• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 추계학술대회 논문집
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• pp.524-527
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• 2000

In this paper, we have studied minimization of the burr which occurred after $\mu$-BGA(ball grid array) singulation process, singulation of the multilayer with a pulsed Nd:YAG(266, 532 nm) laser is used to cut the metal layer which doesn't well absorb laser beam. Especially, the photoresist and $N_2$blowing is effective to minimize of the surface demage and burr. In this experiment, the $N_2$ blowing reduces a laser energy loss by debris and suppress a surface oxidation. The SEM(scanning electron microscopes) and non-contact 3D inspector are used to measure cutting line-width and surface demage. The $\mu$-BGA singulation threshold energy is 75.0 J/cm$^2$at 30 ${\mu}{\textrm}{m}$/s scan speed.

• 마이크로전자및패키징학회지
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• 제8권3호
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• pp.1-9
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• 2001

본 논문에서는 마이크로 납볼 격자 배열 ($\mu$BGA)패키지의 검사 알고리듬을 제안하였다. 이 알고리듬의 개발은 납볼 배열의 미세 크기 때문에 사람의 사각으로는 결함을 식별하기 어려운 점에 기인하였다. 특히, 여기에서 보인 자동 시각 $\mu$BGA 검사 알고리듬은 소위 말하는 이차원 오차뿐만 아니라 볼의 높이 오차까지 검사할 수 있다. 검사 알고리듬은 특수하게 제작된 청색 조명 하에서 이차원 $\mu$BGA 영상을 사용하고 회전 불변 알고리듬으로 영상을 처리하였다. 그리고 2개의 카메라를 사용하여 높이 오차를 검출할 수 있었다 모의실험결과, 제안한 알고리듬이 기존 방법에 비하여 괄목할 만큼 납볼 결함을 검출할 수 있음을 보였다.

• Journal of Welding and Joining
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• 제19권4호
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• pp.406-412
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• 2001

This study is focussed on the numerical prediction of the thermal fatigue life of a ${\mu}BGA$(Micro Ball Grid Array) solder joint. Numerical method is used to perform three-dimensional finite element analysis for Sn-37mass%Pb. Sn-3.5mass%Ag solder alloys during the given thermal cycling. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. In this study, a practical correlation for the prediction of the thermal fatigue life is suggested by using the dimensionless variable $\gamma$. As a result. it could be found that Sn-3.5mass%Ag has longer fatigue life than Sn-37mass%Pb in low cycle fatigue. In addition. the result with ${\gamm}ashow$a good agreement with the FEA results.

• Journal of Welding and Joining
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• 제21권3호
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• pp.92-98
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• 2003

This paper describes the numerical prediction of the thermal fatigue life of a $\mu$BGA(Micro Ball Grid Array) solder joint. Finite element analysis(FEA) was employed to simulate thermal cycling loading for solder joint reliability. Strain values, along with the result of mechanical fatigue tests for solder alloys were then used to predict the solder joint fatigue life using the Coffin-Manson equation. The results show that Sn-3.5mass%Ag solder had the longest thermal fatigue life in low cycle fatigue. Also a practical correlation for the prediction of the thermal fatigue life was suggested by using the dimensionless variable ${\gamma}$, which was possible to use several lead free solder alloys for prediction of thermal fatigue life. Furthermore, when the contact angle of the ball and chip has 50 degrees, solder joint has longest fatigue life.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 하계종합학술대회 논문집(4)
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• pp.139-142
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• 2000

$\mu$BGA(Ball Grid Array) is growing in response to a great demand for smaller and lighter packages for the use in laptop, mobile phones and other evolving products. However it is not easy to find its defect by human visual due to in very small dimension. From this point of view, we are interested its development of a vision based automated inspection algorithm. For this, first a 2D view of $\mu$BGA is described under a special blue illumination. Second, a notation-invariant 2D inspection algorithm is developed. Finally a 3D inspection algorithm is proposed for the case of stereo vision system. As a simulation result, it is shown that 3D defect not easy to find by 2D algorithm can be detected by the proposed inspection algorithm.

• Journal of Welding and Joining
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• 제21권4호
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• pp.25-30
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• 2003

There have been many researches for small scale packages such as CSP, BGA, and Flipchip. Underfill encapsulant technology is one of the latest assembly technologies. The underfill encapsulant could enhance the reliability of the packages by flowing into the gap between die and substrate. In this paper, the effects of underfill packages by both aspects of thermal and mechanical reliabilities are studied. Especially, it is focused to value board-level reliability whether by the underfill is applied or not. First of all, The predicted thermal fatigue lifes of underfilled and no underfilled $\mu$ BGA solder joints are performed by Coffin-Manson's equation and FEA program, ANSYS(version 5.62). Also, the thermal fatigue lifes of $\mu$ BGA solder joints are experimented by thermal cycle test during the temperature, 218K to 423k. Consequently, both experimental and numerical study show that $\mu$ BGA with underfill has over ten times better fatigue lift than $\mu$ BGA without underfill.

• Journal of Mechanical Science and Technology
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• 제16권7호
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• pp.919-926
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• 2002

In this study, the numerical prediction of the thermal fatigue lie? of a $\mu$BGA (Micro Ball Grid Array) solder joint was focused. Numerical method was performed using the three-dimensional finite element analysis for various solder alloys such as Sn-37%Pb, Sn-3.5%Ag, Sn-3.5%Ag-0.7%Cu and Sn-3.5%Ag-3%In-0.5%Bi during a given thermal cycling. Strain values obtained by the result of mechanical fatigue tests for solder alloys, were used to predict the solder joint fatigue life using the Coffin-Manson equation. The numerical results showed that Sn-3.5%Ag with the 50-degree ball shape geometry had the longest thermal fatigue life in low cycle fatigue. A practical correlation for the prediction of the thermal fatigue life was also suggested by using the dimensionless variable γ. Additionally Sn-3.5Ag-0.75Cu and Sn-2.0Ag-0.5Cu-2.0Bi were applied to 6$\times$8$\mu$BGA obtained from the 63Sn-37Pb Solder. This 6$\times$8$\mu$BGA were tested at different aging conditions at 130$\^{C}$, 150$\^{C}$, 170$\^{C}$ for 300, 600 and 900 hours. Thickness of the intermetallic compound layer was measured thor each condition and the activation energy thor their growth was computed. The fracture surfaces were analyzed using SEM (Scanning Electron Microscope) with EDS ( Energy Dispersive Spectroscopy).

• 조명전기설비학회논문지
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• 제19권7호
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• pp.53-59
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• 2005

본 논문에서는 비젼 시스템을 사용하여 마이크로 BGA 소자의 2차원 결함을 검사하는 알고리즘을 제안하였다. 제안한 방법은 정밀도를 높이기 위해 부화소 알고리즘을 사용하였으며, 입력된 영상에서 패키지 영역을 추출하고, 추출된 영역에서 볼 탐색창 방법을 사용하여 볼 영역을 추출한다. 이렇게 추출된 볼 영역에 대해 결함검사에 필요한 파라미터들을 추출하고, 이들을 사용하여 소자의 불량 유무를 판정한다. 모의실험을 통해 볼 검사 정밀도의 평균 오차가 17[${\mu}m$]가 됨을 확인하였다.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2005년도 춘계학술대회논문집
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• pp.437-442
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• 2005

In this paper, we proposed the 2-dimensional inspection algorithm for micro-BGA(Ball Grid Array) device using a vision system. The proposed method uses the subpixel algorithm for high precision. The proposed algorithm preferentially extracts the package area of device in the input image. After the extraction of package area, each ball areas are extracted by ball search window method. The parameters for inspection are calculated for the extracted ball area. In the simulation results, we have the average error within $17{\mu}m$.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.138-141
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• 2002

There are continuous efforts in the electronics industry to a reduced electronic package size. Reducing the size of electronic packages can be achieved by a variety of means, and for ball grid array(BGA) packages an effective method is to decrease the pitch between the individual balls. Chip scale package(CSP) and BGA are now one of the major package types. However, a reduced package size has the negative effect of reducing board-level reliability. The reliability concern is for the different thermal expansion rates of the two-substrate materials and how that coefficient CTE mismatch creates added stress to the BGA solder joint when thermal cycled. The point of thermal fatigue in a solder joint is an important factor of BGA packages and knowing at how many thermal cycles can be ran before failure in the solder BGA joint is a must for designing a reliable BGA package. Reliability of the package was one of main issues and underfill was required to improve board-level reliability. By filling between die and substrate, the underfill could enhance the reliability of the device. The effect of underfill on various thermomechanical reliability issues in $\mu$BGA packages is studied in this paper.