• Korean Journal of Mineralogy and Petrology
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• v.36 no.3
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• pp.185-197
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• 2023

The Gubong Au-Ag deposit consists of eight lens-shaped quartz veins. These veins have filled fractures along fault zones within Precambrian metasedimentary rock. This has been one of the largest deposits in Korea, and is geologically a mix of orogenic-type and intrusion-related types. Korea Mining Promotion Corporation drilled into a quartz vein (referred to as the No. 6 vein) with a width of 0.9 m and a grade of 27.9 g/t Au at a depth of -728 ML by drilling (No. 90-12) in the southern site of the deposit, To further investigate the potential redevelopment of the No. 6 vein, another drilling (No. 04-1) was carried out in 2004. In 2004, samples (wallrock, wallrock alteration and quartz vein) were collected from the No. 04-1 drilling core site to study the occurrence and chemical composition of Ti-bearing minerals (ilmenite, rutile). Rutile from mineralized zone at a depth of -275 ML occur minerals including K-feldspar, biotite, quartz, calcite, chlorite, pyrite in wallrock alteration zone. Ilmenite and rutile from ore vein (No. 6 vein) at a depth of -779 ML occur minerals including white mica, chlorite, apatite, zircon, quartz, calcite, pyrrhotite, pyrite in wallrock alteration zone and quartz vein. Based on mineral assemblage, rutile was formed by hydrothermal alteration (chloritization) of Ti-rich biotite in the wallrock. Chemical composition of ilmenite has maximum values of 0.09 wt.% (HfO₂), 0.39 wt.% (V₂O₃) and 0.54 wt.% (BaO). Comparing the chemical composition of rutile at a depth -275 ML and -779 ML, Rutile at a depth of -779 ML is higher contents (WO₃, FeO and BaO) than rutile at a depth of -275 ML. The substitutions of rutile at a depth of -275 ML and -779 ML are as followed : rutile at a depth of -275 ML Ba²⁺ + Al³⁺ + Hf⁴⁺ + (Nb⁵⁺, Ta⁵⁺) ↔ 3Ti⁴⁺ + Fe²⁺, 2V⁴⁺ + (W⁵⁺, Ta⁵⁺, Nb⁵⁺) ↔ 2Ti⁴⁺ + Al³⁺ + (Fe²⁺, Ba²⁺), Al³⁺ + V⁴⁺+ (Nb⁵⁺, Ta⁵⁺) ↔ 2Ti⁴⁺ + 2Fe²⁺, rutile at a depth of -779 ML 2 (Fe²⁺, Ba²⁺) + Al³⁺ + (W⁵⁺, Nb⁵⁺, Ta⁵⁺) ↔ 2Ti⁴⁺ + (V⁴⁺, Hf⁴⁺), Fe²⁺ + Al³⁺ + Hf ⁴⁺ + (W⁵⁺, Nb⁵⁺, Ta⁵⁺) ↔ 2Ti⁴⁺ + V⁴⁺ + Ba²⁺, respectively. Based on these data and chemical composition of rutiles from orogenic-type deposits, rutiles from Gubong deposit was formed in a relatively oxidizing environment than the rutile from orogenictype deposits (Unsan deposit, Kori Kollo deposit, Big Bell deposit, Meguma gold-bearing quartz vein).

• The Korean Journal of Ceramics
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• v.6 no.3
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• pp.219-223
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• 2000

The ferroelectric SBT films were deposited on Pt/Ti/SiO$_2$/Si substrates by liquid injection metalorganic chemical vapor deposition (MOCVD) with single-mixture solution of Sr[Ta(OEt)$_5$(dmae)]$_2$and Bi(C$_6$ 6/H$_5$)$_3$. The Sr/Ta and Bi/Ta ratio in SBT films depended on deposition temperature and mol ratio of precursor in the single-mixture solution. At the substrate temperature of 40$0^{\circ}C$, Sr/Ta and Bi/Ta ratio were close to 0.4 and 1 at precursor mol ratio of 0.5~1.0, respectively. As-deposited film was amorphous. However, after annealing at 75$0^{\circ}C$ for 30 min in oxygen atmosphere, the diffraction patterns indicated polycrystalline SBT phase. The remanent polarization (Pr) and coercive field (Ec) of SBT film annealed at 75$0^{\circ}C$ were 4.7$\mu$C/$\textrm{cm}^2$ and 115.7kV/cm at an applied voltage of 5V, respectively. The SBT films annealed at 75$0^{\circ}C$ showed practically no polarization fatigue up to 10$^10$ switching cycles.

• Journal of the Korean Ceramic Society
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• v.39 no.4
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• pp.377-385
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• 2002

The possibility of $ZrO_2$ thin film as insulator for Metal-Ferroelectric-Insulator-Semiconductor(MFIS) structure was investgated. $SrBi_2Ta_2O_9$ and $SrBi_2Ta_2O_9$(SBT) thin films were deposited on P-type Si(111) wafer by R. F. magnetron sputtering method. The electrical properties of MFIS gate were relatively improved by inserting the $ZrO_2$ buffer layer. The window memory increased from 0.5 to 2.2V in the applied gate voltage range of 3-9V when the thickness of SBT film increased from 160 to 220nm with 20nm thick $ZrO_2$. The maximum value of window memory is 2.2V in Pt/SBT(160nm)/$ZrO_2$(20nm)/Si structure with the optimum thickness of $ZrO_2$. These memory windows are sufficient for practical application of NDRO-FRAM operating at low voltage.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.50 no.3
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• pp.110-114
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• 2001

$0.7Ba(Mg{\frac}_{1}{3}Ta{\frac}_{1}{3})O_3-0.3Ba({\frac}_{1}{3}Nb{\frac}_{1}{3})O_3ceramics$ were prepared by the conventional mixed oxide method. The ceramics were sintered at the temperature of $1500{\sim}1575[^{\circ}C]$ for 5 hours in air. The microwave dielectric properties of the specimens were investigated with sintering temperature. The 0.7BMT-0.3BCN ceramics showed typical XRD patterns of the complex perovskite structure. Dielectric constant and quality factor were increased with increasing the sintering temperature. In the case of the specimens sintered at $1575[^{\circ}C]$ for 5 hours, dielectric constant, quality factor and temperature coefficient of resonant frequency were good values of 28,23545 at 10[㎓] and -1.2 $[ppm/^{\circ}C]$, respectively.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.168.1-168.1
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• 2014

We developed poly (3,4-ethylene dioxylene thiophene):poly (styrene sulfonic acid) (PEDOT:PSS)-free organic solar cells (OSCs) using buffer and anode combined Ta doped $In_2O_3$ (ITaO) electrodes. To optimize the ITaO electrodes, we investigated the effect of $Ta_2O_5$ doping power on the electrical, optical, and structural properties of the co-sputtered ITaO films. The optimized ITaO film doped with 20 W $Ta_2O_5$ radio frequency power showed sheet resistance of 17.11 Ohm/square, a transmittance of 93.45%, and a work function of 4.9 eV, all of which are comparable to the value of conventional ITO electrodes. The conventional bulk heterojunction OSC with ITaO anode showed a power conversion efficiency (PCE) of 3.348% similar to the OSCs (3.541%) with an ITO anode. In addition, OSCs fabricated on an ITaO electrode successfully operated without an acidic PEDOT:PSS buffer layer and showed a PCE of 2.634%, which was much higher than the comparable no buffer OSC with an ITO anode. Therefore, co-sputtered ITaO electrodes simultaneously acting as a buffer and an anode layer can be considered promising transparent electrodes for cost-efficient and reliable OSCs because they can eliminate the use of an acidic PEDOT:PSS buffer layer.

• Nuclear Engineering and Technology
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• v.45 no.5
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• pp.683-688
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• 2013

Candidate coating materials for re-usable metallic nuclear fuel crucibles, TaC, TiC, ZrC, $ZrO_2$, and $Y_2O_3$, were plasmasprayed onto a niobium substrate. The microstructure of the plasma-sprayed coatings and thermal cycling behavior were characterized, and U-Zr melt interaction studies were carried out. The TaC and $Y_2O_3$ coating layers had a uniform thickness, and high density with only a few small closed pores showing good consolidation, while the ZrC, TiC, and $ZrO_2$ coatings were not well consolidated with a considerable amount of porosity. Thermal cycling tests showed that the adhesion of the TiC, ZrC, and $ZrO_2$ coating layers with niobium was relatively weak compared to the TaC and $Y_2O_3$ coatings. The TaC and $Y_2O_3$ coatings had better cycling characteristics with no interconnected cracks. In the interaction studies, ZrC and $ZrO_2$ coated rods showed significant degradations after exposure to U-10 wt.% Zr melt at $1600^{\circ}C$ for 15 min., but TaC, TiC, and $Y_2O_3$ coatings showed good compatibility with U-Zr melt.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.119-119
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• 2015

Ion beam sputtering has been widely used in Secondary Ion Mass Spectrometry (SIMS), X-ray Photoelectron Spectroscopy (XPS), and Auger Electron Spectroscopy (AES) for depth profile or surface cleaning. However, mainly due to severe matrix effects such as surface composition change from its original composition and damage of the surface generated by ion beam bombardment, conventional sputtering skills using mono-atomic primary ions with energy ranging from a few hundred to a thousand volts are not sufficient for the practical surface analysis of next-generation organic/inorganic device materials characterization. Therefore, minimization of the surface matrix effects caused by the ion beam sputtering is one of the key factors in surface analysis. In this work, the electronic structure of a $Ta_2O_5$ thin film on $SiO_2/Si$ (100) after Ar Gas Cluster Ion Beam (GCIB) sputtering was investigated using X-ray photoemission spectroscopy and compared with those obtained via mono-atomic Ar ion beam sputtering. The Ar ion sputtering had a great deal of influence on the electronic structure of the oxide thin film. Ar GCIB sputtering without sample rotation also affected the electronic structure of the oxide thin film. However, Ar GCIB sputtering during sample rotation did not exhibit any significant transition of the electronic structure of the $Ta_2O_5$ thin films. Our results showed that Ar GCIB can be useful for potential applications of oxide materials with sample rotation.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.04b
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• pp.38-41
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• 2004

The oxidizer plays an important role in the metal chemical mechanical polishing(CMP) slurry. Currently, the oxidizer used in CMP slurry is nearly divided into several kinds such as $Fe(NO_3)_3$, $H_2O_2$, $KIO_3$, and $H_5IO_6$. It is generally known that oxidizer character of $H_2O_2$ is more effective than other oxidizers. In this work, we have been studied the characteristics for the $H_2O_2$ concentration of copper slurry, which can applicable in the recent semiconductor manufacturing process. Also, it plays an important role in the planarization of copper films using copper slurries during micro-electronic device fabrication. In this work, we confirmed that removal rate of Cu/TaN changed by $H_2O_2$ concentration on copper slurry. And we used $KMnO_4$ in the measurement method of $H_2O_2$. In analysis results, we confirmed that the difference of results is large. We thought that the difference was due to organic component existence. So in titration method of $H_2O_2$ concentration, we used $Na_2S_2O_3$ instead of $KMnO_4$ as solution. Consequently, using the titration method, we could calculate correct data reduced error. And $H_2O_2$ concentration has been adjusted to the target concentration of 0.1 wt%.

• Journal of the Korean Ceramic Society
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• v.41 no.5
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• pp.401-405
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• 2004

Undoped SrB $i_2$T $a_2$O$_{9}$, donor-doped Sr$_{0.99}$B $i_2$(Ta$_{0.99}$W$_{0.01}$)$_2$O$_{9}$ and acceptor-doped SrB $i_2$(Ta$_{0.99}$Ti$_{0.01}$)$_2$O$_{8.99$ ceramics were prepared and their microstructure, ferroelectric P-E hysteresis and Curie temperature were investigated. Grain size did not influence P-E hysteresis curve in undoped SrB $i_2$T $a_2$O$_{9}$ ceramics. Donor-Doped Sr$_{0.99}$B $i_2$(Ta$_{0.99}$W$_{0.01}$)$_2$O$_{9}$ ceramics showed more saturated P-E hysteresis curve with larger remanent polarization (P$_{r}$) than undoped SrB $i_2$T $a_2$O$_{9}$ ceramics while acceptor-doped SrB $i_2$(Ta$_{0.99}$Ti$_{0.01}$)$_2$O$_{8.99}$ ceramics led to a pinched P-E hysteresis loop. Larger polarization in donor-doped Sr$_{0.99}$B $i_2$(Ta$_{0.99}$W$_{0.01}$)$_2$O$_{9}$ ceramics resulted from easier domain wall motion by Sr-vacancies.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.186-186
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• 1999

시뮬레이션 모델 및 AES, SIMS에 의한 깊이방향 분석의 유용성을 확인하기 위해 이체 충돌모델에 기초한 몬테칼로 시뮬레이션을 수행하였다. 이를 위해, 현 시뮬레이션에서는 충돌 캐스캐이드에 의한 interstitial 및 vacancy 원자의 발생과 각 원자 층이 일정한 원자농도를 유지하도록 interstitial에 의한 vacancy의 소멸을 고려하였다. 이 모델은 AES 깊이 방향 분석에서는 AsAs/GaAs 초격자에, SIMS 깊이 방향 분석에는 Ta2O5/SiO2 초격자에 적용되었고, 실험으로부터 얻어진 결과들을 잘 나타냈다. 0.5keV Ar+ 이온 스퍼터링에 의한 AES 깊이방향 분석의 경우 AlAs 층에서 Al의 선택 스퍼터링에 의해 AlAs 층에서 As(MVV-32eV)의 Auger 강도는 GaAs 층에서보다 약 1.2배 크게 나타났다. 이 시뮬레이션은 Ta2O5(18nm)/SiO2(0.5nm)에 대한 SIMS 깊이방향 분석에서 표면 쪽으로의 1-3nm 정도의 피크(SiO+) 이동 및 decay length도 또한 잘 설명할 수 있었다. 이때, 낮은 에너지에서 보다 더 깊은 이온빔 믹싱이 발생하기 때문에 높은 에너지에서 오히려 더 좋은 분해능을 얻을 수 있었다.