• Title/Summary/Keyword: $\Omega$ Type

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Electrical, Electronic Structure and Optical Properties of Undoped and Na-doped NiO Thin Films

  • Denny, Yus Rama;Lee, Kangil;Seo, Soonjoo;Oh, Suhk Kun;Kang, Hee Jae;Yang, Dong-Seok
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.193.1-193.1
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    • 2014
  • This study was to investigate the electronic structure and optical properties of Na doped into NiO thin film using XPS and REELS. The films were grown by electron beam evaporation with varying the annealing temperature. The relationship between the electrical characteristics with the local structure of NiO thin films was also discussed. The x-ray photoelectron results showed that the Ni 2p spectra for all films consist of Ni 2p3/2 which indicate the presence of Ni-O bond from NiO phase and for the annealed film at temperature above $200^{\circ}C$ shows the coexist Ni oxide and Ni metal phase. The reflection electron energy loss spectroscopy spectra showed that the band gaps of the NiO thin films were slightly decreased with Na-doped into films. The Na-doped NiO showed relatively low resistivity compared to the undoped NiO thin films. In addition, the Na-doped NiO thin films deposited at room temperature showed the best properties, such as a p-type semiconducting with low electrical resistivity of $11.57{\Omega}.cm$ and high optical transmittance of ~80% in the visible light region. These results indicate that the Na doping followed by annealing process plays a crucial in enhancing the electrical and optical properties of NiO thin films. We believe that our results can be a good guide for those growing NiO thin films with the purpose of device applications, which require deposited at room temperature.

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Identification and Characterization of Two New S-Adenosylmethionine-Dependent Methyltransferase Encoding Genes Suggested Their Involvement in Stipe Elongation of Flammulina velutipes

  • Huang, Qianhui;Mukhtar, Irum;Zhang, Yelin;Wei, Zhongyang;Han, Xing;Huang, Rongmei;Yan, Junjie;Xie, Baogui
    • Mycobiology
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    • v.47 no.4
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    • pp.441-448
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    • 2019
  • Two new SAM-dependent methyltransferase encoding genes (fvsmt1 and fvsmt2) were identified from the genome of Flammulina velutipes. In order to make a comprehensive characterization of both genes, we performed in silico analysis of both genes and used qRT-PCR to reveal their expression patterns during the development of F. velutipes. There are 4 and 6 exons with total length of 693 and 978 bp in fvsmt2 and fvsmt1, respectively. The deduced proteins, i.e., FVSMT1 and FVSMT2 contained 325 and 230 amino acids with molecular weight 36297 and 24894 Da, respectively. Both proteins contained a SAM-dependent catalytic domain with signature motifs (I, p-I, II, and III) defining the SAM fold. SAM-dependent catalytic domain is located either in the middle or at the N-terminal of FVSMT2 and FVSMT1, respectively. Alignment and phylogenic analysis showed that FVSMT1 is a homolog to a protein-arginine omega-N-methyltransferase, while FVSMT2 is of cinnamoyl CoA O-methyltransferase type and predicted subcellular locations of these proteins are mitochondria and cytoplasm, respectively. qRT-PCR showed that fvsmt1 and fvsmt2 expression was regulated in different developmental stages. The maximum expression levels of fvsmt1 and fvsmt2 were observed in stipe elongation, while no difference was found in mycelium and pileus. These results positively demonstrate that both the methyltransferase encoding genes are involved in the stipe elongation of F. velutipes.

Etching characteristics of Al-Nd alloy thin films using magnetized inductively coupled plasma

  • Lee, Y.J.;Han, H.R.;Yeom, G.Y.
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 1999.10a
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    • pp.56-56
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    • 1999
  • For advanced TFT-LCD manufacturing processes, dry etching of thin-film layers(a-Si, $SiN_x$, SID & gate electrodes, ITO etc.) is increasingly preferred instead of conventional wet etching processes. To dry etch Al gate electrode which is advantageous for reducing propagation delay time of scan signals, high etch rate, slope angle control, and etch uniformity are required. For the Al gate electrode, some metals such as Ti and Nd are added in Al to prevent hillocks during post-annealing processes in addition to gaining low-resistivity($<10u{\Omega}{\cdot}cm$), high performance to heat tolerance and corrosion tolerance of Al thin films. In the case of AI-Nd alloy films, however, low etch rate and poor selectivity over photoresist are remained as a problem. In this study, to enhance the etch rates together with etch uniformity of AI-Nd alloys, magnetized inductively coupled plasma(MICP) have been used instead of conventional ICP and the effects of various magnets and processes conditions have been studied. MICP was consisted of fourteen pairs of permanent magnets arranged along the inside of chamber wall and also a Helmholtz type axial electromagnets was located outside the chamber. Gas combinations of $Cl_2,{\;}BCl_3$, and HBr were used with pressures between 5mTorr and 30mTorr, rf-bias voltages from -50Vto -200V, and inductive powers from 400W to 800W. In the case of $Cl_2/BCl_3$ plasma chemistry, the etch rate of AI-Nd films and etch selectivity over photoresist increased with $BCl_3$ rich etch chemistries for both with and without the magnets. The highest etch rate of $1,000{\AA}/min$, however, could be obtained with the magnets(both the multi-dipole magnets and the electromagnets). Under an optimized electromagnetic strength, etch uniformity of less than 5% also could be obtained under the above conditions.

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Room-Temperature Deposition of ZnO Thin Film by Pulsed Vacuum Arc and Effect of Oxygen Gas Ratio on Its Electrical Properties (펄스형 진공 아크법에 의한 ZnO 박막의 상온합성 및 이의 전기적 특성에 미치는 산소분압비의 영향)

  • Shin Min-Geun;Byon Eungsun;Lee Sunghun;Kim Do-Geun;Jeon Sang-Jo;Koo Bon Heun
    • Journal of the Korean institute of surface engineering
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    • v.38 no.5
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    • pp.193-197
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    • 2005
  • Highly c-axis oriented Zinc oxide (ZnO) films were successfully deposited at room temperature by oxygen ion-assisted pulsed filtered vacuum arc. The effect of oxygen gas ratio ($O_{2}/O_{2}+Ar$ on the preferred orientation, surface morphology and resistivity of the ZnO films were investigated. Highly crystalline ZnO films with (002) orientation were obtained at over $13\%$ of oxygen gas ratio. Increasing oxygen gas ratio up to $80\%$ was found to improve crystallinity of the films. From hall measurements, it was found that the film has n-type characteristic and carrier concentration and its mobility were closely related with oxygen gas ratio. Minimal resistivity of $3.6{\times}10^{-3}{\Omega}{\cdot}cm$ was obtained in the range of $20\%$ to $40\%$ of oxygen gas ratio.

A Study on Adhesion and Electro-optical Properties of ITO Films Deposited on Flexible PET Substrates with Deposition of SiO2 Buffer Layers (PET 기판 위에 SiO2 버퍼층 증착에 따른 ITO 박막의 부착 및 전기적 광학적 특성 연구)

  • Kang, Ja-Youn;Kim, Dong-Won;Cho, Kyu-Il;Woo, Byung-Il;Yun, Hwan-Jun
    • Journal of the Korean institute of surface engineering
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    • v.42 no.1
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    • pp.21-25
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    • 2009
  • Using an evaporation system, $SiO_2$ was deposited as a buffer layer between a PET substrate and a ITO layer and then ITO/$SiO_2$/PET layers were annealed for 1.5 hours at the temperature of $180^{\circ}C$. Adhesion and electro-optical properties of ITO films were studied with thickness variance of a $SiO_2$ buffer layer. As a result of introduction of the $SiO_2$ buffer layer, sheet resistance and resistivity increased and a ITO film with optimum sheet resistance ($529.3{\Omega}/square$) for an upper ITO film of resistive type touch panel could be obtained when $SiO_2$ of $50{\AA}$ was deposited. And it was found that ITO films with $SiO_2$ buffer layer have higher transmittance of $88{\sim}90%$ at 550 nm wavelength than ITO films with no buffer layers and the transmittance was enhanced as $SiO_2$ thickness increased from $50{\AA}$ to $100{\AA}$. Adhesion property of ITO films with $SiO_2$ buffer layers became better than ITO films with no buffer layers and this property was independent of $SiO_2$ thickness variance ($50{\sim}100{\AA}$). By depositing a $SiO_2$ buffer layer of $50{\AA}$ on the PET substrate and sputtering a ITO thin film on the layer, a ITO film with enhanced adhesion, electro-optical properties could be obtained.

A study on optical properties of InP for implementation of fiber-optic temperature sensor (광섬유 온도센서를 위한 InP의 광학적 특성 연구)

  • Kim, Young-Soo;Shin, Keon-Hak;Chon, Byong-Sil
    • Journal of Sensor Science and Technology
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    • v.3 no.3
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    • pp.36-44
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    • 1994
  • A fiber-optic temperature sensor utilizing InP as a sensing medium was implemented and tested to determine the dependance of the optical characteristics of InP on physical parameters for the use as design parameters in this type of sensors. The optical absorption coefficient of InP has been determined through the experimental measurement of the fundamental optical absorption characteristics at various temperature points. The transmission characteristics of light source at three temperature points($249^{\circ}K$, $298^{\circ}K$, $369^{\circ}K$) are computed from the optical absorption coefficient for a fixed length of InP. A series of measurement concluded that optical absorption edge moves to longer wavelength region at a speed of 0.42 nm / $^{\circ}K$ as the specimen gets hotter, and that increasing the thickness of the InP sensing layer shifts power density curve to lower temperature region.

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A study on the characteristics of planar type inductively coupled plasma and its applications on the selective oxide etching (평면형 유도결합 플라즈마의 특성 및 선택적 산화막 식각 응용에 관한 연구)

  • 양일동;이호준;황기웅
    • Journal of the Korean Vacuum Society
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    • v.6 no.1
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    • pp.91-96
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    • 1997
  • The electrical characteristics and the plasma parameters of planar inductively coupled plasmas (ICP) have been measured. The resistance of the total load including the coil and the plasma varied from 1 to 4 W and the inductance from 1.5 m to 2 mH when the power was changed from 100 to 1000 W and the pressure from 1 to 10 mTorr. The density of electron measured by Langmuir probe was over $10^{11}/\textrm{cm}^3$ and the temperature varied between 3 and 5 eV as the process conditions were changed. Bias modulation was adopted as a new method to improve the selectivity of $SiO_2$on Si in $C_4F_8$ (octafluorocyclobutane) plasma. The selectivity was improved as the duty ratio decreased, but the etch rate of $SiO_2$decreased below 400$\AA$/min. $H_2$addition to $C_4F_8$ plasma showed that the etch selectivity could be higher than 50 and the etch rate of $SiO_2$over 2000$\AA$/min when 60% $H_2$was added.

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Au Catalyst Free and Effect of Ga-doped ZnO Seed Layer on Structural Properties of ZnO Nanowire Arrays

  • Yer, In-Hyung;Roh, Ji-Hyoung;Shin, Ju-Hong;Park, Jae-Ho;Jo, Seul-Ki;Park, On-Jeon;Moon, Byung-Moo
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.354-354
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    • 2012
  • In this study, we report the vertically aligned ZnO nanowires by using different type of Ga-doped ZnO (GZO) thin films as seed layers to investigate how the underlying GZO film micro structure affects the distribution of ZnO nanowires. Arrays of highly ordered ZnO nanowires have been synthesized on GZO thin film seed layer prepared on p-Si substrates ($7-13{\Omega}cm$) with utilize of a pulsed laser deposition (PLD). With the vapor-liquid-solid (VLS) growth process, the ZnO nanowire synthesis carries out no metal catalyst and is cost-effective; furthermore, The GZO seed layer facilitates the uniform growth of well-aligned ZnO nanowires. The influence of the growth temperature and various thickness of GZO seed layer have been analyzed. Crystallinity of grown seed layer was studied by X-Ray diffraction (XRD); diameter and morphology of ZnO nanowires on seed layer were investigated by field emission scanning electron microscopy (FE-SEM). Our results suggest that the GZO seed layer with high c-axis orientation, good crystallinity, and less lattice mismatch is key parameters to optimize the growth of well-aligned ZnO nanowire arrays.

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Effect of annealing om p-type Al/SnO2 transparent conductive multilayer films (p-형 Al/SnO2 투명 전도성 다층박막에 미치는 열처리의 영향)

  • Park, Geun-Yeong;Kim, Seong-Jae;Gu, Bon-Heun
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2014.11a
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    • pp.27-28
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    • 2014
  • 투명전극이란 전기 전도도를 갖는 동시에 가시광선 영역에서 빛을 투과하는 성질을 가지는 소재이다. 일반적으로 가시광선 영역(380nm~780nm)에서 80%이상의 광 투과도를 가지며, 비저항이 $10^{-3}{\Omega}{\cdot}cm$ 이하, optical band gap 이 3.3 eV 이상인 물질을 TCO(Transparent Conducting oxide)라고 한다. 현재까지 국내의 TCO 관련 연구는 터치패널, 디스플레이, 태양전지 등 광전자분야에서 가장 널리 사용되고 있는 ITO(Sn:In2O3)에 치중되어 있으며, 관련 연구도 거의 디스플레이 맞춤형 연구개발이 주류를 이루어왔다. ITO가 전기전도성이 우수하고 동시에 가시광선 영역에서의 투과율도 80%이상으로 전기적, 광학적 특성이 우수하다는 장점을 가지고 있으나, In의 희소성으로 인한 고가격, 유독성, 접착력 문제 때문에 이를 대체하기 위해 제조원가가 ITO에 비하여 월등히 저렴하고 내화학성과 내마모성이 우수하면서도, 가시광선 영역에서의 광투과율이 80%이상으로 좋다는 $SnO_2$에 관한 연구가 활발히 진행되어 왔다. 적절한 dopant를 첨가하여 $SnO_2$자체의 높은 광학적 투과도를 유지하면서 전기전도성을 더 높일수 있고, 투명전극이 가져야 할 고온 안정성을 가지고 있으며 비독성이고 수소 플라즈마에 대한 내성이 더 클 뿐만 아니라 저온에서 성장이 가능하다. $SnO_2$의 전기 전도도를 높이기 위한 Al, In, Ga, B와 같은 3족 원소가 $SnO_2$의 n형 dopant로 널리 사용되고 있다. 그 중 Al은 반응성이 커서 박막 증착 중에 산화되기 쉬운 반면, 전기적 특성 및 광학적 특성의 향상을 이룰 수 있다. 본 연구에서는 Rf Sputtering법을 사용하여 quartz기판 위에 다층박막 형태의 투명전도막을 제작한 후, 열처리를 수행, 이에 의한 다층박막 내 계면간 상호확산 현상을 이용하여 투명 전도막의 특성변화를 관찰하였다. 박막의 구조적 특성은 XRD장비를 사용하여 분석하였으며, 전기적, 광학적 특성은 각각 표면저항기, 홀 측정 장비, 그리고 UV-VIS-NI를 사용하여 확인하였다.

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Optimizing Surface Reflectance Properties of Low Cost Multicrystalline EFG Ribbon-silicon (저가 다결정 EFG 리본 웨이퍼의 표면 반사도 특성 최적화)

  • Kim, Byeong-Guk;Lee, Yong-Koo;Chu, Hao;Oh, Byoung-Jin;Park, Jae-Hwan;Lee, Jin-Seok;Jang, Bo-Yun;An, Young-Soo;Lim, Dong-Gun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.2
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    • pp.121-125
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    • 2011
  • Ribbon silicon solar cells have been investigated because they can be produced with a lower material cost. However, it is very difficult to get good texturing with a conventional acid solution. To achieve high efficiency should be minimized for the reflectance properties. In this paper, acid vapor texturing and anti-reflection coating of $SiN_x$ was applied for EFG Ribbon Si Wafer. P-type ribbon silicon wafer had a thickness of 200 ${\mu}m$ and a resistivity of 3 $\Omega-cm$. Ribbon silicon wafers were exposed in an acid vapor. Acid vapor texturing was made by reaction between the silicon and the mixed solution of HF : $HNO_3$. After acid vapor texturing process, nanostructure of less than size of 1 ${\mu}m$ was formed and surface reflectance of 6.44% was achieved. Reflectance was decreased to 2.37% with anti-reflection coating of $SiN_x$.