Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference (한국조명전기설비학회:학술대회논문집)
- 2005.05a
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- Pages.437-442
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- 2005
The Development of 2-Dimensional Inspection Algorithm using Camera for BGA device
카메라를 이용한 BGA 소자의 2차원 결함검출 알고리즘 개발
- Published : 2005.05.13
Abstract
In this paper, we proposed the 2-dimensional inspection algorithm for micro-BGA(Ball Grid Array) device using a vision system. The proposed method uses the subpixel algorithm for high precision. The proposed algorithm preferentially extracts the package area of device in the input image. After the extraction of package area, each ball areas are extracted by ball search window method. The parameters for inspection are calculated for the extracted ball area. In the simulation results, we have the average error within
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