계면을 texturing 하는 것이라고 할 수 있는데, 이 경우 생성된 광자들이 다량기판으로 넘어갈 수 있게 되어 광추출효율이 현저하게 개선된다.

• Bulletin of the Korean Chemical Society
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• 제35권7호
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• pp.2013-2018
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• 2014

The adsorption and decomposition of trimethylene oxide ($C_3H_6O$) molecule on the Al(111) surface were investigated by the generalized gradient approximation (GGA) of density functional theory (DFT). The calculations employed a supercell ($6{\times}6{\times}3$) slab model and three-dimensional periodic boundary conditions. The strong attractive forces between $C_3H_6O$ molecule and Al atoms induce the C-O bond breaking of the ring $C_3H_6O$ molecule. Subsequently, the dissociated radical fragments of $C_3H_6O$ molecule oxidize the Al surface. The largest adsorption energy is about -260.0 kJ/mol in V3, V4 and P2, resulting a ring break at the C-O bond. We also investigated the decomposition mechanism of $C_3H_6O$ molecules on the Al(111) surface. The activation energies ($E_a$) for the dissociations V3, V4 and P2 are 133.3, 166.8 and 174.0 kJ/mol, respectively. The hcp site is the most reactive position for $C_3H_6O$ decomposing.

• 열처리공학회지
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• 제10권1호
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• pp.20-29
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• 1997

Pure copper is widely used for base material for electrical and electronic parts because of its good electrical conductivity. However, it has such a low strength that various alloying elements are added to copper to increase its strength. Nevertheless, alloying elements which exist as solid solution elements in copper matrix severely reduce the electrical conductivity. The reduction of electrical conductivity can be minimized and the strengthening can be maximized by TMT(Thermo-Mechanical Treatment) in copper alloys. In this research, the effects of TMT on mechanical and electrical properties of Cu-Ni-Al-Si-P, Cu-Ni-Al-Si-P-Zr and Cu-Ni-Si-P-Ti alloys aged at various temperatures were investigated. The Cu alloy with Ti showed the hardness of Hv 225, electrical conductivity of 59.8%IACS, tensile strength of 572MPa and elongation of 6.4%.

• 한국재료학회지
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• 제25권1호
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• pp.16-20
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• 2015

In this study, in order to improve the efficiency of n-type monocrystalline solar cells with an Alu-cell structure, we investigate the effect of the amount of Al paste in thin n-type monocrystalline wafers with thicknesses of $120{\mu}m$, $130{\mu}m$, $140{\mu}m$. Formation of the Al doped $p^+$ layer and wafer bowing occurred from the formation process of the Al back electrode was analyzed. Changing the amount of Al paste increased the thickness of the Al doped $p^+$ layer, and sheet resistivity decreased; however, wafer bowing increased due to the thermal expansion coefficient between the Al paste and the c-Si wafer. With the application of $5.34mg/cm^2$ of Al paste, wafer bowing in a thickness of $140{\mu}m$ reached a maximum of 2.9 mm and wafer bowing in a thickness of $120{\mu}m$ reached a maximum of 4 mm. The study's results suggest that when considering uniformity and thickness of an Al doped $p^+$ layer, sheet resistivity, and wafer bowing, the appropriate amount of Al paste for formation of the Al back electrode is $4.72mg/cm^2$ in a wafer with a thickness of $120{\mu}m$.

• Journal of Magnetics
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• 제21권2호
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• pp.192-196
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• 2016

The Fe-Si-B-Nb-Cu alloys containing Ca and Al were rapidly solidified to thin ribbons by melt-spinning. The ribbons were ball-milled to make powders, and then mixed with 1 wt.% water glass and 1.5 wt.% lubricant. The mixed powders were burn-off, and then compacted to form toroidal-shaped cores, which were heat treated to crystallize the nano-grain structure and to remove residual stress of material. The characteristics of the powder cores were analyzed using a differential scanning calorimetry (DSC) and a B-H meter. The microstructures were observed using transmission electron microscope (TEM). The optimized soft magnetic properties (${\mu}_i$ and $P_{cv}$) of the powder cores were obtained from the Ca and Al containing alloys after annealing at $530^{\circ}C$ for 1 h. The core loss of Fe-Si-B-Nb-Cu-based powder cores was reduced by the addition of Ca element, and the initial permeability increased due to the addition of Al element.