• 제목/요약/키워드: ${\varepsilon}-Ag_3Sn$

검색결과 5건 처리시간 0.023초

Sn-Ag-Cu 무연합금의 미세구조 분석 (Microstructure of Sn-Ag-Cu Pb-free solder)

  • 이정일;이호준;윤요한;이주연;조현수;조현;류정호
    • 한국결정성장학회지
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    • 제27권2호
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    • pp.94-98
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    • 2017
  • 최근 수년 동안 Sn-3.0Ag-0.5Cu(weight%) 조성의 합금은 주요 전자 제조업체들의 대표 무연솔더 조성으로 다양한 전자제품의 제작에 적용되어 왔다. 그러나 최근 Ag 가격의 급격한 상승과 전자산업의 저가격화 전략으로 인해 솔더 재료에서의 Ag 함량의 감소가 지속적으로 요구되고 있다. 본 연구에서는 Sn-3.0Ag-0.5Cu 조성의 무연솔더를 주석, 은 및 구리 금속분말의 용융을 이용하여 합금화 하였다. 제조한 Sn-3.0Ag-0.5Cu 샘플에 대한 결정구조 및 미세구조를 XRD, 광학현미경, FE-SEM 및 EDS 분석을 이용하여 검토하였다. 분석결과, 제조된 Sn-3.0Ag-0.5Cu 샘플은 ${\beta}-Sn$, ${\varepsilon}-Ag_3Sn$${\eta}-Cu_6Sn_5$ 결정으로 구성되어 있었다.

등온시효에 따른 Sn-3.5Ag 솔더 접합부의 금속간 화합물 성장에 관한 연구 (Growth Kinetics of Intermetallic Compound on Sn-3.5Ag/Cu, Ni Pad Solder Joint with Isothermal Aging)

  • 이인영;이창배;정승부;서창제
    • Journal of Welding and Joining
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    • 제20권1호
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    • pp.97-102
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    • 2002
  • The growth kinetics of intermetallic compound layers formed between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad by solid stateisothermal aging were examined. The interfacial reaction between the eutectic Sn-3.5Ag solder and the Cu and Ni/Cu pad was investigated at 70, 120, 150, $170^{\circ}C$ for various times. The intermetallic compound layer was composed of two phase: $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the solder and $Cu_6Sn_5$(${\varepsilon}-phase$) adjacent to the copper and on solder/Ni pad the intermetallic compound layer was $Ni_3Sn_4$. Because the values of time exponent(n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energy for layer growth of total Cu-Sn($Cu_6Sn_5 + Cu_6Sn$), $Cu_6Sn_5$, $Cu_3Sn$ and $Ni_3Sn_4$ intermetallic compound were 64.82kJ/mol, 48.53kJ/mol, 89.06kJ/mol and 71.08kJ/mol, respectively.

Sn-3.0Ag-0.5Cu, Sn-0.7Cu 및 Sn-0.3Ag-0.5Cu 합금의 제조 및 특성평가 (Fabrication and characterization of Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-0.3Ag-0.5Cu alloys)

  • 이정일;팽종민;조현수;양수민;류정호
    • 한국결정성장학회지
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    • 제28권3호
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    • pp.130-134
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    • 2018
  • 솔더(solder) 재료는 수 천년 이상 인류 문명과 함께해온 대표적인 금속 합금으로서 현재까지도 전자 패키징(electronic packaging) 및 표면 실장(SMT, surface mount technology) 분야의 핵심 소재로 사용되고 있다 그러나 최근 Ag 가격의 급격한 상승과 전자산업의 저가격화 전략으로 인해 솔더 재료에서의 Ag 함량의 감소가 지속적으로 요구되고 있다. 본 연구에서는 Sn-3.0Ag-0.5Cu, Sn-0.7Cu 및 Sn-0.3Ag-0.5Cu(weight%) 조성의 무연납 솔더바 샘플을 주조법으로 합금화 하였다. 제조한 Sn-3.0Ag-0.5Cu, Sn-0.7Cu 및 Sn-0.3Ag-0.5Cu 샘플에 대한 결정구조, 화학조성 및 미세구조를 XRD, XRF, 광학현미경, FE-SEM 및 EDS 분석을 이용하여 조사하였다. 분석결과, 제조된 샘플은 ${\beta}-Sn$, ${\varepsilon}-Ag_3Sn$${\eta}-Cu_6Sn_5$ 결정으로 구성되어 있었을 확인할 수 있었다.

BaSn(BO3)2세라믹스의 저온소결 및 유전특성 (Low-Temperature Sintering and Dielectric Properties of BaSn(BO3)2 Ceramics)

  • 남명화;김효태;황준철;남중희;여동훈;김종희;남산
    • 한국세라믹학회지
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    • 제43권2호
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    • pp.92-97
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    • 2006
  • Dolomite type $BaSn(BO_3)_2$ ceramics with rhombohedral crystal structure has been synthesized via solid state reaction route. Dielectric properties were measured for the samples sintered at $1050\~1200^{\circ}C$ for 2 h in air. Dielectric constant, loss tangent, and temperature coefficient were increased with sintering temperature due to the evolution of $BaSnO_3$, secondary, phase. Optimum dielectric properties were obtained at the $BaSn(BO_3)_2$ ceramics sintered at $1100^{\circ}C.\;CuO/Bi_2O_3$ was added to $BaSn(BO_3)_2$ ceramics to lower the sintering temperature for LTCC application, then Co and Fe-based coloring agents were added for colorizing the LTCC tape. Typical dielectric properties of $BaSn(BO_3)_2$ ceramics with $5 wt\%\;CuO/Bi_2O_3\;and\;3wt\%$ Co-coloring agent that sintered at $900^{\circ}C$ were $\varepsilon_r=9.89,\;tan{\delta}=0.92\times10^{-3},\;and\;TCC=112ppm/^{\circ}C$. Thus obtained LTCC tape was co-fired with Ag paste for compatibility test and revealed no sign of Ag reaction with the ceramics.

치과용 아말감합금 및 아말감의 마세구조에 관한 연구 (A STUDY ON THE MICROSTRUCTURES OF THE AMALGAM ALLOYS AND AMALGAMS)

  • 연상흠;이정식;이명종;엄정문
    • Restorative Dentistry and Endodontics
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    • 제21권1호
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    • pp.87-105
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    • 1996
  • The purpose of this study is to investigate the characteristics of the compositions and phases of amalgam alloys and amalgams by using EMPA and X-ray diffractometer. Each specimen was made from Caulk Fine Cut Clow copper lathe cut amalgam), Caulk Spherical (low copper spherical amalgam), Tytin (high copper unicorn position amalgam), Dispersally (high copper admixed amalgam) and Valiant (Palladium enriched amalgam). For preparing amalgam alloys, Tytin and Valiant were used as powder forms and the others were used as tablet forms after being polished with polishing machine. For preparing amalgams, each amalgam alloy and Hg were measured, and triturated by mechanical amalgamater according to user's instructions. After triturating, the triturated mass was inserted to cylindrical metal mold and simultaneously adapted by cylindrical condenser with same diameter and condensed by Instron universal testing machine with 80kg pressure & 1mm/min speed. Each specimen was removed from the metal mold and stored at room temperature for a week. The specimen was polished with the same polishing machine for amalgam alloy. For observation of microstructure and analysis of composition of amalgam alloys and amalgams, EMPA was used to get secondary electron images, backscattered images and characteristic X-ray images of Ag, Sn, Cu, Zn, Hg. To analyze compositions of amalgam alloys and amalgams, X-ray diffractometer was used. Amalgam alloys were scanned at the range of 2${\theta}$ of 30-$85^{\circ}$ and the speed of $4^{\circ}$/min with Cuka line and amalgams were scanned at the range of 2${\theta}$ of 28-$44^{\circ}$ and the speed of $4^{\circ}$/min with Cuka line. By comparing obtained d(distance between surfaces) and d of expected phases and atoms in amalgam alloys and amalgams in ASTM card, phases and atoms were identified. The results were as follows, 1. In Caulk Fine Cut amalgam alloy typical ${\gamma}$ phase was shown, and in amalgam, ${\gamma}$, ${\gamma}_1$ and ${\gamma}_2$ phases were observed. 2. In Caulk Spherical amalgam alloy ${\gamma}$, Ag, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, ${\gamma}_2$ and $\eta$ phases were observed. 3. In Tytin amalgam alloy ${\gamma}$, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed. 4. In Dispersalloy ${\gamma}$, Ag, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed. 5. In Valiant alloy ${\gamma}$, Cu and e phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed.

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