• Title/Summary/Keyword: $Ag/TiO_2$

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고밀도 유도 결합 플라즈마를 이용한 박막 증착 장치 개발

  • 주정훈
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2003.12a
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    • pp.26-30
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    • 2003
  • 안테나 내장형 유도결합 플라즈마를 마그네트론 스퍼터링 장치에 추가하고 플라즈마의 생성 조건을 제어함으로써 고품질의 박막을 증착할 수 있는 장치의 개발 연구를 수행하였다. 정확한 장치의 성능을 평가하고 앞으로의 개선점을 찾기 위하여 Langmuir probe, OES, RF impedance probe, QMS 등의 플라즈마 진단 도구들을 사용하여 기본 동작 특성 및 공정중 플라즈마의 전자 온도, 밀도, 방출 파장 분석을 통한 입자 상태 분석, 부하 임피던스와 시스템 임피던스 분석을 통한 파워 전달 특성을 평가하고 이에 따라서 장치의 구성 및 동작 조건을 변경 개선하였다. 실험 대상 박막계는 기본 물성 측정을 위한 Al, Ag, TiN, MgO, Si, $SiO_2$, 등이며 타겟의 크기는 2인치 직경의 원형, 12인치 원형, 5인치 * 25인치 사각형 3가지 이다.

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Impedance Spectroscopy Analysis of the Screen Printed Thick Films (스크린 프린트된 후막의 Impedance Spectroscopy 특성 분석)

  • Ham, Yong-Su;Moon, Sang-Ho;Nam, Song-Min;Lee, Young-Hie;Koh, Jung-Hyuk;Jyoung, Soon-Jong;Kim, Min-Soo;Cho, Kyung-Ho
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.23 no.6
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    • pp.477-480
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    • 2010
  • In this study, we fabricate 3 wt% $Li_2CO_3$ doped $(Ba,Sr)TiO_3$ thick films on the Ag/Pd bottom electrode printed $Al_2O_3$ substrates for the LTCCs (low temperature co-fired ceramics) applications. From the X-ray diffraction analysis, 3 wt% $Li_2CO_3$ doped BST thick films on the Ag/Pd printed $Al_2O_3$ substrates, which sintered at $900^{\circ}C$, showed perovskite structure without any pyro phase. The dielectric properties of 3 wt% $Li_2CO_3$ doped BST thick films are measured from 1 kHz to 1 MHz. To investigate the electrical properties of 3 wt% $Li_2CO_3$ doped BST thick films, we employ the impedance spectroscopy. The complex impedance of 3 wt% $Li_2CO_3$ doped BST thick films are measured from 20 Hz to 1 MHz at the various temperatures.

A Study of Electro-Optical Properties of Polyester Acrylate-Based Polymer-Dispersed Liquid Crystals Using TIZO/Ag/TIZO Multilayer Transparent Electrodes (TIZO/Ag/TIZO 다층막 투명전극을 이용한 폴리에스터 아크릴레이트 기반 고분자분산액정의 전기광학적 특성 연구)

  • Cho, Jung-Dae;Heo, Gi-Seok;Hong, Jin-Who
    • Applied Chemistry for Engineering
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    • v.33 no.1
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    • pp.50-57
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    • 2022
  • Ti-In-Zn-O (TIZO)/Ag/TIZO multilayer transparent electrodes were prepared on glass substrates at room temperature using RF/DC magnetron sputtering. Obtained multilayer structure comprising TIZO/Ag/TIZO (10 nm/10 nm/40 nm) with the total thickness of 60 nm showed a transmittance of 86.5% at 650 nm and a sheet resistance of 8.1 Ω/□. The multilayer films were expected to be applicable for use in energy-saving smart window based on polymer-dispersed liquid crystal (PDLC) because of their transmittance properties to effectively block infrared rays (heat rays). We investigated the effects of the content ratio of prepolymer, the thickness of the PDLC coating layer, and the ultraviolet (UV) light intensity on electro-optical properties, and the surface morphology of polyester acrylate-based PDLC systems using new TIZO/Ag/TIZO transparent conducting electrodes. A PDLC cell with a thickness of 15 ㎛ PDLC layer photocured at an UV intensity of 1.5 mW/cm2 exhibited good driving voltage, favorable on-state transmittance, and excellent off-haze. The LC droplets formed on the surface of the polymer matrix of the PDLC composite had a size range of 1 to 3 ㎛ capable of efficiently scattering incident light. Also, the PDLC-based smart window manufactured using TIZO/Ag/TIZO multi-layered transparent electrodes in this study exhibited a light brown, which will have an advantage in terms of aesthetics.

High-Speed Cu Filling into TSV and Non-PR Bumping for 3D Chip Packaging (3차원 실장용 TSV 고속 Cu 충전 및 Non-PR 범핑)

  • Hong, Sung-Chul;Kim, Won-Joong;Jung, Jae-Pil
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.4
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    • pp.49-53
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    • 2011
  • High-speed Cu filling into a through-silicon-via (TSV) and simplification of bumping process by electroplating for three dimensional stacking of Si dice were investigated. The TSV was prepared on a Si wafer by deep reactive ion etching, and $SiO_2$, Ti and Au layers were coated as functional layers on the via wall. In order to increase the filling rate of Cu into the via, a periodic-pulse-reverse wave current was applied to the Si chip during electroplating. In the bumping process, Sn-3.5Ag bumping was performed on the Cu plugs without lithography process. After electroplating, the cross sections of the vias and appearance of the bumps were observed by using a field emission scanning electron microscope. As a result, voids in the Cu-plugs were produced by via blocking around via opening and at the middle of the via when the vias were plated for 60 min at -9.66 $mA/cm^2$ and -7.71 $mA/cm^2$, respectively. The Cu plug with a void or a defect led to the production of imperfect Sn-Ag bump which was formed on the Cu-plug.

Evaporation characteristics of materials from resistive heating sources(I) (저항가열원에 의한 물질의 증발특성(I))

  • 정재인;임병문;문종호;홍재화;강정수;이영백
    • Journal of the Korean institute of surface engineering
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    • v.24 no.1
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    • pp.25-30
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    • 1991
  • The evaporation characteristics of Ag, Al, Au, Cr. Cu, In, Mg, Mn, Pb, Pd, Si, SiO, Sn, Ti and Zn with the various resistive heating sources have been studied. The employed sources are refractory metal (Mo, Ta and W) boats, W-wire, ceramic (usually Al2O3)-coated and -barriered refractory metal boats, and special boats such as baffled boats and intermetallic boats (nitride compound and graphite). We investigated the melting mode, evaporation rate at a specific power, and lifetime of the sources. A special boat holder is also discussed which is needed to cool the sources at a large heat capacity.

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Fabrication of Superconducting Dual Mode Resonator using Laser Ablation (레이저 어블레이션에 의한 초전도 이중모드 공진기 제작)

  • Park, Joo-Hyung;Yang, Seung-Ho;Lee, Sang-Yeol;Ahn, Dal;Sok, Jung-Hyun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1998.06a
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    • pp.41-44
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    • 1998
  • Dual mode resonators were fabricated using high temperature superconductor. The deposited material was $Y_1Ba_2Cu_3O_{7-x}$(YBCO) on MgO(100) substrate using pulsed laser deposition. Dual mode resonators were patterned by standard photolithography process and wet etching. At the back-side of the substrate, the ground plane with the metal layer of Ti and Ag was fabricated. The transition temperatures of YBCO films were 85-88 K, and network analyzer was used for testing the performance of the resonators. The input/output feedline angles of each resonator were $60^{\circ}$and $100^{\circ}$. The resonant frequency of resonators was 10 GHz. In this paper, dual mode resonator was fabricated for the application of satellite communication.

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Fabrication and Characteristics of High Brightness White Emission Electroluminescent Device (고휘도 백색방출 전계발광소자의 제작 및 특성)

  • Bae, Seung-Choon;Kim, Jeong-Hwan;Park, Sung-Kun;Kwun, Sung-Yul;Kim, Woo-Hyun;Kim, Ki-Wan
    • Journal of Sensor Science and Technology
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    • v.8 no.1
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    • pp.10-15
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    • 1999
  • White emission thin film electroluminescent device was fabricated using ZnS for phosphor layer and BST ferroelectric thin film for insulating layer. For fabrication conditions of BST thin film, stoichiometry of target was $Ba_{0.5}Sr_{0.5}TiO_3$, substrate temperature was $400^{\circ}C$, working pressure was 30 mTorr, and A:$O_2$ ratio was 9:1. At this time, dielectric constant was 209 at 1kHz frequency. For phosphor layer ZnS:Mn, ZnS:Tb, and ZnS:Ag were used. Mixing rates of activators were respectively 0.8, 0.8, and 1 wt%. Total thickness of phosphor tapers was 500 nm, thickness of lower insulating layer was 200 nm, and thickness of upper insulating layer was 400 nm. In this conditions, luminescence threshold voltage of thin film electroluminescent device was $95\;V_{rms}$, maximum brightness was $3,000\;cd/m^2$ at $150\;V_{rms}$. Luminescence spectrum peak was observed at region of blue(450 nm), green(550 nm), and red(600 nm).

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Effect of Surface States of the Substrate on the Temperature Rampup Rate During Rapid Thermal Annealing by Halogen Lamps (할로겐 램프에 의한 급속 열처리에서 기판 표면 상태에 따른 온도 상승 효과에 관한 연구)

  • 민경익;이석운;주승기
    • Journal of the Korean Institute of Telematics and Electronics A
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    • v.28A no.10
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    • pp.840-846
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    • 1991
  • In case of the rapid thermal process by halogen lamps, an optical pyrometer is generally used to measure the temperature. It is, however, necessary to measure the temperature by the thermocouple when the process temperature is lower than 700$^{\circ}C$ and the correction of the temperature is required. Contact by the PdAg paste is commonly used out but in this case it is impossible to see the effect of surface states of the substrate, which is critical in the rapid thermal process. In this study, real temperature ramping speed of silicon substrates coveredwith various thin films such as SiO$_2$2, Si$_{3}N_{4}$, dopants, and conductive layers (Ti or Co) was investigated by a mechanical contact of the thermocouple. And the results were compared with the case in which the contact was made by the PdAg paste. Effect of process ambient was also studied. It was found that depending on the surface state, overshoot more than 100$^{\circ}C$ could occur. It was also found that in case of the substrate covered with conductive layers, mechanical contact might render the correct temperature.

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The Leakage Current Properties of BST thin films with Unsymmetrical Electrode Materials (BST 박막의 비대칭전극재료에 따른 누설전류특성)

  • 전장배;김덕규;박영순;박춘배
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1999.05a
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    • pp.329-332
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    • 1999
  • In this paper, BST((Bao.&o,dTi0:3) thin films were deposited by the rf magnetron sputtering method on Pt/$SiO_2$/Si substrate. Pt, $RuO_2$, Ag, Cu films for the formation of top electrode were deposited on BST thm films. And then Top Electrodes/BST/Pt capacitors were annealed with rapid thermal annealing(RTA) at various temperature. We have investigated effect of post-annealing on the electrical properties such as dielectric constant and leakage current of the capacitors. It was found that electrical properties of the capacitors were greatly depended on the annealing temperatures as well as the materials of top electrodes. In BST thin films with Pt top electrode was annealed at $700^{\circ}C$. the dielectric constant was measured to the value of 346 at l[kHzl and the leakage current was obtained to the value of $8.76\times10^8$[A/$\textrm{cm}^2$] at the forward bias of 2[V].

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Production and Operating Characteristics for Inorganic EL Phosphor (무기EL용 형광체 제작 및 구동특성)

  • Chansri, Pakpoom;Lee, Don-Kyu;Gwak, Dong-Joo;Sung, Youl-Moon
    • Proceedings of the KIEE Conference
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    • 2015.07a
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    • pp.1132-1133
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    • 2015
  • In this paper, we are presents production and operation characteristics for inorganic EL phosphors device using screen printed. The EL device is composed as ITO PET / EL phosphors dielectric $(2{\times}2cm^2)/TiO^2$ paste/Ag electrode. At 100Vac 400Hz, the luminescence of inorganic EL phosphors were $60.33cd/m^2$ of red phosphor, $42.12cd/m^2$ of green phosphor and $58.45cd/m^2$ of blue phosphor. The output current was 12.57 mA, 17.11 mA and 11.98 mA, respectively. The inorganic EL phosphors of EL device are increasing efficiency EL device.

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